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Test Economics for Homogeneous Manycore Systems

randall-hampton avatar
26 diapositives · 405 Views · Nov 20, 2014

This paper explores the economics of testing in homogeneous manycore processor systems, focusing on the impact of manufacturing test costs and defect coverage. As technology advances, it becomes crucial to adapt testing strategies to reduce costs while maintaining product quality. We propose integrating test cost-driven redundant cores alongside traditional yield-driven approaches. Experimental results support the notion that relaxing defect coverage requirements and utilizing partial or no burn-in testing can significantly lower total production costs, enabling efficient manufacturing processes in the manycore processor era.

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  1. Test Economics for Homogeneous Manycore Systems Lin Huang† and Qiang Xu†‡ †CUhk REliable computing laboratory (CURE) Department of Computer Science & Engineering The Chinese University of Hong Kong ‡CAS-CUHK Shenzhen Institute of Advanced Integration Technology

  2. Observations on Manufacturing Test Cost • Manufacturing test is responsible for achieving sufficient high defect coverage • As technology advances … • Test patterns that target more kinds of errors become essential • Accelerated testing methods (e.g., burn-in test) becomes difficult • Manufacturing test cost – a great share of production cost • In particular, burn-in cost can range from 5-40% of production cost • If we are able to relax the coverage requirement, manufacturing cost can be dramatically reduced

  3. Manycore Processor Era Provides us An Opportunity • The integration of a large number of cores on a single silicon die • Increasingly popular in the industry • Traditional yield-driven redundant cores aims to improve the manufacturing yield • We propose to introduce a few test cost-driven redundant cores in addition to yield-driven spares for test cost reduction • If test cost reduction exceeds the manufacturing cost increment, the total production cost can be reduced

  4. Manycore Processor Era Provides us An Opportunity • If test cost reduction exceeds the manufacturing cost increment, the total production cost can be reduced • Consider a 16-core processor To guarantee that all 16 cores work well provided they pass manufacturing test, we need … –Very high defect coverage to identify killer defects – Sufficient burn-in to weed out chips with latent defects Manufacturing test is responsible for 16 out of 20 cores (instead of all 20 cores) to work –Defect coverage requirement can be lowered –Burn-in test can be reduced or eliminated – Manufacturing cost increases

  5. Agenda • Background • Test Economics with Partial/No Burn-In • Test Economics with Partial Manufacturing Test • Experimental Results • Conclusion

  6. Basics in Yield Modeling • Defects on chip – Negative-binomial distribution • Defect type • Killer defects • Latent defects • Bathtub curve

  7. Problem 1[Partial Burn-In] • Enable partial/no burn-in test only • Given defect coverage requirement, we consider to introduce redundant cores into manycore system that functions if no less than cores are defect-free • We fabricate cores on a chip • Chips with all cores pass test are sold out • Eventually we need to guarantee cores are defect-free at the end of infant morality • Determine the number of burn-in driven spares and burn-in time such that … • The production cost per sold chip is minimized • Product quality constraint is met

  8. The Impact of Partial Burn-In • The reliability induced by latent defects follows Weibull distribution with decreasing failure rate • Assume that all latent defects reveal themselves after full burn-in time

  9. Product Quality and Chip Test Yield • Product quality requirement • The probability that a sold chip actually functions at the end of infant mortality should be higher than a threshold • – no less than cores on a chip is defect-free at the end of infant mortality • – all cores on a chip pass manufacturing test after (partial) burn-in • Chip test yield

  10. Product Quality and Chip Test Yield

  11. Product Quality and Chip Test Yield • Define • – -out-of- cores are initially defect-free • – cores in that set maintain defect-free after burn-in time • We obtain

  12. Cost Model • Simple yet effective cost model – capture the key impact of introducing burn-in driven redundancy • Manufacturing cost – normalize to the case that manufacturing cost of each core for manycore chips without redundancy is 1 unit • ATE cost – ATE cost per fabricated core is unit • Burn-in cost – normalize the cost of fully burn-in process as unit and assume it is proportional to the burn-in time

  13. Case Study on Partial/No Burn-In • Homogeneous manycore system that functions with no less than 32 defect-free cores • Product quality requirement is set to 500DPPM

  14. Problem 2[Partial Burn-In & Relaxed Defect Coverage] • Not only enable partial/no burn-in test but also relax the defect coverage for core tests • We introduce test cost-driven spares and yield-driven ones • We have totally identical cores on chip • Chips containing no less than pass- test cores are shipped out • Eventually we need to guarantee cores are defect-free at the end of infant morality

  15. Problem 2[Partial Burn-In & Relaxed Defect Coverage] • Determine the number of test cost-driven spares, number of yield-driven spares, defect coverage for core test, and burn-in time such that … • The production cost per sold chip is minimized • Product quality constraint is met

  16. The Impact of Test Decision Criterion • Ideally a prefect manufacturing test is able to reject all bad cores while accept all defect-free ones • and • In reality … Test escapes False rejects

  17. Product Quality with False Rejects • Redefine • – no less than cores on a chip is defect-free at the end of infant mortality • – no less than cores among all cores on a chip pass manufacturing test after (partial) burn-in • Similarly, we have

  18. Product Quality with False Rejects • Notations • – -out-of- cores are initially defect-free • – cores in that set maintain defect-free after burn-in time • – among good cores on a chip, pass the test • – among bad cores, pass the test • We have

  19. Cost Model • Total production cost • ATE cost depends on defect coverage

  20. Experimental Setup • Homogeneous manycore system that functions with no less than 32 defect-free cores (i.e., ) • The best , and combination in terms of production cost is determined by exploring solution space • System parameters • , , , , • , , • Product quality requirement is set to 500DPPM

  21. High defect density Low defect density Tradeoff between Burn-In Cost and ATE Cost under Product Quality Constraint

  22. Comparison between Traditional and Proposed Strategy 22.28%

  23. Comparison between Traditional and Proposed Strategy 25.26%

  24. Comparison between Traditional and Proposed Strategy

  25. Conclusion • We propose to introduce spare cores into manycore system • Burn-in test time can be shorten • Defect coverage requirement can be relaxed • Without sacrificing quality of the shipped products • We develop novel analytical models to verify the effectiveness of the proposed strategy

  26. Test Economics for Homogeneous Manycore Systems Thank you for your attention !