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Committee Chairman Council Environmental Issues Update

Committee Chairman Council Environmental Issues Update. February 2004. Manufacturing Issues. Toxic Release Inventory Reporting IPC still seeking burden reduction EPA White Paper Proposal January 2005? TRI Reporting on Lead Science Review expected completion Summer 2004? 2005?

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Committee Chairman Council Environmental Issues Update

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  1. Committee Chairman CouncilEnvironmental Issues Update February 2004

  2. Manufacturing Issues Toxic Release Inventory Reporting • IPC still seeking burden reduction • EPA White Paper • Proposal January 2005? • TRI Reporting on Lead • Science Review expected completion Summer 2004? 2005? • 1,252 Form Rs were filed by electronics companies • 70% reported less than one pound of lead released

  3. Manufacturing Issues RCRA (Waste Management) • Definition of Solid Waste (includes hazardous waste) • Proposed Limited Exclusions for Recycling • IPC Urging Broader Rule • Final rule, Spring 2005 • F006 Sludge Rule • Proposal August 2004?

  4. Product Issues • Increasing Regulations • WEEE/RoHS type restrictions • California • China • Massachusetts ? • Wisconsin ? • Brominated Flame Retardants • CA • Maine

  5. Materials Declaration Handbook • Supply Chain communication of materials of concern • Increasingly demanded by OEMs • Chaired by John Sharp, Teradyne Connection Systems • Final Draft

  6. Lead Free Solder LCA • IPC and EIA partnering with the US EPA • Project Goals • Evaluate the relative environmental impacts of Sn/Pb solder and Pb-free solders • Evaluate the effects of lead-free solders on recycling and reclamation at EOL • Assess the leachability of Pb-free solders and their potential environmental effects • Overview presentation: 11 am Tuesday • Draft report will be posted for public review at www.cleanproducts.org • Final Report Spring 2004 

  7. Reflow Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu) Sn/Ag/Bi (42 Sn/1.0 Ag/57 Bi) SnAg/Cu/Bi (96 Sn/2.5 Ag/0.5 Cu/1.0 Bi) Wave Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Cu (99.2 Sn/ 0.8 Cu) Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu) (Not in Presentation) Solders Selected for Evaluation

  8. LCIA Results Impact category SnPb SnAbCu SnAgBi SnAgBiCu Nonrenewable resource use Lowest Highest Renewable resource use Lowest Highest Energy use Lowest Highest Landfill space Lowest Highest Global warming Lowest Highest Ozone depletion These results are currently undergoing final review Lowest Highest Photochemical smog Lowest Highest Acidification Lowest Highest Particulate matter Lowest Highest Eutrophication Lowest Highest Water quality Lowest Highest Public chronic non-cancer Lowest Highest Public cancer Lowest Highest Occupational chronic non-cancer Lowest Highest Occupational cancer Lowest Highest Aquatic toxicity Lowest Highest :

  9. What Study Does Not Address (partial limitations to scope) • Excludes performance and economic considerations • Assumes releases = exposure • EOL Issues • Bismuth solders present both a technological and economical problem to recycling (did address in BSA model) • Strict definition of lead-free (0.1%) may prevent recycling • Equipment life?

  10. Product Issues Lead-Free Labeling • Various lead-free labeling being used • Need a global lead-free labeling standard • IPC blue ribbon committee • Labels for bare boards and assemblies • Working with JEDEC on joint-standard for component labeling • Draft proposal to be finalized this week

  11. Product Issues Lead-Free Labeling • Indicate Lead Free Solder family • Tin-lead boards and components have no assigned label (default) • Optional additional board markings • Halide-free base resin • Conformal coating used after assembly

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