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P14452: Systems Design Review

This document provides a comprehensive overview of the updated specifications and key developments in the systems design review. It details the revised morph chart, concepts under consideration, and action items focused on component selection such as microcontrollers, energy storage, and signal processing. It emphasizes the prototyping phase, materials evaluation, and circuit schematic capture. Target measurements related to high-pressure, high-temperature, and oily environments are highlighted, along with performance metrics for noise and frequency response.

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P14452: Systems Design Review

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Presentation Transcript

  1. P14452:Systems Design Review Take Two

  2. Overview • Updates • Engineering Specifications • Morph Chart • Concepts • Development • Presentation • Selections • Action Items

  3. New Specifications

  4. Updated Morph chart

  5. Concept Development Revisited

  6. Functional Decomposition

  7. Hardware Tree

  8. Power Sources

  9. Start/Stop Capture

  10. Sensor Connectors

  11. Sampling Rate Selection

  12. Device Mounting

  13. High Pressure solutions

  14. High Temp Solutions

  15. Oily Environment Solutions

  16. Data Storage

  17. Processing and Control

  18. Concepts Reinvented

  19. Concept 1

  20. Concept 2

  21. Concept 3

  22. Concept 4

  23. Concept Selection Revamped

  24. Datum: MSR145

  25. Pugh

  26. Chosen Concept

  27. Action Items Moving Forward

  28. Component Selection • Need to Choose • Microcontroller • microSD card • Ultracapacitor • Attenuator Op-amp • Power Regulator • Cable Connectors • Component Parts • Resistors • Capacitors

  29. Prototyping • Develop a Breadboard Design • Existing Materials • Processor Development Board • Signal Generator • Systems to Refine • Input Attenuation • Power Regulation • Software • User Configuration • Sampling Routine • Filter Routine • Storage Routine

  30. Materials Testing • Evaluate Materials • Metals • Aluminum and Steel • Plastics • Polysulfone • PVDF • PFA • Teflon PTFE • Composites • Fiberglass and Carbon Fiber • Target Measurements • Axial Strength (Pressure) • Elasticity (Pressure) • Thermal Conductivity (Temp) • Porosity (Oil)

  31. Schematic Capture • Circuit Schematics • Microprocessor I/O • Power Regulation • Input Attenuator • Simulations • Input Attenuator • Frequency Response • Attenuation Performance • Power Regulator • Noise Performance • Initial PCB Layout

  32. Questions? fin.

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