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Main Claim :

Wire bonding 전에 laser 로 bond finger 부분을 제거한 후 wire bonding 한다. 오염된 DI water 에 의한 Bond finger discolor U/F 용액에 의한 resin bleed out 발생. Current. Invention. Laser. Laser. Bond finger discolor. Resin bleed out. Main Claim :

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Main Claim :

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  1. Wire bonding전에 laser로 bond finger 부분을 제거한 후 wire bonding한다. • 오염된 DI water 에 의한 Bond finger discolor • U/F용액에 의한 resin bleed out발생 Current Invention Laser Laser Bond finger discolor Resin bleed out • Main Claim : • - Claim1 : flipchip 공정에서 DI water 를 사용하는 flux cleaning 과 SAT inspection하는 동안 오염된 물에의한 bond finger 에 discolor가 자주 발생하고있다.Bond finger opening을 wire bonding 전에 Laser로 open하여 작업하면 오염된 DI water가 finger에 노출되지 않게 하여 근원적으로 discolor를 막을 수 있다. • Claim: U/F공정 동안 solder mask가 Bond finger를 덮고 있기 때문에 dispensing pattern이 자유로며, resin bleedout이 발생해도 Laser solder mask opening에서 제거가 가능한 장점이 있다. • =>특히 FCCSP,TMVPKG의 DBRC를 최소화해서 Large die를 구현을 할 수 있는 장점이 있다.

  2. Bond finger 영역에 Solder mask를 Laser로 open한다 Bond finger 영역에 Solder mask가 덮혀져 있는 PCB • Embodiment 1: De-flux Process Underfill Process SAT Inspection Laser Die Die Laser Plasma cleaning Die Die Wire bonding process Laser Laser

  3. Process schematic • Embodiment 1: UV Coated PCB UV type material UV type material UV type material UV type material Chip Attach/Reflow SAT process Flux cleaning Substrate Bake Underfill / Cure SAT UV Die Die Die Substrate Bake UV expose UV material strip 변경된 PCB Substrate Bake Added process

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