html5-img
1 / 45

Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004

Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004. Ivo Rutten Vice President and General Manager Business Segment Greater China Communications Semiconductor Division. Communication IC Design and IC Application - Agenda -. The Philips approach

natala
Télécharger la présentation

Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Communication IC Designand IC ApplicationelectronicChina 2004,Shanghai, March 2004 Ivo Rutten Vice President and General Manager Business Segment Greater China Communications Semiconductor Division

  2. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Summary

  3. Differentiating technology • Leadership in Systems and Platforms • Leveraging Philips’ core competencies in R&D and CE heritage • Nexperia: The Solution for Video and Mobile applications • Shipping now in GSM handsets, digital televisions and DVD recorders • Rich IP portfolio with fully integrated re-use concept • Excellence in RF • RF is crucial for wireless applications • QUBiC4 low cost, high performance RF • And now, best-in-class CMOS • 120 nm now, 90 nm first full lots now, 65 nm first silicon in Q4 2003 • Ramp-up of 300 mm wafers pilot line in Crolles on target • 0.18 µm non-volatile EE/Flash for encryption technologyin smart cards

  4. Nexperia™ • Nexperia solutions build on comprehensive collective expertise in the Philips Group, particularly Philips’ consumer AV IP • At the heart of all of our future system products across the markets we serve • Modular hardware and software • Support for industry standard operating systems • Two application areas: • Nexperia Home for Connected Home / Digital Home applications including digital television, home entertainment hubs, media servers, DVD recorders, PVRs, wireless displays and media adapters • Nexperia Mobile for mobile multimedia handsets, wireless PDAs, other portable wireless devices

  5. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Summary

  6. Nexperia Cellular System Solutions Everything but the plastic: • Complete reference designs for GSM/GPRS/EDGE mobile handhelds • Full IOT validated system including Nexperia Cellular Multimedia Baseband, power management unit, RF, power amplifier and software • Tailored for target applications • Add multimedia with minimal cost, risk and time-to-market … All you need for multimedia handsets Well on our way to 1 out of 10 GSM/GPRS phones based on Nexperia Cellular System Solution

  7. Mobile displays Pipeline Connectivity Imaging Multimedia solutions Video Power management Security/ identification Voice/audio Services & software Scope of Philips mobile applications

  8. System solutions: from sysol ME3 to ME4 Single package ME3 Single die ME4 Step 1 Step 2 Step 3 Memory SySol Baseband IC CMOS Baseband Audio PMU/Charge SySol Single die CMOS Analog IC BiCMOS Transceiver Analog IC RFCMOS ASW/PA FEM/GSM module RF-CMOS Development 2003 2004 2005 2008/9 2006/7

  9. Step 1: 2 dies in 2 technologies RF power amplifier Digital Analog High Power Batt charge switch QUBIC4+ Analog pwr supply RF power supply Dig pwr supply Memories Ram/ROM/Flash DSP + CPU JTAG + Peripherals RF power control Receiver chain Rx ADC Ref. Oscillator Auxiliar ADCs Transmitter + Synth GMSK mod, Pre-dist. BAI Audio sign. proc. 32 kHz clock unit Low Power Auxiliary DACs Analogue Audio Micbias+ Audio det RTC + alarm On/off control CMOS 090

  10. Step 2: 2 dies in 1 technology Digital RF power amplifier Analog High Power Batt charge switch RFCMOS090 Analog pwr supply RF power supply Dig pwr supply Memories Ram/ROM/Flash DSP + CPU JTAG + Peripherals RF power control Receiver chain Rx ADC Ref. Oscillator Auxiliar ADC’s Transmitter + Synth GMSK mod, Pre-dist. BAI Audio sign. proc. 32 kHz clock unit Low Power Auxiliary DAC’s Analog Audio Micbias+ Audio det RTC + alarm On/off control CMOS090

  11. Step 3: 1 die in 1 technology  ME4 Digital RF power amplifier Analog High Power Batt charge switch Analog pwr supply RF power supply Dig pwr supply CMOS090 with RF option Memories Ram/ROM/Flash DSP + CPU JTAG + Peripherals RF power control Receiver chain Rx ADC Ref. Oscillator Auxiliar ADC’s Transmitter + Synth GMSK mod, Pre-dist. BAI Audio sign. proc. 32 kHz clock unit Low Power Auxiliary DAC’s Analogue Audio Micbias+ Audio det RTC + alarm On/off control

