Sample SlidesAdvanced Animations, Transitions, Graphics & Complex Information Slides for High Technology Topics(Originated from several presentations.) Reed Crouch
Company-Specified Projects Multifunction Testbeds New PRC Research Strategy Consortia Projects – Fundamental Research
DIRECTOR: Prof. Rao R. Tummala DEPUTY DIRECTOR: Prof. Madhavan Swaminathan ADMINISTRATIVE Lauren HallMary Ellen Mount INFRASTRUCTURE Dean SutterMike Toole FINANCIAL & INDUSTRYRELATIONS Carl RustMary Ellen MountJudy Lorier, Tina Crouch MARKETING Reed CrouchCarl RustLauren Hall RESEARCH RF SOP Manos Tentzeris OPTO SOP G.K. Chang WLP&A SOP C.P. Wong Multi-FunctioSOP DESIGN MadhavanSwaminathan NANO & Bio SENSOR Z.L. Wang &Farrokh Ayazi FABRICATION Rao Tummala MULTIFUNCTION Venky Sundaram 3D SOP Chong Yoon
FACULTY LEADER FACULTY PM FACULTY LEADER LEADER MSDT EMAP TIM ETFT PM FACULTY LEADER FACULTY LEADER FACULTY LEADER LEADER PM PM NANOPACK PRC Faculty & Research StaffSpring 2007 RF SOP SOP Integration, Assembly & Reliability Design & Test SOP @ GT-PRC Opto SOP Materials Nano-Bio SOP
Dean Sutter Associate Director, Infrastructure Labs, Equipment, Support Reed Crouch Communications Coordinator Mass Communications, Website, Publications, Graphics Infrastructure Mike Toole Lab Technician Maintenance, Testing, Calibration Lauren Hall Mgr. Admin. & Operations Newsletters, Promotional Marketing Carl Rust Associate Director, Industry Open Houses, Industry Meetings Lauren Hall Mgr. Administration & Operations Scheduling, Events, Travel PRC Administration Mary Ellen Mount Administrative Coordinator Special Projects, Planning, Support Leyla Conrad Associate Director, Education Courses, Programs, Students Swapan Bhattacharya Research Scientist DBO-1 & Nano Bio Workshop Education & Conferences Judy Lorier Accounting Manager Budgets, Reports, Projects Ravi Doraiswami Research Engineer DBO-2 Industry Relations & Financial Tina Crouch Accountant Budgets, Reports Mahesh Varadarajan Research Engineer SOP Textbook Mary Ellen Mount Administrative Coordinator Special Projects, Planning, Support Carl Rust Associate Director, Industry Relations & Financial Industry Partnerships, International Collaborations, Financial Boyd Wiedenman Research Engineer 3S Workshop Admin Operations
MATERIALS THERMAL & DESIGN & TEST MECHANICAL Center Leadership INTER-CONNECTS ProcessStaff Admin Staff Si Organics NANO BIOELECTRONICS SUBSTRATE Core Technologies & Teams Extended Faculty Team Core Technologies Core Teams
Europe Korea ATOTECH AT&S BOSCH EPCOS INFINEON NXP SEMICONDUCTORS HYNIX LG ELECTRONICS SAMSUNG TECHWIN Japan U.S.A. DISCO IBIDEN NGK-NTK OAK-MITSUI PANASONIC SONY India APPLIED MATERIALS BREWER SCIENCE CELESTICA CHOMERICS DOW CHEMICAL DOW CORNING DRAPER LABORATORY DUPONT ENDICOTT INTERCONNECT GENERAL ELECTRIC HONEYWELL IBM INDIUM INTEL JACKET MICRO DEVICES LORD MAXTEK MEDTRONIC QUALCOMM ROCKWELL COLLINS ROGERS CORP. ROHM & HAAS SONOSCAN STARFIRE SYSTEMS TEXAS INSTRUMENTS SAMEER A Global Center
