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Implementation Review of ER-2 and WB-57 Payload Control Systems at NASA ASF

This document presents a review of the preliminary requirements and design for the ER-2 and WB-57 payload control systems, specifically focusing on the Experimenter Interface Panel (EIP) and NASA Airborne Science Data Acquisition and Transmission (NASDAT) units. It aims to demonstrate the readiness of the Airborne Sensor Facility (ASF) at NASA to advance to detailed design phases. Key components, network requirements, functional block diagrams, and other critical specifications for the EIP and NASDAT systems are provided in detail along with a test plan and schedule.

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Implementation Review of ER-2 and WB-57 Payload Control Systems at NASA ASF

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  1. Payload Control System (NASDAT, EIP) ER-2 and WB-57 Implementation NASA ASF, 9/14/2010

  2. Contents • Introduction • Requirements • Implementation • EIP • NASDAT • Network • Control System • Test Plan • Schedule / Milestones • Conclusions / Action Items • Acronym List (Appendix)

  3. Introduction • This review will… • Cover the preliminary requirements & design for the ER-2 and WB-57 EIP and NASDAT units. • Demonstrate the ASF is ready to proceed with detailed design. • This review will not… • Be a review of the Global Hawk system (it’s different!) • Cover, in any significant detail, payload communications or the InMar-SAT system. ASF – Airborne Sensor Facility @ NASA ARC EIP – Experimenter Interface Panel; an instrument electrical interface. NASDAT – NASAAirborne Science Data Acquisition and Transmission unit

  4. Key Requirements • Level 1 (NASA Airborne Science / HQ): Sensor Web – A distributed and coordinated network of sensors which collectively act as a single “macro- instrument.” (Delin, Sensors Magazine 4/1/2004)

  5. Key Requirements • Level 2/3 (ER-2 & WB-57 Systems):

  6. Requirements (25A x 2 ckts) (79A) (50A x 2 EIPs) (72Ax2 EIPs) (79A) (30A) (30A) DC CURRENT REQUIREMENT: >80A per EIP (2.8kW) AC CURRENT REQUIREMENT: 50A / Ф, per EIP

  7. EIP Implementation EIP Functional Block Diagram:

  8. EIP Implementation • A modular, PCB-based design reduces wiring and simplifies assembly & maintenance w/rt to the Global Hawk version. SSPC Module (4) AC Distribution Module Legacy Module DC Distribution Module Ethernet Module (Monitor Module Not Shown)

  9. Support 5 experiments with 3 ‘Misison Critical’ and 1 (modified) ‘Air Data’ connector(s) Drop to 4 PWR connectors (5 command relays / EIP); EIP Implementation J6-J9 change to D38999/21-16 Provide analysis for 50A/circuit (same connector) Fuse internal circuit internally Replace J13 & J14 with Ethernet; leave aircraft wire in place & use as needed. Ship-side signals (DC, AC, Control input) connectors are unchanged.

  10. EIP Implementation EIP Front Panel: Mission Critical 15A AC/DC & Control 15A AC/DC & Control 2x50A DC Output Control & Data Input Mission Critical Mission Critical 15A AC/DC & Control 15A AC/DC & Control 3Ф AC Input Legacy Output 8x100 Mb Ethernet 4x1Gb Ethernet Adapter harnesses will be available to fold Mission Critical & Control into Legacy Output connectors

  11. EIP Implementation • Legacy EIP Power (Mixed AC/DC) Connector Using 3 #16 DC circuits, 2 with SSPCs @ 17.5A trip, 1 fused @ 10A Tie shields at backshell (TBD) • - GH safety circuit used for command circuit – lose NC contact (except for legacy connector) • GPS splitter designed-in but not installed; GPS socket removed in PWR connector • IRIG-B moved to PWR connector (GH style)

  12. L1/L2/Omnistar GPS (coax) (not provided for WB-57/ER-2) 3Ф, 400Hz AC Circuit #1 (15A/Ф)* 3Ф, 400Hz AC Circuit #2 (15A/Ф)* 28VDC Circuit #1 @ 15A 28VDC Circuit #2 @ 15A IRIG-B (coax) Command Relay (N.O. & COM) @ 10A EIP Implementation • Standard Instrument Power Connector (Amphenol D38999/20WG16SN) • 16 x AWG #16 contacts, same pinout as Global Hawk EIP * - Recommended loading varies per plane & based on SAE50881 analysis

