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Mock CCID-41 Fit Checks

Mock CCID-41 Fit Checks. MIT/LL REXIS/OBF Telecon 5/8/13. General Cosmetics. One CCD was cracked on delivery This doesn’t impact what we’re doing, but we did want to make sure that you knew this Wirebonds look great under a microscope, particularly the ones near the embedded RTD

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Mock CCID-41 Fit Checks

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  1. Mock CCID-41 Fit Checks MIT/LL REXIS/OBF Telecon 5/8/13

  2. General Cosmetics • One CCD was cracked on delivery • This doesn’t impact what we’re doing, but we did want to make sure that you knew this • Wirebonds look great under a microscope, particularly the ones near the embedded RTD • CCID-52 instead of CCID-41?

  3. Intra-Package Alignment • Evaluation is only qualitative at this stage • Working on setting up quantitative evaluation within the next week • Alignment of chips perpendicular to flexprints looks very good on all four CCDs • Flexprints appear to have some rotational misalignment • Not enough to affect connection to REXIS electronics, but would appear to affect wirebond length • 1 is flush up against the CCD, 2 have the gap increasing from left to right, 1 has the gap increasing from right to left No gap present Gap increases from left to right

  4. Intra-Package Alignment • Alignment of chips parallel to flexprints looks good on 3 of 4 CCDs • Cracked CCD appears to be closer to the edge of the package than the others Uncracked CCD Cracked CCD

  5. Inter-Package Alignment • Clearance between CCDs and inside edges of detector assembly looks good • Aiming for at least 1mm all the way around the array Adequate (>1mm) clearance Hard to tell but there is clearance here

  6. Inter-Package Alignment • One CCD appears to have the tee too far from the flexprint and possibly off-center • While a concern, the other CCDs look fine • Any thoughts on what happened with this one? • N.B.: Gap between CCDs along X and along Y are not the same due to the geometry of the CCID-41 active area and framestore Difficult to see but this CCD appears to be closer to the assembly edge CCD is not up far enough

  7. Shipping Containers for EM CCDs • We have many old mounting fixtures that would be appropriate for housing EM CCDs • Keith mentioned LL may have boxes that would mate to these fixtures? • We might have extra boxes • Do we need to give LL anything?

  8. Path Forward • Issues to address before EM CCD assembly can begin • Moving die inboard off package front edge • Flexprintrotational misalignment with respect to CCD die • Tee misalignment • Are any of the above issues with the assembly process or are they within fabrication tolerances? • If none of the above can be addressed at LL, we may be able to adjust our design to accommodate but this is not ideal • Is the wirebond length OK? • Shipping containers/fixtures for CCDs

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