1 / 33

Shanghai Microsemi

Shanghai Microsemi. Semiconductor Co., Ltd. Company Profile. Located at Xin Zhuang, Shanghai, China Established in September 1995 100% owned by Microsemi Corp in Dec 2007 4” Wafer Fab with monthly output 60K pcs, 80% utilization rate. Products Portfolio. GPP Chips Finished Goods.

leigh
Télécharger la présentation

Shanghai Microsemi

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Shanghai Microsemi Semiconductor Co., Ltd.

  2. Company Profile Located at Xin Zhuang, Shanghai, China Established in September 1995 100% owned by Microsemi Corp in Dec 2007 4” Wafer Fab with monthly output 60K pcs, 80% utilization rate

  3. Products Portfolio GPP Chips Finished Goods

  4. Products Tree Finish Goods Diode Bridges Modules GPP Diode Single-Phase Rectifier Bridges Diode Modules FRED Modules 3-Phase Rectifier Modules High Voltage Stack Diode 3-Phase Rectifier Bridges SCR Modules Rectifier+SCR Modules

  5. Microsemi Shanghai ’s Technology Advantages

  6. P+ P+ P + N N P+ N N+ N+ P+ N+ N+ + N N Passivation techniques

  7. P+ N N+ Microsemi’s 5-Star Passivation Silicon nitride layer = Silicon Nitride & Glass passivation Microsemi uses the process for all hi-rel discrete devices Process : Grooves etching + Silicon Nitride + glass layer on etched grooves Quality rating: Highest quality process

  8. LPCVD growth layers plus glass passivation P+ Layer N+ Layer Advantages of SMSC’s GPP chips • Technology coming from Microsemi Corp’s Hi-Rel processing • Unique multilayer passivation ensure excellent high temperature characteristics and passing 200C HTRB test • Die size from 0.050” Sq to 0.672” Hex High purity evaporated metal ensure a strong metallurgical bond and provides extremely low contact resistance LPCVD : Low Pressure Chemical Vapor Deposition

  9. Double Isolation Technology Advantages: • GPP Chips -- SMSC’s New developed Passivated Double Isolation Chips

  10. FG’s Release to Market (RTM) Procedures SMSC SMSC/Sub-con SMSC • Die receiving inspection • Visual / Electrical inspection • Assembly • Finished Goods (FG) • Visual/Electrical • Stamping • Reliability tests • REPEATEDABILITY TRIALS RTM • Die qualification • Visual examination • Electrical inspection • HTRB • FG inspection • Visual / Electrical inspection • Reliability tests (next slide)

  11. Reliability Tests Plan

  12. Reliability Tests

  13. Single Phase Bridge Rectifiers • Specs: Io = 0.5~50A STD VRRM =200 ~ 1000V • Typical Applications: • GBJ、IH、KBJ Series: • Induction Heater/Home Appliance/Switching Power/Industrial Power Controller • GBU、GBL、KBP Series: • PC Power/LCD-TV/Industrial Power Controller • GBPC & GBPC-W Series: • Welder/Air-condition/Communication Power Supply/Industrial Power Controller

  14. High Voltage Stack Diodes • Plastic case UL flammability recognition 94V-0 • Replacement of Philips parts (e.g. BYX134GPL) • Using SMSC’s unique passivated GPP chips • High voltage up to 6KV GPP chips • High maximum operating temperature • Application: Ignition systems; High voltage coils; • X-ray system; Microwave system, etc. • Business Partners: • Federal Mogul • Delphi • Eldor

  15. FRED ModulesUltra Fast Recovery Epitaxial Diodes • Common cathode configuration • Epoxy Potting body • Low Leakage Current • Low Forward Voltages • 150℃ Operating Junction Temperature • RoHS Compliance

  16. 3-Phase Bridge Rectifiers MT Series • 35 to 50 Ampere Current Rating • 800V to 1800V Reverse Voltage Rating • Direct Replacement to IXYS & IR parts • Typical Applications: • UPS, Industrial Power Controller, • Input rectifiers for PWM inverter, • Battery DC power supplies • High-frequency Switching Power Supply

  17. 3-Phase Bridge Rectifiers NEW

  18. 3-Phase Bridge Rectifiers

  19. Power Diode Modules NEW • Quality Assurance • SMSC’s New developed Passivated Double Isolation Chips Inside • 100% HTRB Test for Each Lot Double Moat Structure DGP Chip DGP design would improve the reliability and performance • Assembly Technology -- “Vacuum + H2” Multi-Gas BrazingTechnology -- Brazing with DBC for excellent thermal distribution -- Ultrasonic scanning to ensure reliable brazing quality -- High insulation voltage ≥ 3000V -- Vacuum Welding Technology -- Voidage: <2.5% -- X-ray Whole Body Scanned

  20. Power Diode Modules Diode-Diode Modules

  21. Power Diode Modules Rectifier Modules

  22. Power Diode Modules • Applications -- DC Power Equipment -- Inverter -- Battery Charger -- DC Motor Power Supply -- Welding Machine -- PWM Converter Rectifier

  23. New product Promotion Applications -- Input rectification -- Output rectifies which are available in indentical package outlines -- Industrial Level 60EPS Series High Reliability & High current capacity Low Leakage Current Low Forward Voltage 150℃ Operating Junction Temperature ROHS Compliance Replacement of IR Parts The official approval document of 60EPS by APC of Schneider Denmark.

  24. New product Promotion——3-phase Rectifier Modules M2-1 M3-1 Thin modules (17mm high) MSDM Series • Glass passivated chip • High Reliability • Superior thermal conductivity • Blocking voltage:800 to 1800 V • Heat transfer through aluminum oxide DBC ceramic isolated metal baseplate • Application --Three phase rectifiers for power supplies --Rectifiers for DC motor field supplies --Battery charger rectifiers --Input rectifiers for variable frequency drives

  25. New product Promotion ——Diode Modules D1-1 D2-1 MSCD-B/MSAD-B/MSKD-B Series • Blocking voltage:800 to 1800V • Heat transfer through aluminum oxide DBC ceramic isolated metal baseplate • Glass passivated chip • Application • Non-controllable rectifiers for AC/AC converters • Line rectifiers for transistorized AC motor controllers • Field supply for DC motors

  26. New product Promotion ——Thyristor Modules T2/F2 T1/F1 MSTC/MSFC Series • Isolation voltage 3000V • High surge capability • Glass passivated chips • International standard package • Simple Mounting • Heat transfer through aluminum oxide DCB ceramic isolated metal baseplate • Application • Power Converters • Lighting Control • DC Motor Control and Drives • Heat and temperature control

  27. New product Promotion ——3 phase Rectifiers+SCR Modules M4 M5 MSDT Series • ThreePhase Diode and a Thyristor • Isolation voltage 3000V • High surge capability • Glass passivated chips • Simple Mounting • Isolated Module Package • Application • Inverter for AC or DC motor control • Current stablilzed power supply • Switching power supply

  28. Power Modules Cross Reference Guide (partial)： * For Reference Only Feb 2011 28

  29. Power Modules Cross Reference Guide (partial)： * For Reference Only Feb 2011 29

  30. Major Customers

  31. Quality System ISO 9001:2008 ISO 14001:2004

  32. Quality System RoHS Compliance REACH Compliance UL Approved

  33. Thank You Shanghai Microsemi Semiconductor Co., Ltd. 203 Shen Nan Road, Shanghai, 201108, PRC Website: http://www.smsemi.com Email: Sales@smsemi.com Sales : 0086 - 21 - 6489 - 6650

More Related