  12. High-level requirements for ME3 • Low to mid tier phone with EDGE capability • Main technologies CMOS090 and QUBiC4+ • Target 1 package, maximum 2 packages • Enabling the path to1 die in CMOS for ME4 • Main focus on size, component count and process diversity reduction, reaching BOM reduction at the same time

  13. Baseband - one page guideline • System target: GSM/EGPRS modem with integrated MRAM Integrated MRAM, which satisfies the mainstream • Architecture: SC ARM9xx, DSP RD16025 DSP and SC memory concept to be revisited in the light of MRAM concept • Technology: CMOS090 • Typicalimplementation: Package option for external bus interface (EBI) for higher tier(s) On-chip integrated voltage regulators Stereo Audio and AUX ADCs on die Digital RF interface, USB OTG Digital interface options for GPS (GIU), camera, etc.

  14. Transceiver - one page guideline • System target: GMSK and 8PSK modulation • Architecture: TX: Polar modulation concept RX: Near Zero IF receiver • Technology: QUBiC4+  4.5 mm² target die size • Typicalimplementation:SD FracN PLL for PM and AM by PA-control DAC High dynamic RX ADC to relax analog requirements (filtering and # of AGC-steps) Digital RF interface Passive integration (PICS) Integrated power supply

  15. PA/antenna switch - one page guideline • System target: GPRS/ EGPRS, MSC 12, QB • Architecture: Polar modulation; feed forward AM  AM and AM/PM pre-distortion may be needed • Technology: CMOS control + GaAs RF + Passi Si  alternative: QUBiC4+ and Passi Si (passive integration) – cost/performance trade-off • Typicalimplementation: Saturated QB PA for GPRS and EGPRS Integrated QB, low-loss antenna switch Wide dynamic, high accurate AM control via analog AM control signal Phase pre-distortion via look-up tables Digital RF; control interface part (only) – tbd Integrated power supply regulator

  16. Power management - one page guideline • Distributed power supplies (RF and BB) • Bulk of the power management on QUBiC4+ die • Adaptive Voltage Scaling for BB part • PowerWise • Tube (post regulation LDOs on CMOS090) • Partitioning for extra functionality has to be studied: • Charging driver transistor (up to 20 V, including charge via USB) • Backlight management (fun lighting, flash light, 20 V) • USB OTG transceiver • Battery connected supplies (voltage limitation or pre-regulation for RF and BB needed)

  17. OBIGO Play MMS WAP STK AT MMI JAVA HTTP AAC MP4 MP3 MIDI SPV IP DL Stack AGPS FS Audio Widget Video Audio Connec- tivity HWL/L1 Driver/ Handler DSP FW Boot ARM, ON-chip per Off-chip peripherals Sysol software – one page guideline

  18. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Summary

  19. 2.5/3G Nexperia PNX5220 MM baseband IC • Contains • ARM926 system controller (SC) with rich set of peripherals • Telecom DSP • Speech/Audio DSP • Several intercore and and top-level blocks • analog baseband and audio interface (BAI) • Process • 0.09 µm CMOS process for digital • 0.25 µm CMOS process for analog • Packages • Production: TFBGA, 320 balls, 4 rows, 0.5 mm pitch • Development: BGA376,1mm for digital; LQFP80 for analog

  20. GPS Radio UAF1572 BT-BB PCF87752 BT-Radio UAA3559 PNX5220 application diagram Stereo ADC Stereo DAC RF DAC GMSK Mod. Front end UAA3537 I&Q RF ADC hands free RFCU PNX5220 Keyboard 6x6 matrix KBD UAA3580 UAA3581 UMTS Modem PCF0501 jog dial JDI PC, Mouse, USB Stick, Camera, ... Saturn DSP2 (audio) EBI NFI SDI UART Burst FLASH, SRAM/PSRAM Saturn DSP1 (telecom) USB-OTG ATX ARM926 FCI MSI MMC Memory Stick Nand FLASH SPI3 GIU mobile SDRAM Imaging Subsystem SPI2 USIM IIC SPI1 UART SIM card Serial Flash IOM2 PMU PCF50603 PCF50606 Battery LCD PCF8880/90 Charge IC UBA2008 Sensor OM6802 Charger new block

