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JWG9 APs

JWG9 APs. AP210: Electronic assembly interconnect and packaging design is published (4515 pages) AP210-TC1 under preparation AP212: Electrotechnical design and installation is published AP220: Printed circuit assembly process planning is on hold (PNWI). AP210 - Technical Corrigendum 1.

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JWG9 APs

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  1. JWG9 APs • AP210: Electronic assembly interconnect and packaging design is published (4515 pages) • AP210-TC1 under preparation • AP212:Electrotechnical design and installation is published • AP220: Printed circuit assembly process planning is on hold (PNWI)

  2. AP210 - Technical Corrigendum 1 • 76 SEDS issues officially registered • Some 30-40 more SEDS are in the preparation queue • A working draft exist. Changes are directly added to the original sources • Question how to publish TC1?A complete new document with the changes listed in the annex may be easier to produce and more readable.

  3. Relationship: AP210 <=> AP233 AP233: System engineering data representation (WG3) A bigger overlap between the two APs identified. => harmonization needed => discussion whether the further development of AP233 may be directly based on AP210.

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