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New Geometry for BeamCal: Advancements in Sensor and Absorber Design

In the LCD Weekly Meeting on May 4, 2010, André Sailer presented new geometry developments for BeamCal. The updated design features a cut through the XZ plane showing changes in the shape of absorber plates featuring tungsten layers filled in areas between beam pipes. New cylindrical cutouts in graphite and changes in PairMonitor materials to silicon are highlighted. Key parameters like inner and outer radius, layer number, and absorber thickness are adjustable. The updated configuration enhances sensor functionality while maintaining the original geometry's integrity.

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New Geometry for BeamCal: Advancements in Sensor and Absorber Design

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  1. New Driver/Geometry for BeamCal André Sailer LCD Weekly Meeting May 4, 2010

  2. Old and New BeamCal • IP BeamCal cut through XZ plane, • Only difference shape of absorber plates

  3. New Geometry • Filled area between beam pipes with tungsten layers • All layers the same, rectangular cut out • 2nd Cylindrical cutout in Graphite (+PairMonitor) • PairMonitor Material now Silicon • Sensor geometry unchanged (“keyhole”)

  4. New Feature • Changeable parameters • Inner & outer Radius, • number of layers • PairMonitor on/off • thickness of absorber • graphite thickness • beamcal position • Padsize

  5. BeamCal Layer • One Layer consists of • Absorber 3.5 mm Tungsten • Sensor 0.3004 mm Diamond • Electric Metallization 0.0004 mm Gold • PCB 0.15 mm Kapton • Air gap 0.05 mm

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