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Copper Bond Temperature Analysis for Inner Leg Cooling in High-Temperature Applications

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Explore the thermal analysis of copper bonds for inner leg cooling in high-temperature environments, investigating stress levels and potential overheating concerns up to 164°C. Determine if the copper bond can withstand the thermal stress.

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Copper Bond Temperature Analysis for Inner Leg Cooling in High-Temperature Applications

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Presentation Transcript

  1. 85%IACS for upper flag: max temp is 116 C TF inner leg cooling analysis 60%IACS for upper flag: max temp is 116.978C Cooling line in the middle

  2. Temperature after a pulse (K) max temp is 164C 115.6C Is it too high for the Cu bond?

  3. TF inner leg bond Sz: 68.6MPa (9.95ksi)

  4. Flag stress after a pulse (165MPa, 23.9ksi)

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