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NASDAT & EIP Critical Design Review (CDR)

NASDAT & EIP Critical Design Review (CDR). ARRA Task 88 NASA ASF, 9/15/2011. Contents. Background Key Requirements Workmanship Documents & Drawings Personnel Experimenter Interface Panels (EIPs) NASA Airborne Science Data Acquisition and Transmission units (NASDATs) Aircraft

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NASDAT & EIP Critical Design Review (CDR)

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  1. NASDAT & EIPCritical Design Review (CDR) ARRA Task 88 NASA ASF, 9/15/2011

  2. Contents • Background • Key Requirements • Workmanship • Documents & Drawings • Personnel • Experimenter Interface Panels (EIPs) • NASA Airborne Science Data Acquisition and Transmission units (NASDATs) • Aircraft • Conclusions • Acronym List • Backup Slides

  3. Background • What is this review about? • Design & development of the MK3 EIP and NASDAT units • The status & impacts of the new data system on various NASA Airbone platforms • What is not covered in this review? • Details of the Global Hawk system • Details of BGAN antenna installation • Specific instrument installations

  4. Background • A Highly-Simplified System Block Diagram: NOTES: NAV DATA PASS-THRU - ALL COMPONENTS ISOLATED FROM AVIONICS BUS • INSTRUMENT SWITCHES CONTROLLED BY WIRE (NOT • ETHERNET) 28V NAV DATA TO EIPs 1G BGAN/SAT-COM* J20 NAV DATA ISOLATION 1G LINK MODULE (OPTIONAL) J20 * - AIRCRAFT DEPENDENT; ENABLES SENSOR-WEB

  5. Background • Why are we doing this? Sensor Web – A distributed and coordinated network of sensors which collectively act as a single “macro- instrument.” (Delin, Sensors Magazine 4/1/2004)

  6. Background • How this work is funded & requirements: • American Recovery & Reinvestment Act (ARRA): • Build enough EIPs and NASDATs to support ER-2 and WB-57 • Task expires 10/31/11 • FY11 Overguide • Build out remaining, known hardware requirements for Global Hawk and other aircraft • Allocations & details at end of CDR

  7. Key Requirements • EIP Key Requirements: • Match the capability in the ER-2 experimenters handbook, and… • Support legacy instruments • Monitor DC power & transmit over ethernet • Operate in all airborne environments • Include ethernet switch • Fit in existing ER-2 & WB-57 footprint • Easy to install in existing planes with skeleton crews • Meet NASA QA & workmanship requirements • Operate for 10+ years • Be reasonable to maintain & repair

  8. Key Requirements • NASDAT Key Requirements: • Provide experiments… • Navigation and aircraft data isolated from the aircraft bus • Time – as accurate as possible • Baseline satcom, network, & sensor-web communication • Legacy interfaces from Navigation Recorder: RS-232, RS-422, ARINC-429, Synchro, IRIG-B • Record cockpit switch states on manned aircraft • Meet NASA QA & workmanship requirements • Operate for 10+ years • Withstand harsh environments

  9. Workmanship • How can we maintain quality, compatibility with the standards, and meet $ & schedule? • Not many houses build to the NASA 8739.x workmanship standards • No COTS board vendors build to 8739.x • Many workmanship standards are compatible with the NASA 8739 standards • Ex. All flight Global Hawk PCBs built to IPC-610/III & inspected at DFRC • Working with customer QA for site and first-article inspections of hardware

  10. Workmanship

  11. Workmanship

  12. Personnel • Primary members of the NASA Airborne Sensor Facility (ASF) working on this project: • Caitlin Barnes – NASDAT Mechanical Design • Kent Dunwoody – NASDAT Assembly • Josh Forgione – Project Lead, EIP Lead, NASDAT PCB design • Diane Gribschaw - Administration • Jeff Grose – EIP & NASDAT Test, NASDAT Assembly • Jeff Myers – ASF Department Head • Carl Sorenson – NASDAT Lead • Tony Trias – NASDAT Assembly • Roy Vogler – EIP Mechanical Design

