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Solving Microelectronic Obsolescence: Die Reclamation and Reassembly Solutions

The challenge of microelectronic obsolescence, especially under DMSMS pressures, necessitates innovative solutions. Our die reclamation and reassembly service address component scarcity by providing a reliable, high-quality method to extract and repackage IC chips. This method not only enhances the longevity and reliability of components but also leverages commercially available parts to replicate discontinued products. With significant improvements in MTBF and the potential for cost-effective manufacturing, we present a proven solution to support military and commercial applications undergoing rapid obsolescence.

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Solving Microelectronic Obsolescence: Die Reclamation and Reassembly Solutions

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  1. Solving Microelectronic Obsolescence Through Die Reclamation, Re-Assembly & Test A Proven Solution to Provide Management Support for Diminishing Manufacturing Sources and Material Shortages (DMSMS) or the adaptation of COTS product re-packaged for High Temp use.

  2. Overview - Causes for Obsolete Components - How Force’s Die Extraction and Reassembly Service Supports “Parts Substitution” - Die Extraction and Reassembly Photos- Die Extraction Identical Quality and Improved Component Reliability - Die Extraction and Reassembly Benefits for Solving Component Obsolescence Issues - Summary - Contacts for Additional Information

  3. Causes for Obsolete Components - Commercial system lifetimes are often 2 to 3 years. - Military system lifetimes are often 20-30 years. Many commercial components used in these systems are obsolete the day that the military systems are introduced and new commercial replacement ICs are already obsolete. - DoD Requirement to use Commercial Off The Shelf (COTS) solution wherever possible for military systems creates a demand that is not supported by commercial manufacturers - Heavy systems usage in ongoing conflicts increase wear-out ◦ Current inventory status of components used in a Legacy Avionics Program (27%) ◦ In 1996, obsolescence ranged from 10%-20% ◦ In 2005, obsolescence ranged from 20%-30% Source: i2 TACTRAC (03/28/05) Source: ARINC (06/28/06)

  4. How Die Reclamation and Reassembly Service Supports “Part Substitution” - Remove die from plastic or ceramic packages without damaging the die in any manner - Die can then be reassembled into ANY available Ceramic or plastic packages (multiple package footprint varieties) - Create Multi-Chip Modules (Hybrids) from available components - Reassemble extracted die from any packages into hermetically sealed ceramic packages - Extends component (MTBF) reliability necessary for rugged and/or high temperature environments - Utilise commercially available IC’s in plastic packages to replicate discontinued ICs in ceramic packages ◦ Potential Service for Management of Diminishing Manufacturing Sources and Material Shortages (DMSMS)

  5. Example of Bond Pads from an Extracted Die - Extraction Technology Has Been Used For Many Years in the Commercial Industry - Relies on Chemical and Mechanical Processes Which Are No More Aggressive Than Those Used During Wafer Fabrication - Clean bond pad and original gold ball bond - No inadvertent etching - Clean and uncontaminated die surface

  6. SEM Photo of Re-bonded Ball Bond - Original Gold Wires are Removed at the Top of the Original Ball Bonds - Clean, Uncontaminated Gold Surface is Used for the New, High-Adhesion Wire Connection, or Compound Bond - New Gold Ball Formation is made to Original, Pristine Bond New Bond Original Bond

  7. Ball Bond Qualification Data - The New Compound Bond Adheres Extremely Well to the Existing Original Gold Ball Bond has Identical Quality - Bond Pull Data is Indistinguishable for Pre and Post Die Extraction - Bond Pull Data of Re-Assembled Device Meets or Exceeds MIL-STD-883H Criteria Mean – 3 Sigma OEM Gold1 = 4.374 FTL Gold1 = 5.075gFTL Gold2 = 4.342 g MIL-STD-883H Lower Spec Limit = 3.0 g

  8. Identical Quality - New Die Attach Adherence Identical to the New Package substrate/Cavity - Die Shear Data is Indistinguishable for Pre and Post Die Extraction (Typical 2X Standard Minimum MIL-STD-883H Die Shear Requirements) - As previously outlined new Bonding meets or exceeds Mil-Std-883H bond pull requirements

  9. Improved Reliability • Accelerated Life Test Data (250C) Comparison Study - Semiconductor Reliability is Determined by the Arrhenius Equation: k = Ae -Ea/RT - A Popular Commercial Plastic IC Survived Only 6 Hours at 250C - Die from Those ICs which were Extracted and then Re- Assembled Into a Ceramic, Hermetic Package Survived 1500+ Hours at 250C with Materials and Processing Techniques • This is a 250X Lifetime Improvement Under Identical Condition • Ideal for High Temp applications.

  10. Benefits of using Die Reclamation and Reassembly for IC •Process Scales Well for Volume Manufacturing - High Volume, Cost-Effective Extraction of Plastic Components has been Achieved - Functional, Extracted Die can be Re- assembled Using Low-Cost, High-Volume IC assembly Facilities - Added Benefit of Providing Inspected, genuine OCM Silicon To Eliminate the possibility of Counterfeit Devices

  11. Benefits of using Die Reclamation and Reassembly for IC - Many more commercial component sources are available to fill need for obsolete microelectronics - Reduces engineering cost/time to locate/research obsolete components - Repackage plastic packages into otherwise unavailable ceramic components for military/Oli/Gas systems requiring rugged or high temperature/vibration component survivability • Added Benefit -Reduces potential need to buy full wafer for prototype Hybrid development if pre packaged commercial components are readily available for die extraction

  12. Summary - Die Extraction and Re-Assembly is an Excellent Solution to IC Component obsolescence within Military Systems –Problem Solved - Military Systems have 20 –30 Year Life Cycles - Commercial ICs have 2 –3 Year Life Cycles - Increased COTS Component Content in Military Systems Exacerbates Obsolescence Issues - Die can be Removed from ANY Plastic or Ceramic Package Without Damaging the Die While Maintaining FULL-Functionality - Functional Extracted Die can be Re-Assembled Into ANY Plastic or Ceramic Package or Hybrid Module - This Technology has been Proven in the Commercial Industry - The Chemical and Mechanical Processes Used are no More Aggressive than those Utilised in Wafer Fabrication

  13. Summary (Continued) - This Process can be Applied in High Volumes –Thousands to Millions of units - This Technique Insures Genuine OCM Silicon to Eliminate the Possibility of Counterfeiting - Quality Achieved is Identical or Better Than the original Plastic Packaged IC - Die Shear and Bond Pull Data are Identical for Pre Extraction and Re- Assembled IC’s - Accelerated Life Test Data of Plastic to Ceramic Shows Improved Product Lifetimes at High Temps - This Technology is a Proven Production Solution for Obsolescence Problems

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