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Material Estimates and Radiation Plans for Stave Modules

This document provides estimates for material percentages and radiation length for various stave modules. Includes calculations for CMOS sensors and dead area considerations.

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Material Estimates and Radiation Plans for Stave Modules

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  1. Material and Dead Region Material Estimates Plans on how to proceed

  2. Radiation Length • Current radiation length of a stave • Cores (including tapes): 0.72% • 2 Planar Modules: 1.08% • Total: 1.8% • For CMOS assume no additional material in carrier • Drop-in Stereo and Z-Encoded (100 micron thick sensors): • 1 Drop-in Module: 0.31% • Total: 1.03% • Embedded (100 micron thick sensors + hybrid width reduced by ASIC size): • 1 Embedded Module: 0.25% • Total: 0.97% It is possible that core can be reduced with CMOS sensors Most of material improvement made with going to single modules with 2d information

  3. Dead Area • One question is efficiency of CMOS • Can start with inactive areas which are not in overlaps • Space between reticles • Inactive edges of reticles next to edge • I have no idea what these can be • Estimates given where roughly ~80-120 mm at edge of reticles and ~80-120 mm between reticles • NEED TO FIRM UP THIS ESTIMATE • From our presentation at the CMOS TF meeting, Tim Jones came up with the following sketch of reticle From Tim Jones

  4. Dead Area • Similarly for module Dead Areas From Tim Jones

  5. Basic Calculations Planar sensors in a similar calculation would be ~1.2% inactive

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