  13. EIP Implementation

  14. EIP Implementation • DC In & Hi-Power Out connectors are same as prior design

  15. EIP Implementation • AC In/Out SAE50881 analysis • Dependent on aircraft wiring more than EIP • Aircraft circuit breakers have high maximum trip: • ER-2/WB-57 historical usage implies greater current ratings than SAE50881 analysis (based on 6TC breakers). • Recommendations: • Caution with high bundle counts & heavy loading • Update analysis with actual ER-2/WB-57 breaker unit data • Incorporate ER-2/WB-57 breakers in EIP environmental tests

  16. EIP Implementation • Modified Legacy Data Connector (page 1 of 2) NEW ASSIGNMENTS: ZJ: INTERLOCK #2 ZM: AIRCRAFT GROUND ZN: ALTITUDE SWITCH #2 N.O. ZP: ALTITUDE SWITCH #2 COM ZQ: LANDING GEAR #2 N.O. ZR: LANDING GEAR #2 COM ZS: FAIL LAMP DRIVE #2 ZT: SPARE

  17. EIP Implementation • Mission Critical / Aircraft Data Connector (page 2 of 2)

  18. EIP Implementation • Mission Critical Connector (Amphenol TVP06RW9-9S) • High-density D38999/III, 9x AWG #23 contacts • Will supply conversion adapters to legacy connector Redundant Interlocks Ground Landing Gear COM N.O. Redundant Fail Drive COM N.O. Altitude Switch

  19. EIP Implementation • Solid State Power Controllers (SSPCs): • DC relay, over-current and arc-fault breaker in 1.5in3 • Trip state, voltage & current monitor • Low power dissipation: • Ron = 6mΩ @ 20A (120mW), no relay coil • Inputs from command relays are opto-isolated on PCB (<20mA/input) • Fails to ‘open’ state • -55ºC to 85ºC operation • Surge tolerant (48V @ 1s, 80V @ 100ms) • Units for power circuits will be permanently ‘CLOSED’ • Status: Rev- PCB received; testing in process

  20. EIP Implementation • DC Monitor Module: • Revised form factor of Global Hawk design • UDP Status Packet Contents: • Voltage & Current for each 15A DC circuit (not for high-power) • Trip status for all SSPCs • Interlock & Fail line status for each payload • (1) External temperature (AD5626) • Humidity • EIP Internal Health Temperatures • Status: Schematic Design • Legacy Module: • Patches Control/Data input to Legacy Output and Mission Critical Connectors • Leverages PCB solder-tail connector technology • Status: Schematic Design Analog Devices AC2626 Temperature Probe

  21. EIP Implementation • AC Distribution PCB (Rev A): • Layer Stackup (0.125” Thick): • Top: Shield • Inner 1-2: Ckts. 1 & 2 ФA • Inner 3: Shield • Inner 4-5: Ckts. 1 & 2 ФB • Inner 6: Shield • Inner 7-8: Ckts. 1 & 2 ФC • Inner 9: Shield • Inner 10: Circuit 1 Neutral • Inner 11: Shield • Inner 12: Circuit 2 Neutral • Bottom: Shield • Layer Spacing: 4.15 mils (min) • Max Electric Field: 120.4 V/mil • FR4 DBV: 1100V/mil • Status: Ready for Fabrication DBV – Dielectric Breakdown Voltage

  22. EIP Implementation • Ethernet Module: Sixnet APSwitch • 8x 100Mbit ports, 4x Gigabit ports • 1x 100Mbit port internal to EIP (use for monitor) • Interconnects: MIL-DTL-38999/III Quadrax • Part #: 25-8 D38999/III (8 quadrax inserts) • Status: Functional & environmental evaluation.

