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Delamination of Stiff Islands on Stretchable Substrates

This study analyzes the delamination behavior of stiff islands on stretchable substrates, investigating factors like debonding at different strain levels and the effect of substrate compliance on critical island size. The research highlights how more compliant substrates allow for larger critical island sizes, impacting island crack and coating crack phenomena in flexible electronics.

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Delamination of Stiff Islands on Stretchable Substrates

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  1. Delamination of stiff islands on stretchable substrates Zhigang Suo Harvard University Lu, Yoon, Suo Int. J. Mater. Res. 98, 717 (2007)

  2. The future of knowledge? Information Display

  3. Hermetic coating Polymer substrate Mechanical Challenges Island crack Coating crack Metal fatigue Island debond Flexible electronics

  4. Island debond No debond at 25% strain Debond at 5.6% strain Bhattacharya, Salomon & Wagner, 2006 Lacour, Wagner, Narayan, Li, Suo, 2006

  5. Energy release rate depends on flaw size G a a Design criterion

  6. Initiation

  7. G Gss a Steady state h Suo and Hutchinson, IJF (1990)

  8. Converging debond Ligament length 2c He, Evans & Hutchinson, 1996

  9. Effect of substrate compliance on G(a)

  10. Gmaxovershoots Gss Overshooting Gss

  11. Critical island size With the same interface toughness and the same applied strain, more compliant substrate allows larger critical island size

  12. Summary • Islands debond when exceeding critical size. • Gmax overshoots Gss. • Critical island size is large when the substrate is compliant. Lu, Yoon, Suo, Int. J. Mater. Res. 98, 717 (2007)

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