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Pryor-Hale Business Plan Competition April 18, 2001 PowerPoint Presentation
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Pryor-Hale Business Plan Competition April 18, 2001

Pryor-Hale Business Plan Competition April 18, 2001

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Pryor-Hale Business Plan Competition April 18, 2001

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  1. Michael McCorquodale, Chief Executive Officer Keith Kraver, Chief Technical Officer Mobius Integrated Systems Corporation 1001 E. Jefferson Ave. Suite 105 Detroit, MI 48207 mobius-is@umich.edu 313.205.3489 Pryor-Hale Business Plan Competition April 18, 2001

  2. Presentation Agenda • The Mission of Mobius Integrated Systems • Problems with Embedded Systems • The Mobius’ Solution • Management Team • Market • Competition • Funding and Financials • Why Invest in Mobius? Agenda Mission Problems Solution Team Market Comp. Funding Why?

  3. The Mission of Mobius Mobius Integrated Systems Utilizes Microsystems Technology to Deliver True System-On-A-Chip (TSoC) Solutions to the Embedded Systems Market What is an embedded system? The Engine Control Module (ECM) is an example of an embedded system: Inside the engine a sensor detects the fuel-to-air ratio and transmits the signal to the ECM so the fuel injection can be adjusted accordingly Agenda Mission Problems Solution Team Market Comp. Funding Why?

  4. Sensor Antenna Data Conversion Microprocessor Baseband Modem Wireless Interface Sensor/Actuator Interface Actuator Frequency Reference Board Level Implementation Problems with Implementation What’s the problem? • Packaging costs high • Power too high • Size too large • Engineering resources spent designing board • Functionality low • Applications limited Agenda Mission Problems Solution Team Market Comp. Funding Why?

  5. Sensor Antenna Data Conversion Microprocessor Baseband Modem Wireless Interface Sensor/Actuator Interface Actuator Frequency Reference Board Level Implementation True System-on-a-Chip Implementation (TSoC) The Mobius Solution Agenda Mission Problems Solution Team Market Comp. Funding Why?

  6. The MS-8 prototype developed at The University of Michigan The Mobius’ Solution TSoC Implementation • Packaging costs reduced: Fewer Circuits • Power reduced: Less Input/Output • Size Reduced: Fewer Circuits, Fewer Pins • Fewer Engineering Resources: Simpler System • Increased Reliability: Longer Operating Life • Possibilities for increased functionality • Possibilities for new applications Agenda Mission Problems Solution Team Market Comp. Funding Why?

  7. Recognizing MEMS as an enabling technology: Prototype MEMS resonators developed at The University of Michigan Realizing The Mobius’ Solution How is it Done? • Utilizing emerging technology: MEMS • Integrating existing technology: RF + Analog + Digital • New application in existing technology: Si Wireless • Support Emerging Standards: Bluetooth Vision • TSoC solutions require competency in all technologies • Who will integrate these technologies? Si RF, SOI, MEMS, etc. • No Intel of Microsystems Exists Agenda Mission Problems Solution Team Market Comp. Funding Why?

  8. The Mobius Team: Founders • Michael McCorquodale • Chief Executive Officer • Ph.D. Candidate: Wireless Integrated Circuit and MEMS Research • Embedded Circuit Development with Hughes Space and Communications • Keith Kraver • Chief Technical Officer • Ph.D. Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research • Embedded Analog Circuit Development with National Semiconductor • Matt Guthaus • Chief Operations Officer • Ph.D. Candidate: Low-Power Microarchitecture Research • Automotive Microcontroller Development with National Semiconductor Agenda Mission Problems Solution Team Market Comp. Funding Why?

