'Product wafers' diaporamas de présentation

Packaging

Packaging. ECE/ChE 4752: Microelectronics Processing Laboratory. Gary S. May April 8, 2004. Outline. Introduction Test Structures Final Test Package Types Attachment. IC Manufacturing. Manufacturing = process by which raw materials are converted into finished products IC manufacturing:

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Plasma etch control by means of physical plasma parameter measurement with HERCULES

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MPW Design Introduction Course - Module 4

MPW Design Introduction Course - Module 4. Process Description Part II. Tyre pressure sensor (SensoNor). Contents. Process Description, Part I Cross section overview Key process features MPW process step-by-step Process Description, Part II Absolute design limitations

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