P13623: Conductive Heat Transfer Lab Equipment

1. P13623: Conductive Heat Transfer Lab Equipment Detailed Design Review May 2nd, 2013

2. Project Participants Project Sponsor : RIT KGCOE, Chemical Engineering Dept. Dr. Karuna S. Koppula Mr. Paul Gregorius MSD 1 Team Guide: Michael Antoniades Project Members: • David Olney - (ChemE) Project Manager • Todd Jackson - (ME) Project Engineer • AlyshaHelenic - (ChemE) Documentation Engineer • Edward Turfitt - (ChemE) Design/Concept Engineer • Charles Pueschel - (ChemE) Data Acquisition Specialist • Ian Abramson - (ChemE) Customer Liaison

3. Agenda • Introduction  • Quick recap of objective and customer needs  • Recap of system design review feedback  • Main problems that were addressed  • Detailed Design  • Review final design  • Talk about the improvements  • Talk about overall functionality   • Discuss educational value  • Review pros and cons  • Controls and electronic schematics  • High level overview of functionality  • LED visual  • Data acquisition • BOM  • Indicate high cost items  • Review material disposition  • Risk Assessment  • High level concerns  • Test and Assembly Plans • Questions

4. Project Overview Problem Statement: • Build an apparatus that can demonstrate thermal conductivity reliably to students for educational purposes. Resources: • The only limitation we have is the set budget for the project. • (space, cart, current lab equipment, donations) excluded from budget. Expectations: • The purpose of this detailed session is for constructive criticism, and validation by the customer for some of our final design that we have derived.

5. Heat Transfer and Thermal Conductivity • Heat transfer can take place from three methods (Conduction, Convection , Radiation). • The most valuable method to calculate a constants for one specific mode of heat transfer is to reduce or eliminate the other two modes.

6. Customer Needs

7. Engineering Specifications I

8. Engineering Specifications II

9. Functional Decomposition

10. System Design Review Recap Key Features • Device will contain use a disk heater, and cold plate to induce a heat gradient. • Ability to use different length samples with multiple shapes and sizes. • Ability to use different insulations for educational purposes. • Usage of a DAQ and labview. • Transparent outer shell to see inside.

11. System Design Concerns • Thermocouple mounting • Inserting samples • Functionality (having a visual model of our design to convey exactly what we are building and how it will function)

12. Detailed Design

27. Controls & Electronics Overview

28. Schematic

29. Temperature Sensors • Higher Temperature Thermistors • Operating Temperature Range of -55°C ~ 200°C • Accuracy of ±1% • Lower Temperature Temperature Sensor • Operating Temperature Range of -40°C ~ 125°C • Accuarcy of ±0.5°C

30. Other Sensors • Pressure Sensor (100 lb) • Application of proper pressure to the samples for good contact. • Current Sensor • Current rating of 25 A • Magnetic Door Sensor • Detects if door is left open and signals to close the door while running experiment to prevent convection losses.

31. Visualizing Data • LCD Screen • Backlit LCD screen to display temperature readings for manual data collection. • Labview • Display temperature readings and digital data collection. • LEDs • Visualise the temperature difference across the sample.

32. Improvements • Educational Value • Dynamic, can vary: • Size, shape, and material of sample • Type of insulation • Orientation of instrument • Contact resistant • Cooling fluid • Visual • LED lights to indicate changing temperature of the sample • Plexiglass slides to allow for viewing inside • Data Collection • Manual through LCD screen or through LabView • Thermal Conductivity Calculation • Vary heat flux or temperature • 2. Ease of Use (Intuition) • Open-fail safety feature • Pressure sensor to prevent over-tightening • Ability to remove side panel for easy access • Adjust temperature sensor placement after sample placement • 3. Originality • Dynamic • Liquid boat option

33. Bill of Materials - Main

34. Bill of Materials - Electronics

35. Bill of Materials - Structural

36. Temperature In Sample versus Length • Assumptions: Steady State, No conduction or convection from the air on the sample. q = Q/A =-k(dT/dx) Given Targets: Q = 500 W, Target ΔT = 120 K Chosen Parameters: T0 = 273 K, D = ¾”, L = ½’

37. Bill of Materials - Sample Bill of Materials – Total

38. High Cost Items Heater - $45.79 Cold Plate - $100.80 Temperature Controller- $146.91 DAQ - $58.94

39. Assembly Overview • Week 10 begin ordering parts • Parts should arrive over the break and will be stored until the fall semester. • Build all mechanical parts first then begin assembly of the mechanical press by building the frame first, drilling and threading all holes and parts assembling the top last • Enclose the structure with plexi-glass. • Once assembled confirm that the device will be operational and will function as desired. • Start assembling electronic components and assembling them to the frame etc. • Begin testing of the device and ensure everything is running optimally. • Begin improvement phase for device performance.

40. Test Plans: Cold Plate

41. Test Plans: Heater

42. Test Plans: Container

43. Test Plans: Sensors and Operation

44. Test Plans: Electrical and Controls

45. Risk Assessment

47. Project Schedule for Quarter

48. MSD I and MSD II Goals and Deliverables Project Organization Define Customer Needs and Specs Develop Concepts Create System Level Design Create Detailed Design • Hold System Design Review • Revise design based on Review • Create test and assembly plans • Write BOM • Order Materials • Hold Detailed Design Review Week 1 - 2 Week 2-10 Update Project Plan with parts obtained Week 10-13 Design Verification Week 12-14 Write Technical Paper Week 14 Create Poster Final Presentation • Execute test plans • Build system • Verify design through testing

49. Questions?