Particles and Fields Package Quarterly Status Review (QSR) April 19, 2011 - PowerPoint PPT Presentation

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Particles and Fields Package Quarterly Status Review (QSR) April 19, 2011 PowerPoint Presentation
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Particles and Fields Package Quarterly Status Review (QSR) April 19, 2011
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Particles and Fields Package Quarterly Status Review (QSR) April 19, 2011

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  1. Particles and Fields Package Quarterly Status Review (QSR) April 19, 2011 Dave Curtis, PFP PM

  2. SSL Contracting Status Funded through the end of April More info in the Business Splinter presentation

  3. Schedule Status EMs have made a lot of progress this month All EM PWBs in test but ~2 (HVPS boards, in fab) SEP, LPW, SWEA, MAG EM mechanical assembly complete STATIC EM TDC complete random vibe SWIA/STATIC analyzers parts out to fab EM Package I&T in progress LPW, SEP, SWEA test with PFDPU complete EM ‘Early Payload Test’ with LM complete MAG next week Pushing to complete before CDR EM Instrument calibrations don’t complete till after Package I&T STATIC is on critical path 13.6 weeks margin to delivery Driven be delays in EM I&T Status at instrument CDR SWIA, STATIC EM will not be complete SWIA, STATIC attenuator life test not done SWIA, STATIC power converters may still be in test Rest of instrument EM will be complete, with perhaps some system level test still in progress

  4. Manpower • RBSP-EFW instrument still not delivered – this month? • A number of problems encountered in thermal vacuum • Resolving those problems have impacted MAVEN power converter team, delayed STATIC & SWIA • We are still under planned FTE rate • but climbing a bit • Mostly due to people splitting time between projects • Note that 100% activity is often more than 40 hours/week in these cases • Plan was based on conservative assumptions about covering people

  5. Accomplishments LPW, SEP, SWEA EM integrated with PFDPU EM PFDPU EM Early Payload test with Spacecraft EM SWEA Peer Review Completed STATIC Random Vibration Completed SEP Attenuator Life Test Completed More in instrument sections…

  6. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SDT working groups Completing EM board testing Completing SWIA/STATIC EM mechanical part fabrication Complete PF Package EM I&T Prepare for CDR

  7. EM Status

  8. PFP RFA Status All Done!

  9. Trades, Issues HV801 issue still open Current plan is to buy HV801s from LADEE NMS, who has parts on order they no longer need. We still don’t have the parts in hand Working on an analysis to decide if the PFDPU mechanical design needs to be augmented to support the PWBs to avoid excessive displacements in vibe Analysis complete, passed on to GSFC expert for review. LPW Stacer Plating issue (NEW) After plating stacer with black Nickel it no longer stows properly Need plating for thermal reasons (aeroheating, thruster heating) Historically we have used a paint (DAG213), but that will not survive atomic oxygen at Mars Working with GSFC Materials on possible solutions

  10. Thermal Status Received ‘Thermal Memos’ as well as spacecraft thermal model Some of the instruments are in trouble according to the thermal memo For example, STATIC goes to -100C We are working on identifying if the issue is the model or the design Our preliminary results are more benign

  11. Top Risks P-20 reduced (mating procedure)

  12. Risks List

  13. PFP Mass CCR262 approved to reallocate NTE amongst PFP

  14. Mass Tracking Chart

  15. PFP Power Small increase in MAG power Small decrease in SWEA power.

  16. PFP Power Trend

  17. PFP Data Rate Per 2009-6-9 allocations from Bruce New MAG requirements on telemetry formatting puts MAG 4% over allocation

  18. Requirements Verification Status CCR (265) to update PFP Functional Requirements (Level 3) approved some old requirements need updating Verification matrix mostly complete Have Functional, ERD, ICD requirements complete, in review Boot software verification has started against software level 5 requirements, which link back to FRD and ICD. STATIC TOF EM Acoustics and Vibration test complete All but coarsest grid with thinnest foils passed Will not use coarsest grids Will repeat on full EM and FM EM Interface tests started Reduces risk, not a qualification test SEP Attenuator Mechanism Life Test complete

