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Efficient PCB Design and Component Selection Using Eagle and TSSOP Packaging

In PCB design, we utilize Eagle for creating LBR, SCH, and BRD files before fabrication. To optimize costs, a 4-layer design is preferred, and we prioritize TSSOP packaging for solderability and availability. TSSOP components, available from DigiKey, are economical and commonly in stock, minimizing wait times. We also create custom libraries in Eagle for components not readily available, following steps to develop symbols, packages, and device connections. This ensures precise specifications and efficient design processes for our projects.

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Efficient PCB Design and Component Selection Using Eagle and TSSOP Packaging

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  1. PCB Team: Prof. Sachin S. Sapatnekar

  2. Layer and Packaging • In our design, we need to use Eagle to make Lbr, Sch, Brd. And then send to the fabrication company to print out the PCB boards. • There are two things that we need to consern: • The cost: in order to be cost efficiency, we use the 4 layer design. • To the concern of solderability and availability, we chose specific packaging format. TSSOP (and so on)

  3. Availability of components • We order most of our components via DigiKey and TSSOP is the most popular type that is cheap and much storage in stock that we can avoid of waiting for components. • Fig 1. the DC step-up IC we chose (from Digi-Key)

  4. 8 – TSSOP specifications • According to the Datasheet, we can Specify the foot- Print in Eagle Precisely Fig 2. Devise dimention From the datasheet from Fairchildsemi.com

  5. One lbr • The eagle doesn’t have all the IC and components that we use, so we need to create the lbr. • There are three steps to make a lbr: 1. symbol 2. package 3. connect them to make device

  6. One lbr • Here is a procedure to make an IC lbr:

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