'Flip chip' diaporamas de présentation

Part-D

Part-D. Main topics Packaging of electronic equipments Components of electronic systems Surface mount technology Printed Wiring board (PWB) types Electronics packaging levels Wire bonding packaging Flip-Chip packaging Chip Scale Packaging Ball Grid Array packaging

1.22k views • 53 slides

Part-D

Part-D. Main topics Packaging of electronic equipments Components of electronic systems Surface mount technology Printed Wiring board (PWB) types Electronics packaging levels Wire bonding packaging Flip-Chip packaging Chip Scale Packaging Ball Grid Array packaging

1.06k views • 53 slides

Digital Integrated Circuits A Design Perspective

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. Manufacturing Process. July 30, 2002. CMOS Process. A Modern CMOS Process; Think ! ; Why 1)dual well, 2)trench, 3)LDD (Lightly-Doped Drain), 4)TiSi2 ?.

634 views • 42 slides

Nordson Corporation : The Global Leader in Precision Technologies for Manufacturers

556 views • 39 slides

Chapter 2: Technologies for Electronics - Overview

Chapter 2: Technologies for Electronics - Overview. HOLE-MOUNTED PRINTED CIRCUIT BOARDS (PCBs). Components with legs soldered through holes in an organic printed wiring board (PWB) Standard grid for holes 0.1 " pitch

492 views • 34 slides

Pixel 2005 summary

436 views • 29 slides

Integrated Circuits

Integrated Circuits. How are Integrated Circuits Made?.

488 views • 26 slides

Study of Indium bumps for the ATLAS pixel detector

440 views • 25 slides

EMI and USB filters

? ? ? ? ? ?. EMI and USB filters. EMI filters in Handset Applications. LCD Display Operating Voltage 4.0 to 5.0 Volts Clock speed: 13 to 20 MHz # of data lines: 16 to 24 lines. Microphone /Speaker Operating Voltage: 3.0 to 5.0 Volts # of lines: 3 to 4 lines. Mega Pixel Camera/

623 views • 25 slides

SMU Activities Jingbo Ye May 9, 2005, CERN, for Opto-Electronics Readout Systems for SLHC.

SMU Activities Jingbo Ye May 9, 2005, CERN, for Opto-Electronics Readout Systems for SLHC. System and Irradiation Tests on the GOL chip. LoC (link on chip) development based on SoS technology. GOL chip.

383 views • 22 slides

Packaging Design Roadmap

Packaging Design Roadmap. Fingerprint Sensor Mike Patterson November 2000. Contents. Current Design Comments on Current Design Other Design Options & Recommendations. Current Design Levels of Interconnect. Level 0: Athena Die to MEMS Substrate Flipchip

431 views • 21 slides

5 Packaging Intro

MEMS MOEMS Nano. Workshop. 5 Packaging Intro. Ken Gilleo PhD ET-Trends LLC. 44%. the. DEVICE. DEVICE. Reworkability. Enable repair. WIRING. WIRING. JOINING. JOINING. Automated Handling. Easy Testability. Easy Assembly. PROTECTION. Package. Chip to PCB Compatibility.

460 views • 19 slides

Highlights

362 views • 19 slides

Flip Chip Technology

Flip Chip Technology. Microwave Device Term Project. 2005/6/16 Kim Dong Hwan School of Electrical Engineering and Computer Science Seoul National University, Korea. Contents. Introduction Wire Bonding vs. Flip Chip interconnect Flip Chip Process (SSB & MSB) Conclusion. Introduction.

1.27k views • 17 slides

The 2002 ITRS Assembly and Packaging Roadmap Bill Chen - ASE

384 views • 16 slides

Pixel integrated stave concepts

Pixel integrated stave concepts. Valencia 2007 SLHC workshop. Introduction. We now have modules on staves, how is the integrated stave approach different? What are the schemes that have been proposed? Common requirements for the active elements How much material or CHF can be saved?.

240 views • 13 slides

The 2003 ITRS Assembly and Packaging Roadmap Joe Adam TWG Co-Chair

263 views • 11 slides

From Compaq, ASP-DAC00

237 views • 11 slides

Assembly and Packaging Joe Adam TWIG Co-chair

Assembly and Packaging Joe Adam TWIG Co-chair. Xavier Baraton Mark Bird - Amkor Bill Bottoms - 3MTS Ken Brown - Intel Chi Shih Chang - K&S Bill Chen - ASE Peter Elenius - K&S Hisao Kasuga - NEC. Ed Fulcher - LSI Logic Ron Gedney - NEMI Seiji Hamano - Fujitsu Mahadevan Iyer - IME

199 views • 9 slides

SPACE PACKAGES OFFERING & ROADMAP

68. MCM. 350/ 08. 350/ 11. Screened die/Flip-Chip. 1000/ 12. Screened die. 350/ 10. Al.N. High Pin Count with Flip-Chip. 900/ 11. 350/ 09. Al.N. CSP with Flip-Chip. 800/ 10. 349. 1.27-1 mm MCGA. 625/ 07. 350/ 09. Al.N. High Pin Count. 800/ 10. 68. MQFP. 352. 18. DIL/FPDIL.

156 views • 1 slides