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Smart & Quality Memory Module

The SQRAM Product Line Roadmap outlines the latest advancements in Samsung's quality DRAM modules, including Wide Temperature Modules designed for extreme conditions. With revenue forecasts indicating a decline in the DRAM market, our focus remains on delivering reliable Long-DIMM and SO-DIMM DDR2 and DDR3 memory modules, equipped with thermal sensors and ECC support. Our rigorous testing processes ensure robust performance across various temperature ranges, making SQRAM the ideal choice for industrial-grade applications.

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Smart & Quality Memory Module

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  1. Smart & Quality Memory Module SQRAM Product Line Roadmap & Sales Kit Embedded Core Group H2, 2011

  2. DRAM Market Status • Worldwide DRAM revenue in 2011 is forecast to decline to US$35.5 billion, down 11.8% from US$40.3 billion in 2010 • Samsung shares over 40% DRAM market

  3. Wide Temperature Module Market

  4. 30u Golden Finger Samsung Memory Chip Thermal Sensor 10G Anti-Vibration

  5. SQRAM Product Roadmap SQR-LD3R SQR-LD3E -20 ~ 70°C -20 ~ 85°C -40 ~ 85°C • Long-DIMM DDR3 RAM module • Samsung chip • ECC support • Long-DIMM DDR3 RAM module • Samsung chip • Register support Q4‘11 Q4‘11 SQR-SD3I SQR-SD2I SQR-SD3T SQR-SD2T Lo9ng-DIMM SO-DIMM • SO-DIMM DDR2 RAM module • 128X8 Samsung F Die • 1G / 2G 667MHz • -40 ~ 85C temperature • SO-DIMM DDR3 RAM module • Samsung C Die • 1G / 2G / 4G 1333MHz • -40 ~ 85C temperature • SO-DIMM DDR2 RAM module • 128X8 Samsung F Die • 1G / 2G 667MHz • -40 ~ 85C temperature • Thermal Sensor support • SO-DIMM DDR3 RAM module • Samsung C Die • 1G / 2G / 4G 1333MHz • -40 ~ 85C temperature • Thermal Sensor support Developing Q4‘11 Q4‘11 Planning Available 2011 2012

  6. SQRAM Overview DRAM Standard: DDR2 667MHz, DDR3 1333MHz Supports Interface: SO-DIMM, LONG-DIMM Chipset: Samsung (Sorting) Module Supplier: Transcend Functionality: ECC, Register, Thermal Sensor Temperature: -40C ~ 85C Regulation: CE, FCC Moduleware: Thermal Monitor Longevity: TBD

  7. Industrial Grade Memory Module • Testing Process • Commercial grade tested good modules • Vibration • Sampling test under -40℃ (ambient) , sampling rate ~10% (MIL-STD-105E) • Testing program under +85℃ (ambient) • Chamber -40℃ ~ +85℃ (ambient) • Testing Program Testing Program Room Temp. Vibration Chamber -40C Heater +85C Static Chamber -40~85C Testing Program Sampling Testing

  8. Testing Process Description • The purpose of vibration is to reveal the non-robust module • PASS/Fail will be determined by the next 3 testing step (chamber -40 ℃, heater 85 ℃, room temp. test) • Condition • • 10~50 Hz • • 2 mm amplitude • • 10G • • 2 min/cycle , total 5cycle Vibration

  9. Testing Process Description • Sampling test • Sample rate: base on MIL-STD-105E, around 10% per 100 pc module • Criterion: all samples should pass the testing • Test program • test coverage: memtest and RST • 32 / 64 bit kernel • Test time: 15 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C

  10. Test Program Function • Stuck On test for detecting data bit which always fix high level • Stuck Off Test for detecting data bit which always fix low level • Random Address Test for random access test • Random Data Test for random data write/read verification • Address-Line Test for internal address decoder circuit test • Walking Bit Test for data line leakage detection • One and Zero Data Test for dram hard fail detect test • Worse Data Background Test for dram process defect test write various data ex, 0xaa / 0x55 / 0xcc / 0x33 / 0x99 / 0x66 … • Un-cachable Memory Test – Disable the cache of CPU to avoid the cache interference of memory test

  11. PASS Criterion • Display Error Chip / Error Counts / Error Address and Error Bit

  12. Testing Process Description • 85℃ • Test program • test coverage: memtest and RST • 32 / 64 bit kernel • Test time: 15 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C Heater +85C

  13. Testing Process Description • Test time: 235 min / cycle • Test cycle: 25℃ => -40 ℃ => 85℃ => 25℃ • Refer to figure1 at page6 • PASS/Fail will be determined by the next testing step (room temp. test) Vibration Chamber -40C Heater +85C Static Chamber -40~85C

  14. Static Chamber

  15. Testing Process Description • Room temp. • Test program (Transcend owned development) • Test time : 6 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C Heater +85C Static Chamber -40~85C Room Temp.

  16. SQRAM ModuleWare

  17. Thermal Monitoring • SUSI driver/API required • Support by Monitoring utility & SUSIAccess • Function • Configuration: • Set warning temperature threshold • Set warning response (alarm, hibernate, shutdown) • User Interface • Monitor from system tray • Event log

  18. Thank You.

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