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Research:

Top Layer (Optimize TiN- % MoS2 Composite Layer). TiN x=~1 ( Where X1=0<X2 <…<Xn=1). TiN x ---------Graded Interlayer. Ti-------------Bond Coat. Substrate.

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Research:

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  1. Top Layer (Optimize TiN-% MoS2 Composite Layer) TiNx=~1 (Where X1=0<X2<…<Xn=1) TiNx---------Graded Interlayer Ti-------------Bond Coat Substrate Deposition and Characterisation of Magnetron Sputtered TiN- MoS2 Composite Coating with a Ti-TiN Graded InterlayerMd. Mahfujur Rahman and Professor Saleem HashmiMaterials Processing Research Centre, Dublin City University, Dublin 9, Ireland Introduction: Sputtering is a plasma induced, molecular levelmomentum transfer of a target material, which is deposited in a thin film to a part. In a magnetron sputtering device a magnetic field is used to enhance plasma ignition, ion energy, plasmadensity, deposition rate and film adhesion. The unbalanced magnetron sputtering has beenused successfully to deposit several new generation coating like multicomponent, multilayer, graded, and composite coating. Design methodology of a composite coating with graded interlayer Project Aims: Deposition and optimisation of graded Ti-TiN and solid lubricant Ti-MoS2 coatings in a reactive gas environment using different targets and graded interlayers. To measure the mechanical and tribological properties of the film and relate these to structure and film composition. The Basic Sputtering Mechanism Closed-field Magnetron Sputtering System A high potential is applied between an anode and cathode ionising (Ar +N2) gas. Plasma Generation Research: In order to provide optimum wear protection for sliding surfaces, it is necessary to use a solid-lubricant coating with low friction, high hardness and good adhesion. In this work, Ti-TiN-(TiN-MoS2) graded composite thin coatings will be deposited on steel substrates by Close Field Unbalanced Magnetron sputtering (CFUBMS) from Ti and MoS2 targets in an attempt to reproduce these properties. Bombardment of Target The +ve ions are accelerated towards the -ve cathodetarget,which is bombarded and causesthe ejection of target atoms. Film Deposition The ejected atoms are deposited on the substrate. In case of reactive deposition, the target flux reacts with reactivegas and forms acompoundfilm on the substrate.

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