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Halogen free material- Technical necessity or marketing campaign PowerPoint Presentation
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Halogen free material- Technical necessity or marketing campaign

Halogen free material- Technical necessity or marketing campaign

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Halogen free material- Technical necessity or marketing campaign

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  1. Halogen free material- Technical necessity or marketing campaign Dr. M. Cygon Isola AG October 2000 1

  2. Main components of base materials Copper foil Glass fabric Thermosets 2

  3. CH3 CH2-CH-CH2-O- -C- -O-CH2-CH-CH2 O CH3 O Br CH3 Br CH3 CH3 -C- -O- CH2-CH-CH2-O- -C- -O-CH2-CH-CH2 CH2-CH-CH2-O- -C- -O-CH2-CH-CH2 -O- CH3 Br O CH3 CH3 Br OH OH O Brominated epoxy resin Br CH3 Br + 2 HO- -C- -OH CH3 Br Br DGEBA TBBA 3

  4. Hazardous substances (EACEM list) CFCs and halons (substances that destroy the ozone layer) Acrylonitrile (monomer) DMA (N,N)-dimethyl acetamide NMA (N)-methylacetamide DMF (N,N)-dimethyl formamide NMF (N)-methyl formamide Diethylamine Nitrosamide Nitrosamine Ethylene glycol ether and acetale Phthalates (all) Formaldehyde (monomer) Hydrazine Picric acid Halogenated aromatic hydrocarbons (general prohibition) PBD, polybrominated diphenyls PBDE, polybrominated diphenyl ether PCD, polychlorinated diphenyls PCT, polychlorinated triphenyls Pentachlorophenol Dioxins Dibenzofurans Halogenated aliphatic hydrocarbons Epichlorhydrin (monomer) Vinyl chloride (monomer) PVC and PVC mixtures Antimony and its compounds Arsenic and its compounds Beryllium and its compounds Cadmium and its compounds Chromium(VI) and its compounds Cobalt and its compounds Lead and its compounds Mercury and its compounds Metal carbonyl Organic tin compounds Selenium and its compounds Tellurium and its compounds Thallium and its compounds Asbestos Cyanide Benzene Phenol (monomer) Toluene Xylene Polycyclical aromatic hydrocarbons 4

  5. 5

  6. PCDD- and PCDF-Kongenere with 2,3,7,8-Chlorine substitution pattern Chlorine “Seveso-Toxin“ Oxygene 6

  7. 7

  8. Waste treatment - Recycling not possible due to glass reinforcement and thermoset epoxy - Copper recycling possible - Thermo-treatment possible, if proper flame retarder - Waste uncritical for repository, after copper removal 8

  9. Environmental aspects on base material cannot be converted to PCB´s! Solder metal Resist Devices Service print Ni/Au 9

  10. Do we really need flame retarded laminates for all applications? 10

  11. 11

  12. Base materials without flame retarders Grade G-10 G-11 PD BT CE Gigaver UL-Rating HB HB V-1 V-1 V-1 V-1 12

  13. Which compounds can be used to obtain a flame retardent effect ? nitrogen compounds phoshorous compounds halogen compounds (chlorine, bromine) hydrates (Al(OH)3 xH2O, Mg(OH)2 xH2O) Additives Reactive components melamines phosphates polybrominated biphenyls*) polybrominated diphenyl ethers*) brominated phthalimides hydrates *) can form dioxins and dibenzofurans tetrabromobisphenol A EP-phosphoric acid esters multifunctional amino-compounds 13

  14. Mechanism of Flame Retarders HALOGENES R-H + X R + HX H2O + X HX + OH X = HALOGENES 14

  15. O HO O H P OH n Mechanism of Flame Retarders PHOSPHOROUS COMPOUNDS DEHYDRATION -CH2-CH2- H3PO4 + C + -H2O ORGANIC COMPOUND CARBON PHOSPHOROUS ACID GLASS-LIKE POLYPHOSPHOROUS ACID 15

  16. Mechanism of Flame Retarders HYDRATES ~ 280oC 2 Al(OH)3 xH2O Al2O3 + x+3 H2O 16

  17. Halogen free base material SC - VO 351 (FR-2) IN OUT BROMINATED ADDITIVE PHOSPHOROUS/NITROGENE ADDITIVE 17

  18. DURAVER-E-Cu 150 (FR-5) Halogen free base material IN OUT REACTIVE BROMINATED EPOXY RESIN REACTIVE PHOSPHOROUS MODIFIED EPOXY RESIN NITROGENE HARDENER DICY HARDENER 18

  19. DURAVER-E-Cu 156 (FR-4) IN OUT REACTIVE BROMINATED EPOXY RESIN REACTIVE PHOSPHOROUS MODIFIED EPOXY RESIN Halogen free base material 19

  20. 20 FE

  21. Outlook a) markets - halogen free PCB´s are interesting for the auto- motive industry due to the motor vehicle regulation - electronic for telecommunication will use halogen free PCB´s for marketing reasons - with TBBA flame protected PCB´s will be use furthermore in quantities 21

  22. Outlook b) materials 22