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Explore the thermal analysis of copper bonds for inner leg cooling in high-temperature environments, investigating stress levels and potential overheating concerns up to 164°C. Determine if the copper bond can withstand the thermal stress.
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85%IACS for upper flag: max temp is 116 C TF inner leg cooling analysis 60%IACS for upper flag: max temp is 116.978C Cooling line in the middle
Temperature after a pulse (K) max temp is 164C 115.6C Is it too high for the Cu bond?