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Development electronics SIPM- MU2e

Development electronics SIPM- MU2e. INFN-LNF G. Corradi 11/06/2016 giovanni.corradi@lnf.infn.it. Calorimeter routing. DAQ room. Detector Solenoid. Floating LV +28V / negative Floating positive HV 230 V (MPPC) ground. ~7-8 m overall cross section ~180 cm 2. ~60-80 m

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Development electronics SIPM- MU2e

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  1. Development electronicsSIPM-MU2e INFN-LNF G. Corradi 11/06/2016 giovanni.corradi@lnf.infn.it

  2. Calorimeter routing DAQ room Detector Solenoid Floating LV +28V /negative Floating positive HV 230 V (MPPC) ground ~7-8 m overall cross section ~180 cm2 ~60-80 m overall cross section ~210 cm2 LV HV isolation OVP filter Detector Ground Safety Ground Floating Structures

  3. Architecture front-end • Optimization of space • Cables and connectors

  4. Preamp-Regulator scheme

  5. Preamplifier_SIPM Preamplifier Shaper filter Select Gain Select Pulse Test Differential Driver Linear Regulation • Electric preamplifier scheme

  6. Simulation before end after filter

  7. Simulation bandwidthPreamplifier

  8. Simulation bandwidth after filter

  9. Preliminary Specifications Preamplifier • Gain Vout/Vin 2 step remote control 15-30 • Dynamic differential +/-1V • Bandwidth 40Mhz • Rise time 10ns • Output impedance 100 Ω • Stability with source capacity max 1nf • Coupling output end source AC • Noise, with source capacity 1pf --------- • Power dissipation 45mW • Power supply +8V • Semi-gaussian shaping filter 3 pole • Injection test pulse charging, fixed amplitude 400mV • Input protection 10mJ

  10. Linear_ Regulator Linear Driver Driver Decoder ADC 16bit Linear low Voltage section I2C line DAC 16bit • Electric linear regulator scheme

  11. Preliminary Specifications regulator • Vin max 250V • Current limit 2mA • Dynamic regulation 5V to 200V • Settling time 100us • Ramp-up programmable 1ms to 100ms • Ripple estimated 3mVpp • Stability Δt 10 °C better 50 ppm • Power dissipation with out load min 50 mW • Power dissipation max load, worst case max 350 mW • Temperature measurement -40 to 50°C • Monitor current detector 50uA to 2mA • Remote control I2C • GND insulated from earth Ceq max 5pf

  12. PCB Layer TOP Preamplifier • Dimention card 58mm x 30mm

  13. PCB Layer Bottom Regulator • 4 holes for heat transfer on the mechanics

  14. Final Assemblay Thermal Contact By Bridge resistor • Thermal conducting • Power to dissipate max 350mW Board Temperature Sensor Output Connector Case (Cu)

  15. Costs

  16. Costs (2)

  17. Status and perspectives • Preamp-regulator, projectcompleted • Test, first week of june • Firmware developmentworking progress • Definition of the cables and interfaceconnectorsbetweenpreamplifier and controller • Project progress, primaryregulatorprototype 250V 40mA ( with knownmagneticfieldproblems) • Project progress, primaryregulatorprototype 8V 1A (sameproblemsasmentionedearlier) • Project and development controller ARM

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