SlideServe
Télécharger Obtenir Pro
Menu
Accueil Pro
Préférences
ApparenceLight Aide et commentaires
© SlideServe · v2026

Chamber PCB s, FEB s, Cooling, HV/LV Distribution

dale avatar
dale
14 diapositives · 273 Views · Jul 13, 2014

This document discusses the design of multi-layer and double-sided PCBs for High Voltage (HV) and Low Voltage (LV) distribution chambers. It covers track widths, spacing, and modular approaches for effective channel distribution across prototype PCBs. Emphasis is placed on cooling solutions, channel handling, pad design, and the integration of resistors to prevent electrical sparks. Additionally, it outlines specifications for various components, including FEBs and connectors, aiming to optimize both functionality and power consumption in high-performance environments.

#chamber pcb s, feb s, cooling, hv/lv distribution #chamber pcb s, feb s, cooling, hv/lv distribution ppt #powerpoint #presentation
Chamber PCB s, FEB s, Cooling, HV/LV Distribution - slide 1
01 / 14Chamber PCB s, FEB s, Cooling, HV/LV Distribution
1 / 17

Télécharger la présentation

Chamber PCB s, FEB s, Cooling, HV/LV Distribution
Une image / un lien ci-dessous est fourni (tel quel) pour télécharger la présentation

Politique de téléchargement : le contenu du site vous est fourni TEL QUEL pour votre information et votre usage personnel ; il ne peut être vendu, concédé sous licence ni partagé sur d’autres sites sans l’accord de son auteur.Le contenu vous est fourni TEL QUEL, pour votre information et votre usage personnel uniquement. Téléchargez la présentation en cliquant sur ce lien. Lors du téléchargement, si vous ne parvenez pas à télécharger une présentation, l’éditeur a peut-être supprimé le fichier de son serveur.Pendant le téléchargement, si vous ne parvenez pas à obtenir une présentation, le fichier a peut-être été supprimé par l’éditeur.

F I N

Plus de contenu associé

Transcription de la présentation

  1. Chamber PCB s, FEB s, Cooling, HV/LV Distribution PCB designs-track widths, track to track distances … 2) Double sided and Multi layer, modular approach. 3) Resistors for protection against possible sparks. 4) Orientation of FEB s, Scheme, Cooling 5) HV/LV distribution- No of channels, Modules, cost

  2. Prototype PCBs No of pads- 256, Pad sizes-8*3.4 sq mm Readout area-97*85 Sq mm. Read by 2 FEBs each with 128 channels. 2 types of pad sizes tried. Both Staggered. Double sided PCB Top copper For previous test beams Track widths -6mil Track- track – 6 mil to 15mil. Resistors added later (0603) vias from- top to bottom copper 256 tracks - all on bottom copper

  3. For next Test beam 512 pads- to be read by 4 FEBs each 128 channels Top copper Pad area-67*73 Sq mm for 3mm. For 4mm - 88*97 sq mm Resistors -0402 Bottom copper 3 and 4 sq mm pads. Not staggered. Track lengths are long. 4 mil tracks. Track- track 4 /6 mil spacing Cross talk??? Multi layer with GND planes??? Double sided PCB- all 512 tracks on bottom copper only

  4. 4 layer PCB with GND Plane Top copper Type 1 Inner 2 GND Plane Inner 1 GND plane Bottom copper GND Plane Connector with resistors Connectors for FEBs

  5. 4 layer PCB with GND tracks Type-2 Bottom copper Inner 1 Every track is in between 2 GND tracks. Top and Inner-2 not shown. in case of type2 Too many tracks to draw. Easy to draw the GND planes in case of type1. Removal of planes is also easier Track lengths are still very long due to connectors for both cases.

  6. Modular approach Top copper 2.6 Sq mm Pads 32*8 matrix. 256 pads Single 300 pin Connector. Reads 2 n - XYTERS. Inner 1 Inner-2 Bottom Copper 2.6 mm square pads • Pads arranged in one block of 32*8=256. • Connected to 300 pin connector. • Tracks - shorter and not closer . • can be easily duplicated for bigger sizes. • 4 such blocks for GEM of 10cm * 10 cm. • Each block read by 1 FEB with 2 n-XYTERs • No resistors could be added so far. • FEBs can be mounted horizontal or vertical Blind vias (red ) to inner layer Blind vias from inner layers( blue) For STAR PMD For ALICE PMD

  7. Prototype design Bottom copper Inner1 4 connectors. Each reads 2 N-XYTERS. 44 spare pins on the connector. Inner2 Top copper

