Understanding Thin Films in High-Tech Industries: Techniques and Applications
This course delves into the fundamental technologies underpinning high-tech industries, focusing on thin films and their deposition and patterning techniques. Topics include basic thermodynamics, vacuum deposition methods, and the structure of essential devices like computer chips. We explore innovations in magnetic storage, optical switches, micro-machines, and various deposition techniques, such as physical vapor deposition and chemical vapor deposition. Students will also investigate real-world applications, generating insights into the future of technology by analyzing five different devices or structures that rely on thin film coatings.
Understanding Thin Films in High-Tech Industries: Techniques and Applications
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Presentation Transcript
Section I: Motivation and introduction The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning.
Basic thermostat and vacuum tech sources deposition morphology Outline of the course
Example: Cross section of a computer chip
Magnetic storage • ---towards terabits/in2 • C. Ross, Annu. Rev. Mater. • Res. 2001. 31:203-235. • Three strategies: • exchange-decoupled grains • (conventional) • In-plane patterned media • Perpendicular patterned media
1 “Photonic bandgap: woodpile structure” (Professor S. Lin, RPI)
Optical switches: • MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent) MEMS
Mini-machnines (Micromechanical systems): actuator, resonator, valve, damper, motor…. Wu (2002) Cleland (2003) Industrial Physics (2002) microns Micro-mirror arrays--Lucent (2001)
substrate thickness monitor vapor source pump Physical vapor deposition: thermal evaporation, e-beam evaporation, sputter deposition, laser ablation, ion beam deposition Base pressure --vacuum seal, outgasing, contamination, pumps Deposition rate (nm/s) --source T, vapor pressure, impinging rate Film structure --morphology, crystal orientation, substrate T, uniformity
Ar H2 Ar precursor CF CF 3 3 O C C O - - O O CH 2+ Pd HC Substrate Heater C O C O Pump CF CF 3 3 Chemical vapor deposition: thermal CVD, atomic layer deposition Pressure, T (source and substrate), flow rate, deposition rate, pulse duration, film properties
+ - OH- wafer H+ e- Cu2+(EDTA) Cu2+ SO42- SO42- glyoxylic acid wafer anode Cl- Solution based deposition: electrochemical deposition (ECD), Electroless deposition (ELD) electrochemical deposition Electroless deposition (HO2CCH2)2NCH2CH2N(CH2CO2H)2 T~70o Room T
Home work. 1. (Deadline: Sept 7, 8am) Describe briefly five different devices or structures (with figures or drawing) that require extensive thin film coating work. (One page per device.)
