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Update on Lab activities and sensor procurement

Update on Lab activities and sensor procurement. Mathieu Benoit. Outline. Sensor production at CNM Sensor production at Micron Semiconductor Progress on Lab activities (Julia Rientenbach and Tim Janssen ) Future plans. Sensor production at CNM.

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Update on Lab activities and sensor procurement

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  1. Update on Labactivities and sensorprocurement Mathieu Benoit

  2. Outline • Sensor production at CNM • Sensor production at Micron Semiconductor • Progress on Labactivities (Julia Rientenbach and Tim Janssen ) • Future plans

  3. Sensor production at CNM • An order has been passed for a sensor production followingLHCb CNM mask for 10 wafers (thanks to ATLAS IBL!). • Sensorswillbeprocessed on high-resistivity SOI wafers 230um • Wafer contains single, double and triple timepix-footprintsensor • Goal is to obtain p and n readoutsensors for test in beam and laboratory and assembly of first prototypes

  4. Sensor production with Micron semiconductor • Micron semiconductor has interest in producing and bumb-bonding of medipix type sensors, isagreeing to help us pursue the production of ultra-thin pixel sensors (~50um). • The production as proposedwilldeploy in 3 phases : • Phase 1 : Production on 6 in wafers using Prague-Liverpool maskset, plans are for p-in-n and n-in p 150um sensors • Phase 2 : Production of a dedicatedmaskset for CLIC, first draft of the maskdrawn by Micron • Phase 3 : Production of the sensor in bothflavor on ultra-thin wafers, bonding of the assemblies

  5. SmallPix and CLICPix • We have the possibility to integrate a SmallPix and a CLICPix design in the Micron 4in production and CNM 2013 production • Weneed to determine the geometry of the pixel sensor to be sure itcanbematched to the ASIC • Passivation opening • Edgeregionwidth • GroundingRing

  6. Futur plans • We are nowready to perform calibration of the I10-W0015 chip (used in TB), wewillperform the measurementsnextweek • Nextstepisanalysis and extraction of the surrogatefunction for this chip (Julia) • Application of this calibration to the TestBeam data (Mathieu and Julia) • In parallel , wewillbeproducingdata sets of GEANT4 simulation reproducing the TestBeam Data using the Timepix Digitizer (Mathieu, Julia and Tim) • Finally , wewillwork on a MC charge transport simulation package , adaptedfrom an existingalgorithm, to provide and more detailed simulation of the transport process (Tim).

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