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Remote MEMS Simulation, Testing and Design

Remote MEMS Simulation, Testing and Design. James Demmel, EECS & Math Kristofer Pister, Richard Muller, BSAC, EECS, UC Berkeley Sanjay Govindjee, CEE Alice Agogino, ME Ming Gu, Math Zhaojun Bai, CS, UC Davis. Goals. Combine two technologies to “Close the MEMS design loop”

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Remote MEMS Simulation, Testing and Design

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  1. Remote MEMS Simulation, Testing and Design James Demmel, EECS & Math Kristofer Pister, Richard Muller, BSAC, EECS, UC Berkeley Sanjay Govindjee, CEE Alice Agogino, ME Ming Gu, Math Zhaojun Bai, CS, UC Davis

  2. Goals • Combine two technologies to “Close the MEMS design loop” • Simulation (SUGAR) • Measurement (Microscopic Stroboscopic Interferometer, …) • Leverage large investment in networking and unique facilities at UCB and elsewhere • Make tools available to remote users • Run large simulations on UCB Millennium cluster • Test devices on UCB, other test rigs • Feedback data into simulation, design • Compare simulation and reality • Parameter extraction, sensitivity studies

  3. BSAC Microscopic StroboscopicInterferometer (Muller, Rembe, BSAC, UCB)

  4. Adaptive Optics MicroMirror(Muller, Rembe, BSAC)

  5. SUGAR(Pister, Demmel, Govindjee, Agogino, Gu, Bai) • MEMS Simulation Tool, inspired by SPICE • Available as Web service on Millennium • Currently 100s of users • Ex: Laterally actuated torsionally suspended micromirror

  6. Matisse Project (DARPA) • Provide remote access to unique and mostly MEMS facilities for large user community • Provide central facility (MEMS Exchange) to organize national network of MEMS testing sites • Use SuperNet infrastructure (CENIC) • DARPA supported (UCB, LBL, CMU, MIT, CNRI, ISI, Sarnoff)

  7. Matisse Site Connections

  8. Current MEMS ExchangeFabrication Sites and Participating Sites 1100 registered users • Fabrication Sites Under Contract: • Academic: • University of California at Berkeley • Stanford University • Cornell University • University of Michigan • Case Western Reserve University • University of Illinois • LSU/Center for Advanced Microstructures and Devices (expected soon) • Commercial: • Analog Devices • Teledyne Electronics • Microwave Bonding Inc. • Integrated Sensing Systems (ISSYS) • Sony Semiconductor • Tactical Fabs, Inc. • Zygo TeraOptics, Inc. • Advanced MEMS Optical, Inc. • ASML • Lance Goddard Assoc. • Intelligent Micropatterning, LLC

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