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Overview of Nanofabrication Techniques

Overview of Nanofabrication Techniques. Experimental Methods Club Monday, July 7, 2014 Evan Miyazono. Outline. Addition (deposition) Subtraction (etching, milling) Patterning. Deposition. figures of merit uniform conformal/edge coverage deposition temperature deposition material

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Overview of Nanofabrication Techniques

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  1. Overview of Nanofabrication Techniques Experimental Methods Club Monday, July 7, 2014 Evan Miyazono

  2. Outline • Addition (deposition) • Subtraction (etching, milling) • Patterning

  3. Deposition • figures of merit • uniform • conformal/edge coverage • deposition temperature • deposition material • lattice mismatch & / built in strain

  4. Deposition • Thermal evaporation • e-beam evaporation • Sputtering

  5. Other deposition • chemical vapor deposition (CVD) • vapor liquid solid (VLS) method of nanowire growth

  6. Deposition tricks

  7. Etching • figures of merit • isotropy/anisotropy • selectivity • redeposition? • check volatility/solubility of products

  8. Dry Etching CAIBE • reactive ion etching (RIE) • inductively coupled plasma (ICP) • sputtering • includes FIB Ga+ milling • chemical assisted ion beam etching RIE ICP RIE FIB

  9. Exotic Dry Etches Angled ICP Bureket al., Nano. Lett. 2012, 12, 6084-6089

  10. Wet Etching • often more selective & isotropic • some etch along crystal planes • ion beam enhanced etching KOH etching of silicon LiNbO/YSO He+

  11. Patterning • e-beam lithography • photolithography • patterning a uniform layer • polymer used as etch mask • patterning something hard to etch? • deposit on polymer and lift-off unwanted material

  12. Beating patterning limitations • cheating positive feature limits with sacrificial masks & conformal deposition • cheating negative feature limits with built in stress and

  13. Case Study: SOI Silicon on insulator Wafer bonding: plasma clean + heat + pressure

  14. My GaAs/YSO device Fabrication photoresist GaAs Spin coat photoresist AlGaAs HF undercut GaAs Transfer to REI host e- Develop resist Dry etch Strip photoresist apply e-beam resist Strip resist Direct write

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