  13. Personnel • Manufacturing teams working on this project: • Alta Manufacturing (Milpitas, CA) – PCB Fab & Assembly • Engineering Integration Technology (EIT), Inc. (Eatontown, NJ) – EIP Assembly, PCB Fab & Assembly • Minimatics, Inc. (Mountain View, CA) – Custom machining • NASA Ames Sheet-metal Fabrication Shop (Moffett Field, CA) – EIP Enclosures • Plasma Ruggedized Solutions (San Jose, CA) – PCB Staking & Coating • SIE Computing Solutions (Brockton, MA) – NASDAT Enclosures • Sierra Proto Express (Sunnyvale, CA) – PCB Fab & Assembly • Zentek Scientific (Fremont, CA) – PCB Fab & Assembly • Environmental Testing: NASA Ames Engineering Evaluation Laboratory (EEL) (Moffett Field, CA)

  14. Documents & Drawings • Key EIP Design Documents: • Assembly Drawing (a9444-ASF11-342A) • Enclosure Drawing (a9444-ASF11-341A) • Ethernet Module (EIP-ASSY-001) • AC Distribution Card (EIP-ASSY-002) • DC Monitor Card (EIP-ASSY-003) • Solid State Power Controller Card (EIP-ASSY-004) • EIP New Technology Report #1289235210

  15. Documents & Drawings • NASDAT: • ARINC Mounting Tray Drawing (Emteq #MT4-6004S) • NASDAT Pinouts (NASDAT-PINOUT) • Interface Card (NASDAT-ASSY-001) • Analog / Dataforth Card (NASDAT-ASSY-002) • MTC / Iridium Power Card (NASDAT-ASSY-003) • Power Distribution Unit Card (NASDAT-ASSY-004)

  16. Experiment Interface Panels

  17. EIP EIP Functional Block Diagram: Power Systems: - 400Hz AC -28VDC -DC Monitor 28V & DCMON are isolated from each other & referenced to EIP enclosure. All AC power is pass-through – no connection to EIP.

  18. EIP • EIP Versions: • Mark I: 1990s – Legacy ER-2 & WB57 units • Cabling patch-through with low-current relays to handle cockpit switch interface • Mark II: 2009 - Global Hawk • First cut at fleet-wide design, ended up being GH-specific • Mechanical relays, lots of wire, no ethernet switch inside • Mark III: 2011 – ER-2, WB-57 • Meets power requirements of MK1 design • Manned aircraft interface • Incorporates ethernet switch • Leverages technology not available during MK2 design

  19. EIP • Power Requirement (ER-2 Experimenter Handbook): (25A x 2 ckts) (79A) (50A x 2 EIPs) (72Ax2 EIPs) (79A) (30A) (30A) DC CURRENT REQUIREMENT: 79A per EIP (2.2kW) AC CURRENT REQUIREMENT: 50A / Ф, per EIP (17.25KVA)

  20. Replace J1-J4 with smaller connectors that only have switch/fail/interlock EIP Instrument Power connectors changes to 38999 21-16 (same as MK2) (MK1) Still supporting 35Ax2 output but on one connector Fuse circuits internally, use poly fuses where tempco is not an issue Replace J13 & J14 with Ethernet; leave aircraft wire in place & use as needed. Ship-side signals (DC, AC, Control input) connectors are drop-in compatible.

  21. EIP Interfaces: J6-J9: MIXED AC/DC CONNECTORS J2-J5: COCKPIT (“AIRCRAFT SIGNALS”) MK3 Proto Front Panel: J4: 35A X2 DC OUT Mission Critical 15A AC/DC & Control 15A AC/DC & Control 2x50A DC Output Control & Data Input Mission Critical J5: DATA (“AIRCRAFT SIGNALS”) EIP POWER (DCMON & ETHERNET SWITCH) Mission Critical 15A AC/DC & Control 15A AC/DC & Control 3Ф AC Input Legacy Output 8x100 Mb Ethernet 4x1Gb Ethernet J19-20: (4) 1Gb ETHERNET DC POWER (TRU) J16-17: (8) 10/100 ETHERNET

