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Mission Statement and Objectives

Mission Statement and Objectives. Design Requirements. Functional Log radiation and corresponding altitude for duration of flight (up to 90,000 feet and back) Store data on non-volatile memory

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Mission Statement and Objectives

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  1. Mission Statement and Objectives

  2. Design Requirements Functional • Log radiation and corresponding altitude for duration of flight (up to 90,000 feet and back) • Store data on non-volatile memory • Provide power for duration of flight plus one hour set up and one hour for recovery (4 hours minimum) • Indicate the unit is powered on • Indicate system is running properly • Ensure system is both water-resistant and buoyant • Provide internal fire resistance • Provide internal temperature regulation • Ensure system will operate within temperature range and withstand forces of launch, ascent, balloon breaking, descent, and landing • Ensure system can attach to research computer payload • Ensure combined system can attach to Borealis balloon Performance • Log radiation and altitude data each second • Provide 5 watts per hour over 4 hour flight • Provide sound and/or light to indicate power is on • Provide sound and/or light to indicate the system is operating properly • Ensure water cannot leak into system and payload floats • Enable system to shut down if internal temperature exceeds 100 C • Ensure system can withstand vertical force of 10Gs and horizontal force of 5Gs (according to HASP requirements) • Ensure payload temperature stays within and will operate between -60 and 60C (external) and between -20 and 40C (internal) • Ensure pressure sensor can withstand 0-90kPa Physical • Ensure system does not exceed maximum dimensions: 5.5” by 5.5” by 5.5” • Ensure system does not exceed maximum mass: 6 lbs Reliability • Ensure system can launch twice and withstand internal tests: • Drop test • Bench-top burn test • Cold room test • Water resistance test • Pressure test • Recover all components and ensure internal components are not damaged

  3. Design Alternatives

  4. Design Comparison

  5. Final Decisions and Budget Raspberry Pi: $25 + SD Card: $13 Total: $38

  6. Computer Subsystem Tests Test 1-Connect Geiger counter to development board - Read and interpret data Test 2-Connect pressure sensor to development board - Read and interpret data while in pressure chamber Test 3-Write to SD card

  7. Program Design

  8. Radiation Sensors

  9. Ratings

  10. Additional Acrylic conformal coating to protect both Geiger counter and the rest of the circuit

  11. Pressure/Altitude Sensor

  12. Ratings

  13. Load

  14. DC/DC Converter

  15. Ratings

  16. Power Source

  17. Configuration 5 Batteries 6 Batteries 8 Batteries

  18. Configuration

  19. Ratings

  20. Electrical Subsystem Tests Burn in test • Breadboard the design and power the circuit, to see how long the batteries last DC/DC converter test • Test to make sure the DC/DC converter is outputting the right value Cold test • Place the fully manufactured circuit in the enclosure and test the enclosure in the cold lab

  21. Final Decisions and Budget Geiger Counter: $150 + Pressure Sensor: $33 + DC/DC Converter: $7 + Batteries: $80 + Battery Boxes: $5 + PC Boards: $12 + Misc: $20 Total: $307

  22. Structural Alternatives 1. 2. 3. 4. -Hard Foam -Gorilla Tape -Packing Tape -Hard Foam -Gorilla Tape -Packing Tape -Fiberglass -Thinsulate -Vinyl -Fiberglass

  23. Preliminary Testing- Prototype 1 -Hard Foam -Gorilla Tape -Packing Tape -Fiberglass

  24. Attachment Method- Prototype 1 • Bottom of our payload will be bolted to top of research computer payload • Research computer payload will attach to BOREALIS Balloon -Prototype Lid -4 Screws -Prototype Box -Existing Research Payload

  25. Drop Test- Prototype 1

  26. Internal Testing- Prototype 1 • Burn test- tested material resistance to fire • Shredded Polyurethane Foam • Burns only when flame is held on foam • Thinsulate • Melts when flame is held on it but does not catch fire • Packing tape • Melts when flame is held on it but does not catch fire • Polystyrene Foam Board • Melts when flame is held on it but does not catch fire • Fiberglass • Melts when flame is held on it but does not catch on fire

  27. Cold Test- Prototype 1 Test 3: Control Box: No Thinsulate Bag, No Shredded Packing Foam Test 1: No Thinsulate Bag, Shredded Packing Foam Test 2: Thinsulate Bag, Shredded Packing Foam Thermocouple on circuit board Thermocouple on battery pack

  28. Cold Room Test- Prototype 1

  29. Budget Building Materials: $40 packing tape, fiberglass kit, gorilla tape, gorilla glue, etc. + Shredded Foam: $2 + Polystyrene ½” Board: $2 + Thinsulate: $15 + TI Sensor Tag: $25 Total: $84

  30. Overall Budget CS Materials $38 + EE Materials $307 + ME Materials $84 Total: $429 $171 under budget!!!

  31. Computer Subsystem Anticipated Schedule = Event = Milestone Window Window

  32. Electrical Subsystem Anticipated Schedule = Event = Milestone Window Window

  33. Mechanical Subsystem Anticipated Schedule = Event = Milestone Window Window

  34. Thank you!

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