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This document presents a thorough overview of the design and simulation of a multi-volume detector (MVD) for advanced particle physics experiments. Key features include silicon detectors, hybrid pixel detectors, and double-sided microstrip detectors with over 11 million pixel readout channels. The mechanics of the detector support, cooling concepts, and the integration of lightweight structures are detailed. Performance metrics, including momentum and vertex resolutions, are analyzed, demonstrating significant improvements with the MVD. This analysis highlights the importance of the MVD in enhancing background suppression in open charm channels.
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r / mm Target 4 rmax= 150 mm 3 2 135 1 Beam 95 1 55 2 3 4 25 5 6 -230 -170 • 6 disk layers • 4 barrel layers • Silicon detectors: • Hybrid pixel detectors • Double-sided microstripdetectors 20 40 70 100 160 230 z / mm
Target Beam • Implementation • Approx. 11 million pixel readout channels • Approx. 200. 000strip readout channels
Detailed CAD model Detector simulation Detailed model including routing Active detector volumes only
Overall routing concept (7.6 … 15.0) cm Circular occupancy Bundling (top/bottom) Beam Circular or bundled Patch Panels 60 z / cm -100 -40 -23 0
Main MVD parts Overall detector integration 2 pixel half-barrels 2 strip half-barrels 6 pixel half-disks 2 strip half-disks MVD attachment Global frame (MVD): 2 halves 3 point fixation Central support frame
Mechanics • Cooling concept • Coolant: Water (18°C) • Vacuum-operated mode using hydrostatic pressure • Active part: ext 2 mm pipe (Ni-Co alloy) • Upstream routing: ext 4 mm flexible plastic pipes Barrel layer Infrared image Micro fittings: Thermoplastic resin 31°C 23°C Glue: Epo-Tek H70 Glue: Master Bond Glue: ArticSilver Thermal FEM analysis Tmax = 37.2°C Tmax = 28.2°C Tmax = 30.4°C Test setup
Mechanics • Lightweight support structures Local support (barrel modules) MVD half support frame R = 137 mm L = 460mm S = 3.8 mm • Sandwich structure: (Carbon – Rohacell – Carbon) • Stiffening structure:2...4 layers of carbon fibre (400 m) HTC foam half disk embedding cooling pipes Barrel layer support
Detector development: Front end electronics • ToPix: Custom designed readout chip • Specifications • Untriggered readout • High output bandwidth • 116 110 pixel matrix (100 100 m2 cell size) • Time over threshold technique (TOT) for amplitude measurement • Low power consumption (< 500 mW/cm2) • CMOS 130 nm technology • Measurements • Testing procedures • Total ionizing dose test • ToPix prototype connected to epi-sensor
Detector development • Pixel sensor • Specifications • Epi-Silicon layer: (50 ... 100) m • Thinned Cz silicon substrate: 50 m • Alt.: Thinned oxygen enriched silicon • Measurements • Sensor characterization • Radiation damage test (neutrons)
Count rates • Maximum countrates / frontend: (1 ... 10) Mevts/ s • Integrated count rate (pixel part): 1.8 Gevts / s • Integrated count rate (strip part): 1.2 Gevts / s Full MVD: 3.0 Gevts / s
Spatial coverage • 2D mapping: Number of MVD points / track • Design optimization for a minimum of 4 track points Active MVD volumes Number of MVD points / track
Radiation length studies (Geantino) • 1D profile scan for polar angle • Minimized material budget for polar angle < 140° • Higher values above 140° due to upstream routing • Slight enhancement 40° due to lead-out of pixel disk services Detailed MVD model < 1% / layer ( < 10%)
Momentum resolution 1 GeV/c pions (0;0;0) (p) without MVD = 2.6 % (p) with MVD = 1.4 % pt p (pt) without MVD = 2.9 % (pt) with MVD = 1.4 % • Improvement by 50% z xy • Single track resolution • No resolution along z without MVD
Primary vertex resolution 15 GeV/c • Vertex resolution (6.57 / 7.50 / 8.50) GeV/c Primary and secondary vertex resolution:x,y 35 m z 100 m z 65 m z xy
Physics analysis • Reconstruction: d0 d0 Conservative estimate 6 orders of magnitude lower decay length Scaled back- ground Vertex cut: S/N =1 S/N 2 23% efficiency arXiv:0903.3905v1 [hep-ex] Background suppression for open charm channels impossible without MVD