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ATLAS SCT Endcap Detector Modules

ATLAS SCT Endcap Detector Modules. Lutz Feld University of Freiburg for the ATLAS SCT Collaboration Vertex 2002. 5.6m. Endcap Disks covered by 3 Rings of Modules. 9 disks in each endcap, ~1.2m diameter CF structure 132 detector modules on a full disk , 1976 endcap modules in total

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ATLAS SCT Endcap Detector Modules

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  1. ATLASSCT Endcap Detector Modules Lutz Feld University of Freiburg for the ATLAS SCT Collaboration Vertex 2002 5.6m

  2. Endcap Disks covered by 3 Rings of Modules • 9 disks in each endcap, ~1.2m diameter CF structure • 132 detector modules on a full disk, 1976 endcap modules in total • modules have central mounting and cooling pointmodule overlap easy • each module serviced by a power tape and 3 optical fibres • evaporative cooling circuits serve up to 13 modules cooling block outer modules middle modules(on backside) power tapes inner modules Lutz Feld, Freiburg University

  3. 3 Module Types outer module (52 per ring) inner module (40 per ring) middle module (40 per ring) Lutz Feld, Freiburg University

  4. strip direction strip direction Endcap Module Design: Silicon Sensors 4 wedge shape silicon sensors 768 p-in-n strips,single sided supplied by Hamamatsu and CiS sensor alignment < 5µm 40mrad stereo angle Lutz Feld, Freiburg University

  5. strip direction strip direction Endcap Module Design: „Spine“ sensors are glued to „spine“: TPG bar for heat removal(1700 W/m/K) AlN wings for mechanical stability mounting points and cooling contacts mounting points and cooling contacts Lutz Feld, Freiburg University

  6. strip direction strip direction Endcap Module Design: Hybrid hybrid connected to sensors only by fanins  thermal split • 12 ABCD3TAbinary read-out chips (DMILL) hybrid:flex circuit on carbon-carbon Lutz Feld, Freiburg University

  7. Hybrid • development of hybrid was critical and needed several iterations • very low impedance is key for successful operation of binary ABCD chips • requirements: • double sided, 12 readout chips • supply well filtered analogue/digital power • com/data lines and drivers for optical link • detector bias supply (up to 500V) • heat removal (7W) • low mass • implementation: • 6 layer copper/Kapton flex circuit • ~75µm feature size, ~3000 micro vias • flex folded around carbon-carbon substrate • full assembly and basic testing in industry Lutz Feld, Freiburg University

  8. Thermal Performance of Endcap Module • evaporative C3F8 cooling system, capable to cool down to –30°C • central module cooling block, split between hybrid and detectors,long modules have additional far end cooling block • detailed simulations, confirmed by measurements of non-irradiated and irradiated modules on an evaporative cooling test rig detector temperature vs. radiation damage for coolant at –21°C inner module outer module expectedafter 10 years expected after 10 years Lutz Feld, Freiburg University

  9. Electrical Performance • binary front-end chip  occupancy vs. threshold  „s-curves“ • signal height and noise are derived from „s-curves“ • relevant for operation: hit efficiency and noise occupancy • noise occupancy determined by • front-end noise (fixed for given ASIC and detector) • channel-to-channel threshold variations (threshold trim per channel) • additional noise: common mode, feedback etc. (the difficult part...) occupancy vs. channel and threshold occupancy vs. threshold Lutz Feld, Freiburg University

  10. 16 Prototype Modules • 9 outer, 2 middle, 5 inner • modules built reliably inside tolerances, in several institutes • noise 1500 e or less • noise occupancy @1fC: ~10-5 • gain ~50mV/fC • threshold spread 150 e threshold spread ENC noise gain Lutz Feld, Freiburg University

  11. System Test: 4 Modules on a Disk Sector noise for each chip when operatedsimultaneouslysingly with 4 modules on disk • no extra noise • common mode noise negligible common mode noise Lutz Feld, Freiburg University

  12. Testbeam Results • binary read-out: efficiency and noise occupancy at given threshold • spec: single hit efficiency > 99% while noise occupancy < 5E-4 • long modules before / after irradiation to 1.6 or 3.3 E14 24GeV-p/cm2in a beam of 180 GeV pions • 10 years LHC operation ~2.6E14 p/cm2 • spatial resolution of 23µm achieved, as expected from pitch/sqrt(12) non-irradiated @ 150V bias 1.6E14 24GeV-p/cm2 @ 480V bias 3.3E14 24GeV-p/cm2 @ 480V bias Lutz Feld, Freiburg University

  13. Summary & Outlook • ATLAS SCT endcap modules final design review in August 02 • now preparing for production of 2000 modules (+spares): • ASICs and detectors: ~80% delivered • hybrid: pre-series of 100 pieces in production, first samples delivered;for production: full assembly and basic testing in industry • spines and fan-ins: pre-series in production, first samples delivered;production can start soon • module assembly and QA at 7 sites • good experience with assembly of prototype modules (>20) • preparation of production tooling and qualification over next months • production will take about 1.5 years Lutz Feld, Freiburg University

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