1 / 10

SDDEC1004 High Speed Wired Data Collection

SDDEC1004 High Speed Wired Data Collection. Honeywell Bob Dearth Michael Retzler Brad Lucht ISU Prof. Zhengdao Wang Zachary Coffin, Cpr E Radell Young, E E William Zimmerman, E E. Project Plan. Loss of team member New team member Bill Zimmerman PCB layout and fabrication

chung
Télécharger la présentation

SDDEC1004 High Speed Wired Data Collection

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. SDDEC1004High Speed Wired Data Collection Honeywell Bob Dearth Michael Retzler Brad Lucht ISU Prof. Zhengdao Wang Zachary Coffin, Cpr E Radell Young, E E William Zimmerman, E E

  2. Project Plan • Loss of team member • New team member Bill Zimmerman • PCB layout and fabrication • Connect components & verify functionality

  3. Project Design

  4. Project Design - Chipset • Measurement Specialties, - Inc. LDT 1-028K/L(Piezo, 4x) • ST Micro - L6932D1.8 (Voltage Regulator) • ST Micro - L7805CV (Voltage Regulator) • Texas Instruments - TLC5510 (AtoD, 4x) • Texas Instruments - CD54HC280 (Parity, 4x) • Texas Instruments - CD4067BE (MUX, 4x) • ECS Inc. - ECS-180-20-1X (18MHz Crystal) • Texas Instruments - CDCE913 (Clock Generator) • Texas Instruments - CD74HCT163 (Counter) • National Semiconductor - DS92LV040A (LVDS Transceiver) • ST Ericsson - ISP1508A (USB Transceiver)

  5. Implementation/Testing • New team member – Bill Zimmerman • Chipset decisions revisited and finalized • Testing specifications received from Honeywell

  6. Implementation/Testing 2 • Frequency response tested September 2nd • Resulting data suggests a performance level below expected • After discussion with Honeywell, Cat-5 design shall be implemented

  7. Implementation/Testing 3 • (Cable)

  8. Implementation/Testing 4 • Typical piezo sensors received Sept. 16th • Initial tests show voltage levels greater than 102V • Voltage level step-down design finalized

  9. Peizo Sensor voltage test

  10. Plan/Schedule • PCB layout to connect chips as necessary • Good chips come in small packages • Reflow soldering may be easier than hand-soldering such small connections • Delivery the week of Thanksgiving

More Related