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Bump-Bonding/Thinning

Bump-Bonding/Thinning. Contact, possible collaboration, Simon Kwan FNAL, BTEV Developing plan 2003 small scale participation, learning curve 2004 trials of leading candidates for phenix chips who is interested, CO, others? Two leading companies

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Bump-Bonding/Thinning

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  1. Bump-Bonding/Thinning • Contact, possible collaboration, Simon Kwan FNAL, BTEV • Developing plan • 2003 small scale participation, learning curve • 2004 trials of leading candidates for phenix chips • who is interested, CO, others? • Two leading companies • MCNC (Development) / Unitive (commercial) Nth. Car. • bump-first then thin • so far no success • AIT Advanced Interconnect Technologies (Hong Kong) • thin first then bump • success with 150micron 4” wafers Craig Ogilvie

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