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CCD Packaging and Material Specifications Update

The agenda for the CCD packaging meeting covers critical action items including the schedule for epoxy use, conformal coating requirements, and material specifications necessary for NASA. It highlights the current progress on parts scheduled for delivery by 1/21/13, along with verification of specifications for various materials. Key topics include ESD protection for flexprint circuitry, solder mask inquiries, and a request for detailed material information by 1/4/13, including assembly processes and outgassing data. Discussion on available CCD characterization data is also addressed.

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CCD Packaging and Material Specifications Update

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  1. LL/MIT REXIS/OBF Telecon 12/13/12

  2. Agenda (MIT Action Items) • Packaging schedule • Epoxies to be used in CCD packaging • Conformal coating of flexprints • Materials information for NASA • CCD characterization data

  3. Packaging Schedule • Still on schedule for 1/21/13 delivery of parts • Flexprints, alumina substrates, and circuit components ordered (thanks Keith!) • Next is aluminum pieces, transport box after that

  4. Epoxies for CCD Packaging • Is the current spec or the ACIS spec correct? • Is Crest 3135 RTV or epoxy? • Does thermal data exist for Epotek 377?

  5. Conformal Coating of Flexprints • Flexprint active circuitry area requires some kind of coating for ESD protection • Is solder mask enough? • All vias on the board are tented • If solder mask is not enough, what is recommended? • Where should coating be done?LL or Kavli or by the vendor?

  6. Material Information for NASA • NASA needs exact specifications on materials we are using in the package • Need the following info (see attached spreadsheet) • Assembly processes • Materials used • Standards/specifications for materials used • Organics only: Amount used and outgassing data • Need to file preliminary spreadsheet by 1/4/13

  7. CCD Characterization Data • What is currently available or can be available soon? • Harvard can plug in any available data to their simulations • Is anything needed from MIT besides the wish list that was already sent over? • I owe Keith a metrology wish list

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