  19. Life Testing SEP Attenuator life test complete 4100 cycles on EM twice expected life ~1000 in air, ~3000 in vacuum Will collect some more cycles over the next few months SWIA, STATIC attenuator life test pending completion of EM attenuator ~June SWEA door mechanism identical to STEREO SWEA, STATIC door mechanism functional, life test pending LPW relay life test expected to start soon LPW deployment life test expected to start soon Stacer coating problem holding that up

  20. MAVEN Magnetometer Status April 2011 Connerney, Sheppard, Schnurr, Oliversen, Espley, etc.

  21. GSFC/MAG - Accomplishments Last Month EM sensor assembly, pigtail, GSE sensor harness completed. Breakout PWBs fabrication completed. Draft MAG Flight Software Requirements Specification (for PFDPU). Completed Safe-to-Mate procedures for MAD board (MAVEN-MAG-PROC-0026). Completed EM Magnetometer board scale factors calibration at GSFC 22’ MAG Test Site; scale factor resistors installed on board. FPGA (rev 0) burned at Aeroflex, received and installed on MAD board. Functional testing in progress. GSE (UCB emulator) development continues; CMD and TLM successfully flowing between GSE and MAD board. Sensor non-magnetic heaters design received from vendor (Tayco), under review. Frames for MAD board and ACHE board fabricated at GSFC; boards installed in frames (see pix).

  22. GSFC/MAG - Accomplishments Last Month MAG Analog and Digital (MAD) Board & frame A/C Heater Electronics (ACHE) Board in frame ->

  23. GSFC/MAG Near Term Plans & Open Issues Mature MAG software requirements draft w/UCB. Hypertronics KPC120 connectors installation and mating issues. Radiation test plan for MIL spec CD4066 quad bilateral switches completed; testing scheduled to begin April 18, 2011. Integration and test of MAG (MAD board and sensor) w/ PFDPU at UCB scheduled April 26-28, 2011. MAD board frame modifications (test connector placement, mechanical mod for center board support) pending final approval. Continue winding FM sensor ring cores, feedback/sense bobbins, and magnetic piece parts per technician availability; fabricate sensor assembly terminal boards. Draft worst case analysis of MAD board. MAG Peer Review scheduled for May 5, 2011 @ GSFC. Workload: RBSP FM post-environmental test evaluation drags on; Juno FM system integration work in progress @ Astrotech, KSC.

  24. MAVEN PFP SWIA Status April 2011 Jasper Halekas, SWIA Lead

  25. SWIA Progress • Electrical Progress • Anode and digital boards tested • Preamp/MCP loaded on preamp half • Preamp half integrated and in testing with digital • MCP half delayed by RBSP • LVPS mostly loaded, waiting for testing, delayed by RBSP • Sweep in testing • Mechanical Progress • E-Box fabricated and assembled • Analyzer in progress • Many major parts already out for fabrication • Final drawings being finished up • Detector Progress • MCPs in testing • Early results using spare THEMIS plates indicate anode board working nominally

  26. SWIA EM Electronics & Chassis

  27. SWIA Issues • Staffing/Schedule • More RBSP delays hurting mechanical and power supplies • Mechanical parts may not all be done in time for peer reviews • Power supplies waiting for loading and testing

  28. SWIA Test Data • Anode counts from integrated test pulser correctly counted • P0, P1, P2 data products correctly generated by FPGA Pseudo Data Products Test pulser output divided by four ratios, sent to alternating anodes 13 15 17 19 21 23 3-d Sky Plot 18 16 14 22 20 24 1 3 6 8 10 12 2 4 5 7 9 11 Energy Spectra

  29. MAVEN PFP SWEA Status April 2011 Dave Mitchell, SWEA Lead

  30. SWEA Status – IRAP (CESR) • Mechanical • Plating of external parts (Black-Ni, Gold, Alodyne) at Anoplate in New York. • Most parts delivered to SSL on 4/5 and passed magnetic screening (< 3 nT at 1 cm before and after exposure to >10-Gauss magnetizing field) • Black-Ni/Gold parts (lower deflector and interface tube) are delayed (expected 4/25)  Mechanical assembly at IRAP delayed ~3 weeks • Electrical: Amp, HV coupling, and HVPS boards assembled at Microtec – expecting delivery at IRAP on 4/19, then functional testing can begin. • AIT: Facilities in large clean room are in progress as scheduled (installed rolling table and tools, vacuum chamber expected week of 4/18)  on schedule for AIT 10 cm upper deflector toroidal grid top cover SWEA parts plated with high-P electroless black-Ni Magnetic screening station at SSL