  23. NASDAT Implementation • NASDAT = DC-8 REVEAL + … • Aircraft Data Isolation Card • Isolation for RS-232, ARINC-429, MIL-STD-1553, IRIG-B, RS-422 • Analog Input Isolation Card • L1/L2/OmniStar GPS Support • COTS Enclosure • SIE 714/716 Series in ¾ ATR Short • Improved Thermal Management SIE 714 & 716 ATR Enclosures

  24. NASDAT Implementation NASDAT Functional Block Diagram:

  25. NASDAT Implementation • NASDAT J1: Isolated Inputs • ARINC-429 (4 channels) • MIL-STD-1553 (1 dual-redundant channel) • RS-232 (2 channels) • RS-422 (2 channels) • Analog (8 channels) • GPS antenna (loop-through via internal splitter) • Power 28VDC

  26. NASDAT Implementation • NASDAT J2: Outputs; Configuration • 5 buffered outputs to 4 pair each, selected from: • (Isolated) Inputs: ARINC-429, RS-232, RS-422 • NASDAT-generated: ARINC-429, RS-232, • RS-422, IRIG-B, PPS • 2 full RS-232 for external payload support instruments • 1 full RS-422 for external payload support instruments • Configuration jumpers • KVM • Access to signals is useful for maintenance

  27. NASDAT Implementation NASDAT J3: Ethernet I/O – Quadrax NASDAT J4: USB Disk – attached or remote Amphenol Rugged USB Keys & Box Connectors (mated) Amphenol Rugged USB Keys & Box Connectors (de-mated)

  28. NASDAT Implementation • NASDAT Standard Data Products: • IWG1-formatted 1 Hz Nav/Housekeeping Data • UDP broadcast to aircraft LAN • UDP telemetry to ground • File recorded on-board • NTP, IRIG-B • Instrument status packet telemetry and monitoring • Instrument ad-hoc low-rate C3 UDP telemetry • “Kitchen Sink” file of most available data at 1 Hz • “Dynamics” file of attitude/accels/rates at 20 Hz

  29. NASDAT Implementation • NASDAT Optional Data Products: • Higher rate data • Other formats or parameters easily configurable • Can read or drive external instruments if needed • Can repeat or generate various signals if needed • NASDAT Legacy Data Products • ER-2 Nav Format • ER-2 Time Format • DC-8 ASCII Format • RS-232, ARINC-429, IRIG-B outputs

  30. NASDAT Implementation • NASDAT Internal Sensors: • Cabin Temp • Cabin RH • Cabin Pressure • Input Volts and Amps • Internal Temps • High-Precision GPS Clock • Miniature GPS/IMU • OmniStar-Capable GPS

  31. NASDAT Implementation NASDAT Internal Configuration Options: • SIM cards for the four Iridium modems • Miniature GPS/IMU installed: LandMark20, MIDG-II, None • Omnistar VBS service activated • Dataforth 5B S/C modules for A/D inputs • Software baseline load per aircraft VBS – Virtual Base Station

  32. NASDAT Implementation • NASDAT Front Panel Contents • J1: Inputs • J2: Outputs and per-aircraft configuration • J3: Ethernet • J4: USB • J5, J6, J7, J8: Iridium TNC Coax • Lamps: 5V “CPU” & 28V “Power” • RH probe • Pressure transducer port • Klixon 5A C/B - input power disable • Switch, guarded - Iridium Radio disable • J-hooks for ATR mounting

  33. NASDAT Implementation • NASDAT Back Panel Contents: • Mating bushings for ATR mounting pins • GoreTex vents for pressure EQ • NASDAT Mounting Tray: • Standard ARINC-404A “ATR ¾ Short” • No vibration isolation necessary • May want fan under tray in E-Bay

  34. NASDAT Implementation • Prototype NASDAT Custom Cards: DATAFORTH CARD (Rev A) INPUT/OUTPUT ISOLATION CARD (Rev -)

  35. Network Implementation • Managed mesh w/ RSTP configured as 1G ring has two levels of fault tolerance: • Ring topology has built in redundancy • 1G over Cu = 2 quadrax (break one, down to 100Mbit) Image from Sixnet Ethertrak Software Users Manual RSTP – Rapid Spanning Tree Protocol – allows redundant connections in a managed network

  36. Network Implementation • Network impacts on system: • 1G ring means 4 quadrax / EIP & bulkheads • Cable: Tensolite NF24Q100 • Bulkheads: Amphenol TBD (19-18 pattern) • Ring network requires infrastructure power • 2 sets of 28VDC @ ~0.5A / EIP • Fused internally in each EIP • Spare pins available on control input harness

