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Analysis of Wire Samples Using Electron Microscopy Techniques

This study presents an in-depth analysis of various wire samples using advanced electron microscopy techniques. Sample 4, Sample 5, and Sample 7 are examined via Secondary Electron Imaging (SEI) and Energy Dispersive Spectroscopy (EDS). The results indicate significant differences in structural integrity, particularly between new wire and damaged wire. Dark spots in SEI imagery highlight the presence of light elements, revealing the material compositions. The analysis aims to understand the elemental differences and their implications on wire performance.

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Analysis of Wire Samples Using Electron Microscopy Techniques

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  1. Microscope at the VU

  2. The samples

  3. Sample 4: Sample 5: Sample 7: new wire

  4. Good wire “SEI” image: • Secundary electrons • Measure of amount of material “COMPO” image: • Primary electrons • Measure of Z of material •  dark spots = light element

  5. Compare wire Wire sample 7: new Wire sample 5: damaged Wire sample 5: damaged SEI Dark spot = light element COMP

  6. EDS: new wire vs damaged wire

  7. Dark spot Opitcal SEI EDS COMPO Tungsten Calcium?

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