1. Digital Integrated Circuit Design Andrea Bonfanti DEIB Via Golgi 40, Milano ManufacturingProcess

2. CMOS Process n-well CMOS Process

3. Twin-well CMOS Process Twin-well Trench-Isolated CMOS Process

4. Triple-well CMOS Process

5. Circuit Under Design

6. Its Layout View nwell metal1 n+ diffusion poly p+ diffusion n+ diffusion contact p+ diffusion

7. Its Layout View (2)

8. Its Layout View (2)

9. Its Layout View (2)

10. Photo-Lithographic Process optical mask oxidation photoresist photoresist coating removal (ashing) stepper exposure Typical operations in a single photolithographic cycle (from [Fullman]). photoresist development acid etch process spin, rinse, dry step

11. Patterning of SiO2 Chemical or plasma etch Si-substrate Hardened resist SiO 2 (a) Silicon base material Si-substrate Photoresist SiO 2 (d) After development and etching of resist, chemical or plasma etch of SiO 2 Si-substrate Hardened resist (b) After oxidation and deposition SiO of negative photoresist 2 Si-substrate UV-light Patterned (e) After etching optical mask Exposed resist SiO 2 Si-substrate Si-substrate (f) Final result after removal of resist (c) Stepper exposure

12. Define active areas Etch and fill trenches Implant well regions Deposit and pattern polysilicon layer Implant source and drain regions and substrate contacts Create contact and via windows Deposit and pattern metal layers CMOS Process at a Glance

13. p-epi (a) Base material: p+ substrate with p-epi layer + p Si N 3 4 SiO (b) After deposition of gate-oxide and 2 p-epi sacrificial nitride (acts as a buffer layer) + p (c) After plasma etch of insulating trenches using the inverse of the active area mask p + CMOS Process Walk-Through

14. SiO 2 (d) After trench filling, CMP planarization, and removal of sacrificial nitride n (e) After n-well and V adjust implants Tp p (f) After p-well and V adjust implants Tn CMOS Process Walk-Through

15. poly(silicon) (g) After polysilicon deposition and etch n + + p (h) After n + source/drain and p + source/drain implants. These steps also dope the polysilicon. SiO 2 (i) After deposition of SiO 2 insulator and contact hole etch. CMOS Process Walk-Through

16. Al (j) After deposition and patterning of first Al layer. Al SiO 2 (k) After deposition of SiO 2 insulator, etching of via’s, deposition and patterning of second layer of Al. CMOS Process Walk-Through

17. Metallization

18. Advanced Metallization

19. Design Rules

20. 3D Perspective Polysilicon Aluminum

21. Design Rules • Interface between designer and process engineer • Guidelines for constructing process masks • Unit dimension: minimum line width • scalable design rules: lambda parameter • absolute dimensions (micron rules)

22. Layer Color Representation Well (n) Yellow Active (diffuision n+ or p+) Green Select (n+) Green Polysilicon Red Metal1 Blue Metal2 Magenta Contact To Poly Black Contact To Diffusion (ntap, ptap) Black Via Black Single-well CMOS Process Layers

23. Layers in 0.25 mm CMOS process

24. Intra-Layer Design Rules 4 Metal2 3

25. Transistor Layout (PMOS)

26. Vias and Contacts

27. Select Layer

28. CMOS Inverter Layout

29. Layout Editor

30. Design Rule Checker

31. Design Rule Checker

32. The final result

33. Packaging

34. Packaging Requirements • Electrical: lowparasitics • Mechanical: reliable and robust • Thermal: efficient heat removal • Economical: cheap

35. Bonding Techniques

36. Tape-Automated Bonding (TAB)

37. Flip-Chip Bonding

38. Package-to-Board Interconnect

39. Package Types

40. Package Parameters

41. Multi-Chip Modules