  8. FEB--Probable scheme?? BGA-144 SQFP148 64 channel chip-- No of Pin outs 125-150? For inputs- 64 For I2c - 6 For CLK - 6 For SDA, SCl - 2 I2C Reset - 2 Reset 2 DATA (diffl) --- 18 ( 16 for digital, 2 analog) Total -100 PLUS Bias ,GND, other control inputs -25 to 50 ?? Consider BGA144(1,27mm pitch) / SQFP148(10*14) with 148 pin count and if we arrange-see the board size-10cm*3.2cm ADC ADC 300 Pin CON ROC CON

  9. Cooling Issues • FEB with one NXYTER draws 1.5A @5V.(with regulators) • For a 2 chip FEB , Current drawn is expected to be 3A minimum. Power= 15Watts. With 3.3V it is 10 Watts. • With 4 such FEBs, each reading a zone with 1K pads, the power dissipation is 40 Watts on an area of 10(cm) * 10 (cm). • Same as power dissipated on one ALICE-PMD module (4608 cells). • Each FEB with 2/4 n –XYTERS needs cooling. To be taken care while designing the FEB.

  10. Detector, HV Detector specifications Detector active area= 20 sq met. GEM PCB dimensions= 30x30Cm. No Of GEMS required =20 ÷0.3x0.3= 222.2= 222 Total number of GEMs required = 222x3= 666 (for triple GEM). 9k pads on one chamber PCB (30cm by 30 cm) For 500,000 we need 56 Nos, each for chamber and drift PCBs (min). HV HV channels required for GEM PCBs = 222 ( one for each triple GEM) HV specification = 3 to 5 KV/1mA /5Watts. CAEN 1535 board has 24 HV channels. Each = 3.5KV/3mA. SHV /multi pin connectors. CAENA1550-5KV/1mA with multi Pin and SHV Can be housed in SY1527. Number of boards required will be = 10 ( 10x24=240 channels). SY 1527 houses 5/10 boards. Need 2/1 Crates. Power consumption= 240x5Watts = 1.2KW

  11. FEBs-LV FEB s, ROC s Channels to read= 500,000 One N-XYTER reads =128 channels. FEB with 2 n-XYTERS reads-256 channels No of FEB s Required = 500,000÷256 = 2000 No (512,000 channels). Each ROC can handle = 2 FEBs (512 channels). No Of ROCs required =1000Nos. LV Specifications 2chip Feb With 3.3 v supply the power dissipation =10watts. 2000 FEBs consume =2000x 10Watts =20KW. One ROC need -3.5A @5V ( one FEB connected). With two FEBs it is 4A 1000 ROC s consume = 1000x5Vx4A=20KW. Power consumption expected for 2000FEBs +1000 ROCs = 40KW

  12. . LV distribution A3009B -2to 8 V, 9A @5V. Max =45W. Has 12 independent channels. Max 480Watts For 1000 ROCS Need 1000÷12= 84 modules For 2000 FEBSs = 2000÷12= 167 modules. Need 167+84 =251 modules. Separate LV channels for FEB and ROC. Alternately: Reduce LV channels to 168÷2=84 by using LVDB to feed 2 FEBS (from 1 channel) Need 84+84 =168 modules. No of 3009s in one EASY crate =4 (2KW) EASY crates Required = 250÷4=63 or 164 ÷4=41 With 2 channels 3486 has =48V /40A , Power Capacity =5KW 3486 s required = 40KW÷5 = 8Nos. Filter for 3486 =8 Nos . One Branch Controller (A1676A) controls 6 EASY- 3000 Crates. For 63/41 Crates we need = 11 /7 Branch controllers

  13. Costs of CAEN-LV/HV modules • SY1527 -Universal Crate-- 11K Euro • 3486-48V supply- 12K Euro • A3000NF-Filter for 3486--- 3.2KEuro • A1676- Branch Controller --- 1.4K Euro • A3009B--- 2 to 8V supply ----- 7.1K Euro • EASY 3000 Crate (for A3009B)---- 2.6K Euro • A1535-24 channel HV module---- 4.8K Euro • A1550 -24 Channel HV module---------- 5.8K Euro

  14. Issues to be taken care • Too many modules and Crates ??? • Alternate systems from WEINER or ?? • Which Detector Control System PVSS or ??? • Cooling system - water cooled or air cooled?? • FEB PCB vertical type of horizontal type ??? • If No regulators on the FEB, any precaution to be taken in DB…..????