1 / 14

B-staging of toughened epoxy composites by Fred Arnold and Steve Thoman

B-staging of toughened epoxy composites by Fred Arnold and Steve Thoman. Elgin Bravo February 09, 2001. Overview of B-stage process for LLP. Reduce package size by wirebonding close to the edge of the die. Backcoat wafers with a B-stage epoxy.

taini
Télécharger la présentation

B-staging of toughened epoxy composites by Fred Arnold and Steve Thoman

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. B-staging of toughened epoxy compositesbyFred Arnold and Steve Thoman Elgin Bravo February 09, 2001

  2. Overview of B-stage process for LLP • Reduce package size by wirebonding close to the edge of the die. • Backcoat wafers with a B-stage epoxy. • Delamination of die from DAP due to high humidity and temperature. • Understand structure and properties of epoxy.

  3. About the authors • Fred Arnold and Steve Thoman affiliated with Naval Air Warfare Center • Polymers and Composite branch. • 28th International SAMPE conference Seattle WA, 1996

  4. Objectives • Characterize cure behavior and glass transition temperature of Hercules 8552 sulfone toughened B-stagable epoxy.

  5. Definition of B-staging • To cure an epoxy to a pre-determined degree of chemical conversion. • Stage o Chemical conversion • Green 0 • B-stage <0.29 • C-stage <0.90

  6. Equipment • Dynamic Mechanical Analyzer (DMA) • glass transition • secondary transitions • gelation • vitrification • Differential Scanning Calorimeter (DSC) equipped w/ modulated DSC cell (MDSC) • specific heat capacity • heats of transition • temperature of phase change

  7. Experimental • Sample size: • 3-5 mg for resin • 25-35 mg for B-staged • Heating rate • 3oC/min • Modulation frequency • 0.5oC

  8. Glass transition temperature

  9. MDSC results compared to DSC

  10. Tg of green epoxy at 23oC T(t) = To + Bt dQ/dt = CpB + f(t,T)

  11. Tg as a function of conversion

  12. Conversion and Isothermal cure

  13. Results • MDSC produces more accurate results • Reversing component eliminates effect of residual heat release near Tg • Optimum B-stage temperature obtained to ensure mechanical strength at RT

  14. Research comparison • Understand Tg using DSC • Degree of chemical rxn for B & C stage • Die delamination • MDSC not available

More Related