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Summary : Pixel 2012, Inawashiro , Japan

Summary : Pixel 2012, Inawashiro , Japan. Mathieu Benoit. Outline. Some news from other HEP experiments ALICE LHCb Super-B Factory Belle II Sensor technology SOI pixel sensors MAPS family Hybrid pixel sensors Readout architectures 3D Integration TSV

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Summary : Pixel 2012, Inawashiro , Japan

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  1. Summary : Pixel 2012, Inawashiro, Japan Mathieu Benoit

  2. Outline • Some news fromother HEP experiments • ALICE • LHCb • Super-BFactory • Belle II • Sensortechnology • SOI pixel sensors • MAPS family • Hybrid pixel sensors • Readout architectures • 3D Integration • TSV • 65nm & 130 nm processreadouts

  3. Upgrade of the ALICE InnerTracking System, Stefan Rossegger ALICE ITS Upgrade

  4. ALICE ITS Upgrade

  5. The LHCb VELO Upgrade , KazuyoshiAkiba VELOPix ASIC development for LHCb VELO Upgrade, M. Van Beuzokom Microchannel cooling for the LHCb VELO Upgrade, Jan Buytaert LHCb Upgrade

  6. LHCb Upgrade

  7. LHCb Upgrade

  8. LHCb Upgrade

  9. LHCb Upgrade (K. Akiba, Jan Buytaert, M. Beuzokom )

  10. LHCb Upgrade

  11. Advances in the Development of Pixel Detector for the SuperBSilicon Vertex Tracker, Eugenio Paoloni Super-BFactory

  12. Super-Belle

  13. Belle II

  14. The Belle II pixel detector: highprecisionwithlowmaterialCarlos Marinas Belle II

  15. SOI Pixel sensortechonology

  16. Progress of SOI Pixel Process, YasuoArai, KEK SOI Pixel sensortechonology

  17. MAPS More technologies interesting for particle detectors become available also with high resistivity epitaxial layers 3D assembly might provide ‘holy grail’ of monolithic very significant progress in recent years (eg SOI development) Walter Snoeys, Monolithic pixel detectors IO pads forstripoperation Pixel matrix 4.4mm The concept: Intelligent sensors in HVCMOS technology readout by the existing readout ASCIs – capacitive coupled hybrid detectors. First module with a HVCMOS chip glued onto a FEI4 ROC works, the noise still high due to non-optimal setup Strip pads IO padsfor CCPD operation Ivan Peric. HV-CMOS pixel detector in commercial CMOS technology for ATLAS, CLIC and Mu3e

  18. INMAPS PImMS1 and PImMS2, monolithic CMOS event-triggered time-stamping image sensorswithstorage of multiple timestampsat 25ns resolution, Jaya John John

  19. Hybrid Pixel Sensors

  20. Hybrid Pixel Sensors Evaluation of novel n-in-p pixel and strip sensors for very high radiation environment, N. Unno

  21. Hybrid Pixel Sensors

  22. Hybrid Pixel Sensors

  23. Hybrid Pixel Sensors

  24. Thin n-in-p pixel sensors and the SLID-ICV vertical integrationtechnology for the ATLAS upgrade at HL-LHC, Anna Macchiolo Hybrid Pixel Sensors

  25. Experience with 3D integration techniques in the framework of the ATLAS pixel upgrade for high luminosity LHC, Laura Gonella 3D Electronics for Pixel detector, Marcel Trimpl 3D integration

  26. Experience with 3D integration techniques in the framework of the ATLAS pixel upgrade for high luminosity LHC, Laura Gonella Through-SiliconVias (TSV)

  27. Towards thirdgeneration pixel readout chips, M. G. Scivieres 65nm & 130nm Readout chips

  28. 65nm & 130nm Readout chips

  29. Conclusion • Quitesomeprogress in main sensor/readout technologies have been presentedduring the conference • SOI: DPW, double-SOI • MAPS: High resistivitysubstrate, Quadruple wellprocesses • Hybridsensors : 130nm readout, 65nm prototypes, Active-edgessensors, sensor+readout efficient up to 1x10^16 neq/cm2 • 3D integrated MPW coming to a conclusion (first proposed in PIXEL2008) • Novelbondingmethodbeinginvestigated • Next PIXEL conference in Toronto in 2014, hopefullywith a lot of results on emerging technologies !

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