'Wire bond' diaporamas de présentation

ECE 546 Lecture 03 Resistance, Capacitance, Inductance

ECE 546 Lecture 03 Resistance, Capacitance, Inductance. Spring 2014. Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu. What is Extraction?.

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CHAPTER 9

CHAPTER 9. Master Figure. Fig. 9.1. Figs. 9.2 a, b, c. (a). (b). (c). Polysilicon bond ring. Getter. Gold. Bond pad. Feedthrough. Figs. 9.3 a, b, c. (a). (b). (c). Figs. 9.4 a, b. (a). (b). Figs. 9.5 a, b. (a). (b). Fig. 9.6. Figs. 9.7 a, b, c. (a). (b). (c).

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The Segmentation Problem

The Segmentation Problem. Segmentation attempts to partition the pixels of an image into groups that strongly correlate with the objects in an image Typically the first step in any automated computer vision application. Image Segmentation.

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Performance Model for Inter-chip Busses Considering Bandwidth and Cost

ISCAS 2005. Performance Model for Inter-chip Busses Considering Bandwidth and Cost. Authors: Brock J. LaMeres University of Colorado, Boulder, CO Sunil P. Khatri Texas A&M University, College Station, TX. Problem : Packaging Limits Performance. IC

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Bridging Theory in Practice

Bridging Theory in Practice. Transferring Technical Knowledge to Practical Applications. Semiconductor Reliability. Semiconductor Reliability. Semiconductor Reliability. Intended Audience: Electrical engineers desiring a brief overview of the various semiconductor reliability tests

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GLAST Large Area Telescope: Silicon-Strip Tracker/Converter Robert P. Johnson U.C. Santa Cruz Tracker Subsystem Manager

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Silicon-Strip Tracker/Converter Robert P. Johnson U.C. Santa Cruz Tracker Subsystem Manager johnson@scipp.ucsc.edu. Silicon-Strip Tracker/Converter. Outline Recommendations from the February review

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Chip Carrier Package as an Alternative for Known Good Die

Chip Carrier Package as an Alternative for Known Good Die. Raymond Kuang . September 08, 2004. Driver for Known Good Die (KGD).

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MRB on SLAC NCR 226 Excess of Disconnected MCM Channels

MRB on SLAC NCR 226 Excess of Disconnected MCM Channels. R.P. Johnson November 9, 2004. 1. Description of Non-Conformance. MCM part number LAT-DS-00898, SN 11378 was found to have 151 channels disconnected between the amplifiers and the pitch adapter.

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Irradiation at IUCF

Irradiation at IUCF. We irradiated 5 chips from Sintef wafer 9 (7,39,42,44,46) at Indiana University Cyclotron Facility on 30th November. Pixel 7,44 and 46 are baseline design. Pixel 42 spiral ring and pixel 39 single ring design.

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MRB on SLAC NCR 226 Excess of Disconnected MCM Channels

MRB on SLAC NCR 226 Excess of Disconnected MCM Channels. R.P. Johnson November 9, 2004. 1. Description of Non-Conformance. MCM part number LAT-DS-00898, SN 11378 was found to have 151 channels disconnected between the amplifiers and the pitch adapter.

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Naming Convention HFT PIXEL

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