2001 ITRS

Slide 1:2001 ITRSFactory Integration ITWG

Jeff Pettinato, Intel

Slide 2:Agenda

Scope and Factory Drivers Difficult Challenges Need for Integrated Solutions Key Technology Requirements Solutions Being Driven by Technology Requirements Summary

Slide 3:Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes

Many International members have contributed to FI

Slide 5:Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas

Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment Factory Operations Policies and procedures used to plan, monitor and control production Direct factory labor Test Manufacturing Prober, Handler, and Test Equipment Manufacturing processes to test wafers and chips

Slide 6:New Elements/Focus in the 2001 Factory Integration Chapter

New Factory Operations metrics as key targets for other factory functional areas to solve in an integrated fashion 1) Factory Cycle time, 2) multiple lots per carrier and single wafer processing, 3) labor efficiency, 4) time to money Focus on e-Factory capabilities to solve Production Equipment Overall Equipment Efficiency (OEE) through Use of Internet, process control, rich data sources, and standards Refinement of Direct transport solutions for 300mm Expanded facilities section with revised technology requirement and potential solutions New Test section to address equipment & manufacturing Introduction of a Fab factory Cost Model based on 300mm, 20k wspw, high volume factory (key focus to extend in 2002) Discussion on 450mm wafer size timing and Mfg Paradigms

Slide 7:2001 Difficult Challenges

Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with post CMOS novel devices 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion < 65nm after 2007 > 65nm through 2007 Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.)Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.)

Slide 9:Key Factory Operations, Production Equipment, and Facilities Technology Requirements

Production Equipment Factory Operations Facilities

Slide 10:Key Material Handling, Factory Info and Control Systems, and Test Mfg Technology Requirements

Factory Info And Control Material Handling Test Mfg

Slide 11:Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Slide 12:Direct Transport Concepts for Tool to Tool Delivery � Production Need date is 2005

Concept #1: Integrated Overhead Hoist Transport (OHT) systems Concept #2: Integrated Overhead Hoist Transport (OHT) systems Conveyorized transport Back

Slide 13:Agile Manufacturing Means�

Quick turn around [*faster cycle] time for production Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume Which can be Realized by� Internet technologies for B2B, Factory to Factory, Internal factory connectivity and communications Supply Chain Management (SCM) Integrated Planning, Scheduling, and Real Time Dispatching Flexible Material Handling and Data Automation Systems Single Wafer Control and Tracking Multiple lots/single wafer control in equipment module (group)

Slide 14:Carrier and Wafer Level Control Concepts for Rapid Material Movement and Processing

Process Tools Process Tools Stockers OHT Loop Stocker robot interfaces directly with Sorters and Metro equip Concept #1: Sorter and Metrology linked with Stockers Back Concept #2: Connected Equipment Front End Modules for Rapid Wafer processing and Inspection

Slide 15:Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Slide 16:Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity

Legend:

Slide 17:Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Slide 19:e-Manufacturing Hierarchy for Connectivity

firewall Semiconductor industry must continue to rapidly leverage mainstream technologies to reduce cost/complexity/integration time

Slide 20:Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality

Slide 22:Some Key Messages

1. Rapid changes in process technologies, business requirements, market conditions, and accelerated ramps have made factories more complex and difficult to integrate 2. Future factories must be agile to meet rapid technology and business changes with cost effective solutions 3. Overall Equipment Efficiency must be drastically improved Equipment at each tech node must meet throughput and uptime metrics Solutions to improve utilization must be developed and implemented 4. Standards have been effective in 300mm. Cycle time to create and deploy must be drastically reduced for the future 5. Integrated Solutions are essential to meet needs 6. e-Factory concepts are being developed to solve complexity, integration and OEE issues Leverages the internet and rich data sources to achieve pervasive process control, fast lot cycle times, on-line equipment repair, and rapid lot delivery using factory wide scheduling and dispatching

Slide 23:Backup Area

Slide 24:Understanding & Managing Factory cost is a Key Focus for 2002+(Fab Capital Cost Breakdown)

Material Handling Systems = 3% of Total Capital $81M for $2.7B factory Wafer and Reticle Carriers Carrier ID readers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Software & computers within the equipment Production Equipment = 80% of Total Capital $2,160M for $2.7B factory Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots Load Ports Installation, but not qualification Software & computers within the equipment Facilities = 15% of Total Capital $405M for $2.7B factory Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Support buildings (Caf�, office, parking) Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Includes site prep, but not land and off-site dev costs Assumptions Total Capital Cost = $2.7B Total Capacity = 40k wspm 300mm wafer size 130nm technology Factory Information & Control = 2% of Total Capital $54M for $2.7B factory Manufacturing execution systems Decision support systems Process Control systems Planning systems, Schedulers, Dispatching Material Control, document management systems Computers, databases, software outside equipment Baseline Model from 2001 Roadmap

Slide 25:Factories Must be Better integrated to solve Difficult Challenges