  9. The Mobius Team: Advisory Board • Dr. Richard Brown • Chairman of Advisory Board • Founder, Sensicore Corporation: A Chemical Sensor Company • Associate Chair Electrical Engineering Division, University of Michigan • Joe Giachino • Member, Automotive Microsystems Specialist • Technical Chairman, Michigan Microsystems Consortium • Over 30 Years Experience in Automotive Microsystems, Ford/Visteon • Dr. Dennis Grimmard • Member, Semiconductor Manufacturing Specialist • Manager, Solid-State Electronics Laboratory, University of Michigan Agenda Mission Problems Solution Team Market Comp. Funding Why?

  10. Market Overview System-on-a-Chip (SoC) Market: • Total Available Market: Currently $5 Billion • Projected to be $17 Billion by 2002 (Cahner’s InStat) • Currently SoC 30% of Integrated Circuit (IC) Market • Projected to be 70% of IC Market by 2003 (Semico Research) Automotive ECM Market: • Total Accessible Market: 15 Million Units per Year • Target Market: 100k ECMs in First Automobile Line • Automotive Market is Driving Microsystems and MEMS Industry: 60 Million Units Deployed (ForbesASAP, April 2001) Additional Markets • Scaling in Additional Markets: biomedical, environmental monitoring, industrial, manufacturing, communications, etc. Agenda Mission Problems Solution Team Market Comp. Funding Why?

  11. Mobius vs. Competition Shading indicates level of integration Agenda Mission Problems Solution Team Market Comp. Funding Why?

  12. Funding Sought Capital Sought • $3MM First Round to Initial Product Delivery Expenditures • Development, Management, and Sales Teams • Office Space, Computer Hardware, CAD Tools • Design, Manufacturing, and Testing of Initial Product Agenda Mission Problems Solution Team Market Comp. Funding Why?

  13. Mobius Financials Revenue Projections (in thousands) 2001 2002 2003 2004 2005 SoC Units Sold 0 243 1,562 4,567 14,168 Ave Selling Price $ - $17.94 $18.25 $15.51 $13.19 Net Revenues $ - $4,354 $28,514 $70,849 $186,807 COGS Projections Fabrication: Foundry $ - $ 111 $ 503 $1,268 $ 3,643 Fabrication: MEMS 0 59 266 672 1,929 Wafer Level Test 0 216 986 2,487 7,143 Packaging 0 780 3,553 8,953 25,716 Post-Package Test 0 338 1,539 3,879 11,143 Initial Design Costs 0 374 1,496 3,366 8,789 Total 0 1,879 $8,345 $20,627 $58,365 Gross Margin NA 57% 71% 71% 69% Agenda Mission Problems Solution Team Market Comp. Funding Why?

  14. Mobius Financials (in thousands)2001 2002 2003 2004 2005 Revenues $ - $ 4,354 $ 28,514 $ 70,849 $186,807 Gross Profit - 2,475 20,168 50,222 128,442 Oper. Income (900) (1,118) (864) 10,397 22,886 Net Income (900) (1,118) (864) 7,278 16,020 Cumm. Income (900) (2,018) (2,882) 4,396 20,416 Cash from Oper. (908) (1,169) (4,838) 5,331 9,530 Capital Exp. 350 2,781 3,422 7,793 16,813 Funding Needs 3,000 5,000 16,000 - - Ending Cash 1,792 2,841 10,582 8,119 837 Agenda Mission Problems Solution Team Market Comp. Funding Why?

  15. Why Invest in Mobius? Reasons to Invest in Mobius • Strong, Scalable, Needed Technology with Significant Added Value • Motivated, Experienced, Talented Team • Tremendously Expanding Market • Applications in Broad Spectrum of Markets • Opportunity to Capitalize on Emerging Applications Agenda Mission Problems Solution Team Market Comp. Funding Why?

  16. TSoC Why Invest in Mobius? Current Strategy • Full Business Plan just Completed • Prototypes Developed, Manufactured, and Tested • Seeking Start-Up Capital From Angel Investors and Venture Capitalists • Looking to Fill Gaps: Management and Partnerships • Developing Specification for Initial Product Offerings • R&D underway for Bluetooth Enabled ECM Agenda Mission Problems Solution Team Market Comp. Funding Why?