  31. SWEA Status, EM - SSL • Mechanical: No change from last month: Pedestal fabrication and test fitting complete, ready to assemble when boards available • LVPC: Some voltages not within spec, and one exhibits and oscillation. Board will be reworked (~2-3 weeks). • Digital: • Fab complete and tested. • Housekeeping and Data messages from FPGA verified. • Test pulser demonstrates that counters working as expected. • Integration with PFDPU EM and functional tests on 4/13 successful SWEA Electronics I&T Digital STEREO SWEA EM front-end boards LVPS

  32. MAVEN PFP STATIC Status April 2011 Jim McFadden, STATIC Lead

  33. STATIC Accomplishments Carbon foils mounted in TOF units survive vibration test – automated software used to evaluate foil breakage Ordered carbon foils on mica slides to improve mounting yield The design of START foil grid-frames was modified to compensate for poor clamping due to fabrication tolerances - new grid-frames ordered. Design of attenuator motor completed, drawings for ETU in process Energy analyzer/deflector parts drafted and ordered EM TDC board bench testing complete, part modifications made EM preamp 1 modified and working adequately for integration w/ TDC board – will be used while optimized preamp board is developed EM Anode, Preamp and TDC boards integrated – working EM Digital board passed power and PFDPU simulator interface testing, ready for interface test with TDC EM Sweep HV board partly loaded and in test (see pictures) Clean room equipment installed – racks, SS table, GN2 purge, etc. Helmholtz coil template fabricated, waiting on welding before assembly

  34. STATIC EM Sweep HV Board

  35. STATIC Open Issues One of two TOF electrical connections broke in 1 of the 3 units during vibration test (see pics) – connection redesigned for stress relief Mounting fixtures for handling flight carbon foil frames need to be fabricated before additional EM carbon foils are loaded New START foil grid-frames will require inspections after fabrication Preamp design changes nearly complete for optimal dynamic range – may require new layout EM 15kV-MCP board changed, MCP “stack stick” multiplier abandoned in favor of a pair of VMI multipliers and a tapped transformer – EM waiting on part placement changes (Berg). Digital board FPGA still in development EM LVPS loaded – waiting to be tested Manipulator fixtures for calibration chamber testing in development Some test harnesses and test cables still on order New calibration chamber ordered – delivery late May SS sink for clean room assembled – waiting for drain assembly

  36. STATIC EM TOF Post Vib Disassembly

  37. Post-vib broken electrical connection

  38. Post-vib broken electrical connection

  39. MAVEN PFP SEP Status April, 2011 Davin Larson, SEP Lead

  40. SEP Accomplishments2011-04-12 Mechanical attenuator tests completed ~4500 cycles completed (all but ~1000 in vacuum) Integration of DAP board (& ½ sensor sans detectors) with PFDPU begun on 2011-04-11 Safe to mate –ok Initial power on - ok but receiving +6V and -6.3 volts instead of nominal +/- 5V Command test – ok Successfully turned on test pulser Bias voltage setting not working (not yet functional on DAP? Telemetry tests – ok Successful run of ‘SEP_DAPINIT’ Unbalanced analog voltages result in offset from baseline Successful run of “SEP_THRESH_SWEEP” Successful run of “SEP_TPSWEEP” Some cross talk visable that was not seen with MISG Noise level is substantially larger and assymetric Timing Tests – skipped SEP Aperture tests – ok SEP auto aperture closure – problem on REG SEP power inrush current test - OK ETU Silicon detectors (1 stack) delivered on 2011-04-12. DAP board 3 channels loaded on DAP #1 12 channels loaded on DAP #2 Actel programming: Using FPGA version 0x32

  41. SEP PFDPU Interface Test Data Increased noise (and asymmetric) Data collected through PFDPU in APID 30 Dropouts? Cross talk?