  37. Network Implementation • Worst-Case 1000BASE-T Cabling: • 2 Ethernet Switches, 4 ER-2 Bulkheads, all Tensolite NF24Q100 + Quadrax • TIA/AIA-568b (CAT6) vs. ER-2 Quadrax: • Conclusion: ER-2 IL meets worst-case CAT6 IL specification IL: Insertion Loss (i.e. attenuation)

  38. Control Implementation • Barebones Implementation (Now) • Low risk: Uses existing switch panel and wiring • Optimized Implementation (Later) • Uses Ethernet for indication and/or control • Requires additional electronics box to translate switches & lamp drives to/from network packets • (WB-57 only) FAIL => FAIL/STATUS • Logic Low: FAIL (red lamp on) • Logic High: RUNNING (red & blue lamps off) • Switching @ TBD kHz: STATUS (blue light on)

  39. Control Implementation BAREBONES OPTIMIZED #1 OPTIMIZED #2

  40. Test Plan • All unique designs will be qualification tested for vibration & thermal / altitude • Test procedures for each major assembly • EIP Test Bench • Developed for GLOPAC EIPs • Automated I/R/C “buzz-out” • Automated monitor calibration • DC & AC generators & loads I/R/C: Isolation / Resistance / Continuity test – finds unintended short or open circuits prior to first power -on

  41. Test Plan Ethernet switch integrated into EIP for WB/ER-2 Will need larger AC load (20kW) Will use 100A in-house TRU, not Champion Unit Need larger AC source; may have to go 60Hz

  42. Test Plan • Vibration – • Qualification Test per DRB 367-1100-121 (TBD) • 7.17grms, 3-axis,1 hour per axis • Fixture modification needed (new bolt pattern) • Thermal Altitude • Worst-case thermal & altitude combinations for pressurized and unpressurized areas • -55C -> 0C @ 70kft • 0C -> 45C @ 30kft • 0C -> 60C (TBD) @ sea level

  43. Test Plan May need to request waiver for infrastructure power cold start (TBD) Considering changing profile & dwell times to match DO-160F approach

  44. Schedule / Milestones • May 2010 – Materials funding issued • September 2010 – PDR • December 2010 – NASDAT Pre-Production • February 2011 – EIP Pre-Production • April 2011 – EIP & NASDAT Production • American Recovery and Reinvestment Act (ARRA) funds expire in June 2011

  45. Conclusion / Actions • The NASDAT, EIP, and associated hardware are ready for detailed design. • Review and record any actions flagged during the presentation.

  46. Payload Control System (NASDAT, EIP) ER-2 and WB-57 Implementation NASA ASF, 9/14/2010

  47. Acronym List • Ω - Ohms • Ф – Phase • 1G – Gigabit Ethernet • A - Amperes • AC – Alternating Current • AIA – Aerospace Industries Association • ASF – Airborne Sensor Facility • ATR – Air Transport Rack • C – Celsius / Centigrade • CAT6 – Category 6 • CPU – Central Processing Unit • DC – Direct Current • EIP – Experimenter Interface Panel • GLOPAC – Global Hawk Pacific • GRIP – Genesis and Rapid Intensification Processes • HQ - Headquarters • Hz – Hertz • IP – Internet Protocol • IRIG – Inter-range Instrumentation Group • IRIG-B – IRIG Code B • I/R/C – Isolation , Resistance, Continuity • k – Kilo (thousand) • kHz - Kilohertz • ms - Millisecond • NASDAT - NASA Airborne Science Data Acquisition and Transmission unit • PDR – Preliminary Design Review • RSTP – Rapid Scanning Tree Protocol • S/C – Signal Conditioning • SAE – Society of Automotive Engineers • SSPC – Solid State Power Controller • SSR – Solid State Relay • TBD – To Be Determined • TCP – Transmission Control Protocol • TIA – Telecommunications Industry Association • uC – Microcontroller • UDP – User Datagram Protocol • uP – Microprocessor • VAC – Volts, AC • VDC – Volts, DC • V – Volts • W - Watts

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