1. Hybrid Issues

2. Hybrid Panel • Shape/layout • Panel not flat • Need to add metal back to FR4, add 2 more side holes in 130 nm hybrids • Tabs not flat after reflow, ends don’t vac down • Metalized , lengthen, wider tabs needed • Mis-drilled alignment holes • Added specs/modified panel • Can’t glue full panel at once • Need to increase hybrid spacing, put locating pin inline for 130 nm hybrids • Vacuum leakage from extra mounting holes • Need to know what people use • Metrology • Location for metrology, fiducial markers • Need suggestions to add to 130 nm panel, add touchdown points on hybrid • Bonding • No bond off/pull test areas on hybrid • Add >2x2 mm2 area in 130 nm hybrids • Solder on pads • Fixed solder resist, only pick-and-place SMDs, moved SMDs away from bonding areas in 130 nm hybrids • Bonding clearances • Changed solder resist • Top metal contamination • Changed etch order so top layer last • Traceablility • Bad numbering of panels • Added numbering to new panels • Need id # on hybrid • Add scratch area to 130 nm hybrids, big enough for bar code

3. Hybrid toolings • Hybrid glue stencil • 8 way vacuum jig • Remove mounting holes for leak improvement • Need more screw down points for panel edge • Does it need cooling, like secondary cold plate? Or are fans sufficient? • ~50 W per panel, “cold” plate (peltier?) could be used in burn in for accelerated ageing • Hybrid pickup tooling • Hard to keep edges of ESD plastic clean, hard to get ground flat • Need to change plastic faces with grindablemetal. Is ESD an issue? • Hard to see if pins all the way down • Could connect landing pads and add simple continuity test