1 / 15

VCSEL Fabrication Processing

VCSEL Fabrication Processing. The following is pictorial description of the fabrication process for oxidized VCSELs. A detailed description of each step is contained in “VCSEL Fab Details.ppt” This work was performed in Micro and Nanotechnology Laboratory at the University of Illinois

angelina
Télécharger la présentation

VCSEL Fabrication Processing

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. VCSEL Fabrication Processing The following is pictorial description of the fabrication process for oxidized VCSELs. A detailed description of each step is contained in “VCSEL Fab Details.ppt” This work was performed in Micro and Nanotechnology Laboratory at the University of Illinois by members of the Photonic Device Research Group

  2. VCSEL fabrication – Bare wafer Cleave Label substrate backside Clean

  3. VCSEL fabrication – Backside contact Target: 40 nm AuGe / 20 nm Ni / 150 nm Au

  4. VCSEL fabrication – Spin PR Degrease /N2 dry /Dehydration bake HMDS (can spin-on or vapor prime) Spin on photoresist (usually 4330)

  5. VCSEL fabrication – Top contact lithography 4330 lithography

  6. VCSEL fabrication – Metal deposition O2 Plasma (300W – 3 min) 1:10 NH4OH:DI dip (15 sec) Flowing DI rinse (10 min) N2 dry, inspect, load, evaporate Target: 15 nm Ti / 150 nm Au Photonic Device Research Group

  7. VCSEL fabrication – Liftoff Acetone soak ~5 min / Squirt gun

  8. VCSEL fabrication – SiO2 deposition Degrease, N2 dry load, deposit dielectric > 400 nm thickness (based on color)

  9. VCSEL fabrication – SiO2 pattern Degrease /N2 dry /Dehydration bake HMDS vapor prime Spin on AZ5214 Hardbake (110° C for 60 sec) Patern & develop

  10. VCSEL fabrication – CF4 RIE etch Freon 14 (CF4) for > 400 nm (22 min) Remove PR mask with acetone

  11. VCSEL – SiCl4 ICP-RIE mesa etch Clean ICP (O2 process – 15 min) ICP predep (SiCl4 recipe – 10 min) Etch > 5 mirror pair into bottom DBR To be replaced by Semigroup RIE

  12. VCSEL fabrication – Selective oxidation Oxidation rate from test piece Use optical (below) or electrical probe Record actual pinch off in log book

  13. VCSEL fabrication – CF4 RIE etch Freon 14 (CF4) process (~200 Å/min) Test for conduction on probe station 2 min etch, test Repeat until all SiO2 is removed

  14. VCSEL Structure and Operation Top-view optical photograph of fabricated VCSEL Side-view schematic of fabricated VCSEL

  15. Test VCSELs!

More Related