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Design

Design. Ash finished electric hybrid tracing to connector fields Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation of HCC footprint Should come next week Power board work by Sam continuing Toroidal DC-DC and pararrel power boards ready for submission

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Design

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  1. Design • Ash finished electric hybrid tracing to connector fields • Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation of HCC footprint • Should come next week • Power board work by Sam continuing • Toroidal DC-DC and pararrel power boards ready for submission • Flat coil next on list • SP board (with SPP) needs details from Mitch

  2. Assembly Results So Far • Very positive results in gluing ASIC to hybrids and hybrids-to-sensor • One solid row of epoxy under ABC130, one dotted row under thermistor, HCC and hybrid-to-tape bonds • ~50% epoxy coverage with 100-120 mm thickness • Performed pickup trials with ABC130. • No visible marking under microscope Slide 2

  3. Minor Jig Issues Glue Stencil Chip Pickup Tool ABC130 Chip Pickup Tool Hybrid Sensor Epolite • All worked as well as expected but: • ASIC glue stencil tended to rock on single ASIC column, pumping too much glue onto ASIC • Epolite (sensor-to-hybrid) epoxy tended to push AWAY the hybrid from the sensors • Previously we were worried that the glue would pull the hybrid TOWARDS the sensors • Expect that skimming glue onto back of hybrid with stencil would also bend hybrid and pump extra glue between stencil and hybrid Slide 3

  4. Chip Stencil Fix Glue Stencil Chip Pickup Tool ABC130 Plastic Bar • Glue a plastic bar onto chip stencil which will touch the chip pickup tool • This has been trialled successfully with 3 pickup tools and two stencils Slide 4

  5. Chip Pickup Tool Fix Plastic Bar Epolite Chip Pickup Tool Hybrid Sensor Bar would locate in the two dowel holes and the additional slot • We want to put a removable bars on chip pickup tool to push on outside of hybrid • Under design and prototyping now • Will add a groove into chip pickup tool to locate and hold bar • Needs to avoid HCC region for both types of hybrids Slide 5

  6. Assembly Future Plans (I) Stencil would be for one hybrid (this shows paper stencil onto sensor for two hybrids • Once pickup tool bar shown to stabilize unsupported hybrid will make metal stencil to screen Epolite onto back of hybrid • Without bar, epoxy will pump between stencil and hybrid, binding hybrid to it. Slide 6

  7. Assembly Future Plans (II) • One of the reasons to change the hybrid pickup tool face to anodized AL is improve the uniformity and stability • Ideally, all tools will be “identical” and therefore interchangeable • In current ABC250 tooling, the same tool has to be used for gluing ASICs-to-hybrids and hybrids-to-sensors • We plan to test this in the next set of hybrid and module assemblies • Will exchange the tooling between ASIC and hybrid gluing • As first test of this, we can exchange jigs after ASIC gluing and curing and the vacuum does not leak and the tool legs all touch Slide 7

  8. Bonding Experience • So far, so good • Not complaints from anyone • Every attempt successful • ~>6 chip cards, 5 hybrids, 1 modules • Much easier than 250 nm (both hybrid and module) • Biggest unexplored issue is the best bonding parameters for the ABC130 metal • Much softer/thicker than ABC25 (more like FEI4) • First chip on boards bonded ok and systematic studies started at Liverpool Slide 8

  9. Jigs Distribution Plans • A set of jigs to do one hybrid sent to Birmingham already to continue accelerated silver epoxy curing studies • Hope to have a jig sets for Cambridge, Glasgow, UCSC, and LBL for hybrids for end of February or beginning of March • ASIC glue stencil, ASIC trays, pickup tools, 8 way jig and module assembly tools from Liverpool • Only one pickup tool per site until bar for pickup tool understood • Module testing plates from LBL • Other 2-3 pickup tools per site and module glue stencil will follow with successful module trialling Slide 9

  10. Component Distribution/Status TM hybrids from Stevenage Mechanical Sensor from HPK Is there an interest in the community for another AL glass ABC130 submission? Glass ASICs from CNM • Orders of 10 panels (2 per site) due back this week (will be before end of February • Plenty (~150) glass and (~100) mechanical sensors • More plain glass ASICs need to be diced (~500-1000); starting at Glasgow • Only component we could be short of is patterned AL glass ABC130s from CNM • Needed for both hybrid and module bonding trials Slide 10

  11. Wish list • We would want a spectrum analyser for power board work (£3.5k) • Might be able to borrow the B180 unit • For submissions, we will need: • £5k for electrical hybrids (40) • £~1k for power board submissions, frames, aux. boards, etc. • £~2k for AL patterned ASICs • We assume next mech and elecrical hybrid submission would get billed after Q1 2014

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