  22. EIP Interfaces: EIP Left Panel: Mission Critical DELETED FOR FLIGHT UNIT 15A AC/DC & Control 15A AC/DC & Control 2x50A DC Output Control & Data Input (USING INTERNAL POLYFUSE) Mission Critical J18: COCKPIT, DATA, EIP POWER, EIP ID J15: 35A X2 DC INPUT J16: 3Ф AC INPUT (2 CKTS) Mission Critical 15A AC/DC & Control 15A AC/DC & Control 3Ф AC Input Legacy Output 8x100 Mb Ethernet 4x1Gb Ethernet

  23. EIP • Previous images showed prototype connector IDs which were arbitrary. • Flight unit connector labeling will match existing ER-2 drawings:

  24. L1/L2/Omnistar GPS (coax) (Global Hawk only) 3Ф, 400Hz AC Circuit #1 (15A/Ф)* 3Ф, 400Hz AC Circuit #2 (15A/Ф)* 28VDC Circuit #1 @ 15A (H: Power) 28VDC Circuit #2 @ 15A (D: Power) IRIG-B (coax) Switch (from cockpit) (N.O. & COM) @ 5A EIP Interfaces: • J6-J9: Standard AC/DC Connector (Amphenol D38999/20WG16SN) • 16 x AWG #16 contacts, same pinout as Global Hawk EIP * - Recommended loading varies per plane & based on SAE50881 analysis

  25. EIP • MK2 & MK3 AC/DC Connector Differences: • No GPS splitter in MK3 units (pin M) • Command Relay (pins P & R) • MK2 relay is a mechanical relay – each pin is passive • MK3 relay is an active device (5A SSPC) • Input must be applied to ‘COM’ pin (P), output to ‘N.O.’ pin (R) • 3-Ф AC Circuits’ wire rating • GH rates circuits @ 10A/Ф, ER-2 & WB @ 15A/Ф • Both units use #16 wire, different rating philosophy

  26. EIP • MK1 vs. MK3 “Aircraft Signals” Connectors: • MK1 had 5, MK3 has 1 full (J1) + 4 small (J2-J5) • J1: Switch #1, Pin-for-pin compatible with MK1 J1 • Uses same M39016/19 relay circuits as MK1: NC/NO/COM contacts, rated @ 1A resistive • Adds AD590/AC2626 temp sensor, read out in EIP status packet • Labeled “DATA” on MK3 • J2-J5 – Switches #2-5, WoW/Alt relays, interlock/fail • Switches are mirrored from J6-J9, but polyfused @ 2A nominal • Switches are NO/COM only and polarity sensitive • Labeled “COCKPIT” on MK3

  27. EIP • “Cockpit” Connectors (J2-J5): MIL-38999/III 13-98 • Switch grouping: • J6 & J2 (#2), J7 & J3 (#3), J8 & J4 (#4), J9 & J5 (#5) Cockpit Switch (2A) WoW (0.5A) N.O. COM N.O. Interlock COM COM GND Altitude (0.5A) N.O. FAIL (4-28V) 28V @ 3A* * - Pin K on J2-J5 protected by a single 3A polyfusefor the set

  28. EIP • Ethernet : MIL-38999/III 21-75 w/ quadrax inserts • ASF-MEMO-001 contains all pinouts & tooling for quadrax • Re-pin mating cable per mission (quadrax rated 500 cycles) • J19 for network, so 2x 1G & 8x 10/100 ports available for instruments, per EIP J19 & J20: 2x 1G per EIP J21 & J22: 4x 10/100M per EIP

  29. EIP • What ethernet connectors should experiments use? • RJFTV – easy, available, inexpensive • RJ45 in a MIL-38999/III shell • Global Hawk issues solved • Contact ASF for support re: use with Tensolite cable • Quadrax: expensive, low-loss, good for aircraft • Stay with Amphenol quadrax (ITT differs) • Part number support & spares available from ASF • ASF also has pressure bulkhead feed-throughs available