  42. Attenuator life test Life tests were done on 3 separate days. TCP/IP connection from computer to MISG was unreliable. Difference in actuation time is probably temperature related.

  43. Attenuator Stroke vs. bus voltage Tested the range of bus voltages that would cause actuation. Below 22 V (2.08 V across nanomuscle), actuation failed in air.

  44. SEP Open issues What voltage to use for +/- 5VA supply. Analog supply NOT currently regulated Need secondary regulation for A250? Eliminate requirement of 5V Digital altogether Mods needed for flight DAP board: Use faster transisters on pulse generator (fixes 3.3 volt logic problem) Use 2.5V reference instead of 5VA for baseline trim Use Valid signal for hysteresis on peak detect Gain change on peak detect circuit (perhaps not needed now) Switch from 10 MΩ to 1MΩ resister on bias voltage control 5 MΩ resistor to -5VA (-2.5R?) to correct for OpAmp input current (this mod is questionable if BLRena mode is working properly) Sensor Add detectors!!!! Insert caps on attenuator lines to clean up some noise FPGA Mods from version 0x32 Eliminate secondary pulse by applying BLRena for 6 μsec on test pulse return Extend test pulse duration from 10 μsec to 20 μsec 16 bit counters on no peak counters Ability to turn off housekeeping measurement Event mode resolution Testing: Purchase new nimbin and test pulser to replace AWOL test pulser Test for correct coincidence determination with FPGA New radiation source PFDPU testing Cross talk observed in PFDPU but not MISG? Increased Noise observed in PFDPU (probably resolved with shield boards) Telemetry dropouts from PFDPU science packets Possible change in opto coupler wiring of actuator control on DCB to eliminate any possibility of noise Baseline shift at high count rates – (probably not an issue) 1 mv shift in baseline shortly after the 1 pps signal More to come

  45. MAVEN PFP DCB, Power Converter & GSE Status April 2011 Dorothy Gordon Timothy Quinn Peter Berg Chris Tiu

  46. PFDPU/DCB Status PFDPU Overall Integration DCB/REG Functional and electrical verification ongoing Actuator Control, Housekeeping, Instrument Current Monitoring DCB/REG/IIB Verified LPW signal routing through IIB and Low Voltage Power Supply DCB/REG/IIB/LPW (see next page) Upcoming PFDPU integration tests Remaining power services and signal routing to be checked on a per instrument basis

  47. PFDPU/DCB Status (2) DCB/REG/IIB/LPW Tested/Verified Power-switch, current monitoring on REG Operation of LPW via the Supplies IIB LVPS LPW/DCB Interaction via serial interface Operation of the EUV Door Actuator LPW Data analyzed for noise and anomalies 10 Hz – 4Vpk-pk 1KHz – 4Vpk-pk 100KHz – 4Vpk-pk

  48. PFDPU/DCB Status (3) PFDPU – S/C Interface Test DCB/REG Verification at Lockheed-Martin Integrated power subsystem Inrush current characterized Tested S/C Discrete commands and Side Select Reset, TIME commands verified Operated PFDPU with the Lockheed-Martin Spacecraft Emulator Verified signal protocol of RS422 command and telemetry interfaces Operation with Flight Software – sent a variety of packets in order to work through the checksum generation algorithm. FSW is working this issue with Lockheed-Martin.

  49. DCB Status DCB ETU Build DCB ETU #2 Build complete Delivered (along with FLASH FPGA daughter board) Short on main DCB power supply (3.3V) Problem needs to be identified and fixed DCB FPGA Changes added to support the S/C interface modifications Functional design is complete; undergoing life-test with flight software and PFDPU Integration

  50. GSE Hardware Status MISG Instrument Simulator First cut operational instrument simulator delivered uses the MISG-FPGA Block RAM Implements the final Instrument Mode functionality covers all 8 Instrument Interfaces with a subset of the final pattern generator buffer space Next Steps Use MISG based SDRAM for Instrument Pattern storage (allowing for increased buffer space) Incorporate new modules into next MISG-FPGA release