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Advanced Applications of Laser and Electron Beam Machining in Manufacturing Processes

Explore the innovative methodologies within the Department of Mechanical and Aerospace Engineering at GSNU, focusing on cutting-edge techniques such as Chemical Mechanical Polishing (CMP), Laser Beam Machining (LBM), and Electron Beam Machining (EBM). Discover the intricacies of wafer carrier polishing, as well as the various applications in electronics and automotive industries, including cutting, welding, and surface treatment. Our advanced processes ensure high precision, automation, and flexibility, enhancing productivity and quality in manufacturing.

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Advanced Applications of Laser and Electron Beam Machining in Manufacturing Processes

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  1. NC Applications in Manufacturing GSNU

  2. CMP (Chemical Mechanical Polishing) Wafer carrier Polishing plate Toyoda Float Polishing Machine Table Speed: 100 RPM Wafer Carrier Speed: 75 RPM Down Pressure: 5 psi GSNU- Dept. of Mechanical and Aerospace Engineering

  3. Process Setup Wafer carrier view Side view GSNU- Dept. of Mechanical and Aerospace Engineering

  4. Wafer-Pad Contact Small Film Thickness Increasing Line Density Large Film Thickness GSNU- Dept. of Mechanical and Aerospace Engineering

  5. 고에너지빔 공정 • 레이저빔(LBM) • 전자빔가공(EBM) • 플라즈마빔가공(PBM) GSNU- Dept. of Mechanical and Aerospace Engineering

  6. 레이저빔가공(LBM) Laser Beam Machining <주요 특징> (1) 정확도, 반복도, 자동화의 용이성 (2) 광섬유의 활용으로 유연화 (3) 간단한 고정구, 짧은 설치시간, 컴퓨터제어 (4) 사용에 주의 GSNU- Dept. of Mechanical and Aerospace Engineering

  7. <적용분야> (1) 전자, 자동차산업 – 절단, 드릴링 (2) 용접작업 (3) 표면처리 (4) 마킹 GSNU- Dept. of Mechanical and Aerospace Engineering

  8. GSNU- Dept. of Mechanical and Aerospace Engineering

  9. cutting Heat treating welding Cladding(피복) GSNU- Dept. of Mechanical and Aerospace Engineering

  10. kiss-cutting engraving perforating Marking-rubber Applications GSNU- Dept. of Mechanical and Aerospace Engineering

  11. slitting showerhead Web-processing Applications GSNU- Dept. of Mechanical and Aerospace Engineering

  12. NC Control GSNU- Dept. of Mechanical and Aerospace Engineering

  13. Laser - Galvanometer Control GSNU- Dept. of Mechanical and Aerospace Engineering

  14. Backlight Unit Patterns 가공 영역 : 13”, 14”, 15” 등 폭 : 50 ㎛ ~ 250 ㎛ 깊이 : 25 ㎛ ~ 125 ㎛ 프리즘 각도 : 90도 가 광학적으로 이상적 GSNU- Dept. of Mechanical and Aerospace Engineering

  15. Groove Shapes : V-cut vs. Laser V-cut Laser GSNU- Dept. of Mechanical and Aerospace Engineering

  16. Material Effect on Pattern 압출성형 사출성형 GSNU- Dept. of Mechanical and Aerospace Engineering

  17. Source CO2 Wavelength ( mm ) 10.6 Output Power (W) 0~50 Power Stability 5% Beam Size (mm) 0.34 Operation Mode Continuous Wave Mode Quality TEM00 Power Supply AC200V+10%, 50Hz Power Consumption (kW) 2.2 Test Result GSNU- Dept. of Mechanical and Aerospace Engineering

  18. Optical Properties - 인쇄 방식에 비해 약 2~3배의 휘도 - 균일도는 패턴조정으로 달성가능 GSNU- Dept. of Mechanical and Aerospace Engineering

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