  21. PNX5220 MM features • Increased processing power • effective MIPS x 2-2.5 • high-performance memory interface • accelerators for multimedia • Reduction of system cost • integration of multimedia features : MPEG4, camera i/f • no need for additional IC • possibility to use cheaper memories • Nand Flash + SDRAMs

  22. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Summary

  23. Nexperia mobile multimedia application ICs • Image processor PNX4000 • Targets cost sensitive camera phones • Real-time image capture + graphics features • A/V coprocessor PNX4004 • Targets entertainment phone segment • Enhancing visual user-experience by unique smart imaging & Display features • Application engine PNX4008 • Targets smart phone and gaming segment • High-end open-OS multimedia processoroptimized for Symbian v8

  24. PNX4000 image processor • Key features • Preview, capture, store JPEG images / MJPEG video clips • Streaming JPEG encode with variable compression ratio • Picture edition with transparency, icons animation • Scaling and Digital zoom (16x) • Sensor Interface with up to 1.3 Mpixels (30 fps in VGA) • Dual LCD support (max width=176, color depth = 65k) • Dedicated power management (10 mW preview, 10 µAstand-by) • Small footprint (7x7 mm TFBGA112) • Value proposition • Cost-effective solution for camera phones combining small footprint and low power consumption

  25. I²C IT BB PNX4000 Parallel IF YUV IF CS Ex : - OM6802 Ex : - Sysol (ARM7) LCD1 select LCD2 select Parallel IF Driver ex : - PCF8881 - PCF8835 Driver ex : - PCF8880 - PCF8833 PNX4000 system architecture • Sensor Interface up to 1.3 Mpixels, 30fps in VGA • Flexible Host Interface SPI or parallel (8080x or 68xx) • Support for 2 LCD (SPI or parallel interface)

  26. PNX4000 – product support • Standard Development Kit • IC + development boards • Application notes • Public API • Specification (function description) • Source code • Validation on Sysol mobile platform (ARM7 + Philips OS) • Optional • Public API customization • sensor, LCD display driver, on-site platform support • Customer applications support • JPEG decoder, MJPEG/MPEG4 transcoder

  27. PNX4004 AV coprocessor • Targets entertainment phone segment • Low latency viewfinder, still image capture and playback, • Picture editing • Audio / video clips capture and playback • Audio / video streaming • Enhancing visual user-experience by smart imaging & display features • Core audio / video engine • System peripherals • Imaging / display features • Based on ARM926EJ CPU, 208 MHz + SiHiveTM ERC • Flexible host interface, compliant to TS27.010 protocol • Embedded RTOS

  28. PNX4004 system configuration

  29. PNX4004 Video/Audio engine • Camera I/F supporting up to 2 Megapixel sensor • supports both YUV and RGB Bayer sensors • Real-time MPEG4 / H.263 HW accelerators • encoding / decoding up to 30 frames/sec CIF • adaptive deblocking post-processing filter for decoding • Fast JPEG image HW encoder / decoder • encoding / decoding of multiple stills/sec of 2Mpix • Audio support for video applications and MP3 player • AMR audio SW encoder / decoder • MP3 + AAC SW decoder • No advanced audio features > Baseband

  30. PNX4004 system peripherals • Memory interface • 32/16 bit SDRAM, max 128 MB ext. memory space, 104 MHz • NAND flash I/F, max 2 GByte, 8/16 bit devices • SD / MMC • Host interfaces • High-speed UART (900kbps) with flow control • Parallel I80/M68 (8 and 16 bit, supports muxed Addr/Data) • 2 audio interfaces • PCM/IOM-2 and I2S • General • 4 UARTs, 2 high & 2 low-speed UARTS - one supports IrDA • Fast I2C • JTAG debug, ETM9/ETB with 1k x 24 bits trace store

  31. PNX4004 imaging / display feature set • Enhanced Camera Signal Processor (eCSP) • Optimized for Mpix digital still performance • Auto Exposure, Auto White Balance and Auto Focus • Sketch, solarization, negative, sepia, B&W, embossing modes • Camcorder functionality • True continuous digital linear zoom • adaptive deblocking post-processing filter for decoding • Image stabilization • Video GFX renderer for capture overlays • Embedded main LCD controller • Drive RAM-less TFT or C-STN display, 16/18-bit RGB • TV output • Digital YUV I/F to external DENC IC

