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GTK General meeting

GTK General meeting. Michel Morel CERN PH/ESE/FE. GTK assembly carrier equipped with µchannel cooling. Top view. Bottom view. GTK carrier assembly specifications. !! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules

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GTK General meeting

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  1. GTK General meeting Michel Morel CERN PH/ESE/FE

  2. GTK assembly carrier equipped with µchannel cooling Top view Bottom view GTK General meeting Louvain M.Morel

  3. GTK carrier assembly specifications !! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules µ via technology board is foreseen around the readout chips Each readout chip powered by 3 different power supplies High current in the power supplies (25A) GTK General meeting Louvain M.Morel

  4. GTK carrier assembly Bloc Diagram 12 X 3.125 Gbps Parallel Optical link P CLK LVDS GTK Readout ASIC 0 Precision CLK OC-12 Receiver SY89113U Fanout Buffer SO-3 & Ser Conf ZL60113 TRANSMITTER GTK Readout ASIC 1 Dig CLK LVDS GTK Readout ASIC 2 Dig CLK OC-12 Receiver SY89113U Fanout Buffer SO-3 & Ser Conf ZL60113 TRANSMITTER GTK Readout ASIC 3 Ser Conf LVDS GTK Readout ASIC 4 ZL60114 RECEIVER S0-3 & Ser Conf ZL60113 TRANSMITTER Serial Conf GTK Readout ASIC 5 12 X 3.125 Gbps Parallel Optical link GTK Readout ASIC 6 Reset LVDS S0-3 & Ser Conf ZL60113 TRANSMITTER SY89113U Fanout Buffer RESET GTK Readout ASIC 7 GTK Readout ASIC 8 JTAG S0-3 & Ser Conf ZL60113 TRANSMITTER GTK Readout ASIC 9 A<3..0> Adress Global_Reset 10 x Test input ----------------------------- 10 x SEU 10 x Temp Monitoring 10 x Test output 10 x 1V2 A 10 x 1V2 D 10 x 2V5 D 1 x 3V3 1 x 5V Power Supplies GTK General meeting Louvain M.Morel

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