INDUSTRY COLLABORATION 5 6 7 4 8 3 9 2 10 1 OVERALL Global Partnership Membership $$ Tech Transfer Self-Sufficiency Summary, rationale, contributors, benchmarks, tests, studies, results, etc. 1 2 3 4 5 6 7 8 9 10 Summary, rationale, contributors, benchmarks, tests, studies, results, etc. 1 2 3 4 5 6 7 8 9 10 Summary, rationale, contributors, benchmarks, tests, studies, results, etc. 1 2 3 4 5 6 7 8 9 10 Summary, rationale, contributors, benchmarks, tests, studies, results, etc. 1 2 3 4 5 6 7 8 9 10
Global Models for Competitiveness • 10 centers • 2 firms • 4 government offices • 2 centers China Korea Belgium • 9 centers • 1 firm • 1 government office • 7 centers • 1 patent office Japan • 8 centers • 5 government offices • 1 other Germany • 6 centers • 7 government offices UK
Ultimate System Attributes • Thermal • structures & • Interfaces • Nano • Batteries System Interconnections • Supply Chain • for Infra- • structure System EDA Tools EmbeddedThinfilm Components • TSV-enabled stacked ICs & Packages Si package Replacing organic package
NANO-BIO-SENSORS SYSTEM-IN-PACKAGE(SIP) THERMAL SOP PD/TIA GaAs MEMS Nanoscaled Interconnects Thinfilm Build-up Dielectric Ultra-fine pitch wiring & vias Core SOP Animation OPTOELECTRONIC SOP RF SOP DIGITAL SOP ULTRA HIGH DENSITY I/O INTERFACE
Industry Role Industry Role 25% Academic Role 15% Academic Role Products Product Development Technology Development Research Competitive Pre-Competitive 2 Years 3-5 Years 3 Years Open Innovation is Key to Global Competitiveness
} DESIGN TSV STACK BOND SIPACKAGE SIMODULE 3D ASSM } TSV • DESIGN • M&P • BONDING SILICON PACKAGE • DIELECTRIC • CONDUCTOR • SI CORE ALL EMBEDDED ACTIVES & PASSIVES • EMBEDDED COMPONENTS • BGA CONNECTOR • 2ND LEVEL SMT SYSTEM INTERCONNECTION Integration Research
$15M $10M $10M $2.6M PRC Costs $2.0M $2.0M $1.6M GT Contributions $1.3M $1M 5-Year Post-ERC Era PRC FY12 and Beyond NSF ERC Era PRC Finances & GT Support Req’d Note: Includes In-kind Services, Equip, $ Materials
Personal Health & Safety • Education – NEEDS – Economic Growth • Multiple Use Technology G L O B A L L Y S H A R E D V I S I O N WIRING, DIELECTRICS, FLUIDICS PHOTONICS RF INTERCONNECTS BATTERIES & THERMAL BIO-SENSORS SYSTEMS & ENABLING TECHNOLOGIES MOLECULAR MANIPUL. COMPUTER POWER CHEMISTRY ADVANCES BIOMEDICAL ADVANCES COMMUNICATIONS MATERIALS ADVANCES N S E C M A N A G E M E N TVISION • FOCUS • PR • COLLABORATION• EDUCATION • ADMINISTRATION • PERSONNEL N S E C IN F R A S T R U C T U R ESHARED FACILITIES • C O L L A B O R A T I O NNATIONAL • INTERNATIONAL RESEARCH CONCEPT DEVELOPMENT SCIENCE & ENGINEERING LABS & FACILITIES NANO PROCESS DEVELOPMENT NANO MANUFACTURING DEVELOPMENT EDUCATION • PRE-COLLEGE • UNIVERSITIES: GRADUATE, UNDERGRAD • INDUSTRY • OUTREACH: • INTERDISCIPLINARY FELLOWSHIPS • INDUSTRY • INT’L PARTNERS • MINORITIES • VIRTUAL ENVIRONMENT • NATIONAL ACADEMIC PARTNERS • OTHER INT. NETWORK COMMS CANCER DETECTION INDUSTRY Industry • Academia – END USERS – Further Research