  32. PNX4004 imaging / display feature set • Graphics / Rendering • Overlay of several objects, stills, video, graphics, text • Programmable attributes per object: • Geometric transformations • Translation • Scaling • Rotation • Slant • Depth • Transparency level zoom GFX rendering Image stabilization

  33. PNX4004 imaging / display feature set • SiHiveTM Embedded Reconfigurable Computing core • Application-Specific-Instruction DSP • VLIW / Space Time Computing based • Benefits • Si efficiency ~ dedicated HW accelerators • Allowing low cost solution to Customization of Imaging / display feature set

  34. PNX4008 application engine • Targets high-end smart phone and gaming segment • performance + power consumption optimized • Dedicated audio system based on XpertTeak DSP • ARM926EJS floating point RISC processor, 208 MHz • includes Jazelle JAVA accelerator • High-performance 3D graphics processor / open-GL ES • HW accelerated JPEG/MPEG4/H263 video engine • HW accelerated security core • Host and OS independent • optimized for Symbian OS V8.0B with UIQ V2.1 • CMOS090, LFBGA320

  35. PNX4008 system configuration

  36. PNX4008 feature set (1) • Audio: • MP3, ATRAC3, dynamic compression and equalization, integrated Stereo Audio DACs • Video • JPEG HW decode, MPEG4/H263 codec, SP L0 to L3, Up to CIF 30fr/s, Video conference mode • Graphics • MBX 3D Graphics Accelerator, OpenGL ES1.0 compliant Performance @80MHz: 160Mpix/s, 1Mpolygons/s • Camera • max 4Megapixel input, YUV 4:2:2 format • LCD • Dual display support, max QVGA RGB 256K colors / 60fr/s

  37. PNX4008 feature set (2) • Security: • Discretix CryptoCell™; 5-15x HW acceleration: • PKI key exchange (RSA, ECC, DSS, DH), Symmetrical encryption (DES, 3DES, AES), HASH core (SHA-1, MD5), Random nr generator, Secret Crypto key • External Memory • 64MByte SDRAM supported • Direct NAND Flash support • Memory stick • SD / MMC • TouchScreen, Keypad • USB OTG (12Mbit/s) • I²C, SPI, UARTS (960 kbaud)

  38. SDK PNX4008 development kit • PNX4008 Applications Engine IC • Development and Integration board • Open-OS • Base port of Symbian V8B and UIQ, including components, middleware and sample applications • Software Development Kit • Compilers and IDE for system integration and application development • Supported by partners Metroworks, Teleca, Symbian

  39. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Conclusion

  40. Build-in DVB-T Antenna and MPCI receiver USB-1.1 port PCMCIA Vodaphone GPRS modem VGA LCD + Touch Screen + Stylus pen Built-in Speakers Local Buttons Internal CF Slot for Flash or HDD Built-in Lion battery Hotman DVB-T/GPRS portable devicePrototype @ CeBit 2004 • LCD (LB064V02) + backlight • Touch screen • Speakers 8 ohm / 2 Watt a piece • IO module with buttons and small LCD display • Battery (3 hours instead of 4) • Small PCB with USB plug, AC adaptor plug, on/off switch, rotary knob

  41. TV-Companion: 3-chip concept building on the programmable TV front-end De-mux partitioning Add-on Silicon Tuner Multi-standard Channel decoder Source decoder PNX0105 Display Baseband RF

  42. Add-on Programmable Multi-standard Channel decoder and De-mux Silicon Tuner MSP OFDM Programmable TV front-end add-on:for advanced phone using the available application engine Source decoding in the AE PES/IP Display Application Engine Base-Band RF

  43. Communication IC Design and IC Application - Agenda - • The Philips approach • Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones • Mobile multimedia solutions • Portable DTV/GPRS solution • Software solutions • Summary

  44. Summary • Leading-edge process technologies, AV software, system expertise, roadmaps • Leveraging our Nexperia™ platforms: • Capable of providing affordable full system solutions • Putting emphasis on multimedia functionality • Our IC and software technologies enable the world of the Connected Consumer

More Related