  30. EIP • EIP Components & Technology: • Solid State Power Controllers (Ametek Amphion) • DC relay, over-current and arc-fault breaker in 1.5in3 • Trip state, voltage & current monitor over SPI • Low power dissipation: Ron = 6mΩ @ 20A (120mW), no relay coil • Fails to ‘open’ state • -55ºC to 85ºC operation • Surge tolerant (48V @ 1s, 80V @ 100ms)

  31. Solid State Power Controller (SSPC) Board 8x 20A SSPCs (15A trip) 4x 5A SSPCs Multiplexes monitor circuits for each SSPC to a common SPI bus Flight units built & tested, in stake & coat

  32. EIP • EIP Components & Technology: • 13-Port Ethernet Switch (Sixnet + NASA) • Original product developed by AP Labs for Alaska Airlines in-flight network • Only COTS switch found that fit inside an EIP • ASF modified to meet environment & connector req’s. • 8x 10/100Mb, 4x 1Gb, one extra internal port AP Labs (uses ITT) NASA (uses Amphenol)

  33. EIP • EIP Components & Technology: • Microchip PIC18FxxJ60: 8-bit microcontroller, 12x 10-bit A/D, built-in 10Mb Ethernet PHY • M39016/19 hermetic relays: copies circuits used in MK1 EIP for cockpit switch interface DCMON PCB In flight fabrication

  34. EIP • EIP Components & Technology: • AC Distribution Board: • 2-circuit, 3-ф, 400 Hz AC terminal block (17.25kVA) • DC circuits pass through • Frees up significant panel space • Layer Stackup (0.170” Thick): • Top: Shield • Inner 1-2: Ckts. 1 & 2 ФA • Inner 3: Shield • Inner 4-5: Ckts. 1 & 2 ФB • Inner 6: Shield • Inner 7-8: Ckts. 1 & 2 ФC • Inner 9: Shield • Inner 10: Circuit 1 Neutral • Inner 11: Shield • Inner 12: Circuit 2 Neutral • Bottom: Shield • Analysis: • Max Electric Field across dielectric: 22.5V / mil @ 180V • FR4 Dielectric Breakdown Voltage (DBV): 1100V/mil • Hi-Pot Test: • Passed to 800VAC (5mA limit), 1250VDC Prototype ACDIST (flight in fab)

  35. EIP • Mass & Power • EIP Prototype Weight: 7.5lb (MK1 was ~6.5lb) • Internal Power: 85W max • Ethernet Switch & DCMON: 15W max (10W typ.) • Power increases with Ethernet traffic • Survival heater (-40C): 70W @ 28V

  36. EIP • EIP Prototype Testing: • Built 2 prototypes to speed up test time • Abused units to find weaknesses in design • Thermal & Altitude Tests: • -75C, sea level – operated 1 hr (until LN2 ran out) • 45C, sea level – operated, but near limits • -55C, 70kft – no issues • Vibration Test: • 3-axis, 0.5grms, powered @ 1hr/axis • Ethernet Traffic Test: test throughput • “Maintenance test” – put it together, take it apart

  37. MK3 EIP Prototype

  38. EIP • Flight EIP Manufacturing: • PCBs inspected & tested on-site at vendor prior to stake & coat. • EIP First Article will be inspected on-site and become the qualification unit. • Remaining EIP assembly will occur in parallel with qual test

  39. EIP • Flight EIP Test Flow: • Qualification test:1 unit, rest pass by similarity • Electrical Performance • Powered vibe @ endurance levels & duration • Powered thermal / altitude

  40. EIP • EIP 3-axis vibration • Profile based on WB-57 levels, approved w/ Lockheed (ER2) • Qualification Test: • Powered 3-axis test @ 0.5grms, 1 hour per axis • Workmanship Test: • Unpowered 3-axis test @ 0.5grms, 15 min/axis

  41. EIP

  42. EIP • Prototype Discrepancies / Issues / Risks:

  43. EIP • Prototype Discrepancies / Issues / Risks

  44. EIP • Prototype Discrepancies / Issues / Risks:

  45. EIP • Flight EIP Status: • All subassemblies are in manufacturing and test. START TASK END DURATION % DONE

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