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GTK COOLING: STATUS OF THE MICRO-CHANNEL OPTION

GTK COOLING: STATUS OF THE MICRO-CHANNEL OPTION. Paolo Petagna (CERN, PH/DT). On behalf of: Jérôme DAGUIN Raphael DUMPS Alessandro MAPELLI Jérôme NOËL Georg NÜßLE Paolo PETAGNA. SUMMARY. Perspectives for µ-channel cooling in HEP The proposed approach for the NA62 GTK

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GTK COOLING: STATUS OF THE MICRO-CHANNEL OPTION

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  1. GTK COOLING: STATUS OF THE MICRO-CHANNEL OPTION Paolo Petagna (CERN, PH/DT) On behalf of:Jérôme DAGUIN Raphael DUMPS Alessandro MAPELLI Jérôme NOËL Georg NÜßLE Paolo PETAGNA

  2. SUMMARY • Perspectives for µ-channel cooling in HEP • The proposed approach for the NA62 GTK • Status of the R&D • Next steps MAINLY “WORK IN PROGRESS”

  3. WHY µ-CHANNEL COOLING NOW? Example: CMOSAIC project run by EPFL (2 labs), ETHZ (2 labs), University of Madrid, Boston University, IBM Zurich. CERN Presently discussing scientific partnership

  4. FUTURE POTENTIAL APPLICATIONS IN HEP • Very low X0 layers for SHLC pixel detectors; • “Trigger Layers” (first-level trigger) in SHLC Trackers • ILC/CLIC detectors First potential target candidate: NA62 GTK

  5. WHY TARGETING THE NA62 GTK? Extremely aggressive X0 specifications Test case for the integration with electronics Simple “system configuration” (3 independent modules) Allows for concentrating the efforts on local thermal management

  6. “STEP 0”: CREATE A NETWORK OF COLLABORATIONS • EPFL – LMIS4 collaborating now on -fabrication • EPFL – LTCM collaborating now on -fluidics + heat & mass transfer • UCL – ELEC/DICE (SOI & MEMS) discussing possible collaboration • VTT let us know their interest through PH/ESE: need to contact them • IBM Research – Zurich Personal contact with B. Michel + CMOSAIC • SLAC Developing in this moment a very similar line of R&D

  7. PROPOSED PROCEDURAL MATRIX Fluid distribution / recollection Channel optimal size Heat transfer from chips/sensor Temperature uniformity 500 m Pyrex C6F14 vs. CO2 500 m Si 500 m Pyrex 500 m Si 500 m Pyrex 300 m Si 300 m Si Silicon on Silicon bonding 300 m Si 50 m Si (thinned) Pressure issues Handling issues 100 m Si (thinned)

  8. CFD SIMULATIONS AT EPFL – 1: CHANNEL GEOMETRY J. Thome et al. Two-Phase Cooling of Targets and Electronics for Particle Physics Experiments , TWEPP 09, Paris, Sep 21-25 2009 50 x 50 m section

  9. CFD SIMULATIONS AT EPFL – 2: C6F14VS. CO2

  10. µ-CHANNEL PROTOTYPES PRODUCED - 1

  11. Pyrex 500 µm Silicon 500 µm Anodic Bonding µ-CHANNEL PROTOTYPES PRODUCED - 2

  12. IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 1: “CLAMP” SYSTEM • Bulky • Complex integration with electronics • Holds pressure in the manifolds • Allow immediately for thermo-fluid studies Size and mass can be reduced

  13. IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 2: NANOPORT® CONNECTORS • Lighter • Easy integration Preferred choice

  14. IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 3: PRESSURE TESTS OF NANOPORT® CONNECTORS Requires careful design and test of fluid distribution / collection

  15. TEST SET-UP FOR C6F14 COOLING: P&I

  16. TEST SET-UP FOR C6F14 COOLING: PREPARATION

  17. PROPORTIONAL RELIEF VALVE PRESSURE GAUGE VENT TO ATMOSPHERE WATER BATH HEATER CONCENTRIC TUBE HEAT EXCHANGER METERING VALVE OPTIONAL CAPILLARY TUBE MASSFLOW METER CO2 BOTTLE WITH PLUNGER DETECTOR TUBE WITH ELECTRIC HEATING FIRST TEST SET-UP FOR CO2 COOLING: AVAILABLE

  18. THERMAL CONTACT STUDIES PRESENT BENCHMARK: ME7159 by AI Technology (USA) diamond-loaded epoxy glue with thermal conductivity11.4 W/mK • R&D contract in preparation with CNR Italy • (Institute for Composite and Biomedical Materials): • Study of thermal conductive adhesives obtained by doping Araldite 2011 and Silicone VRT • Carbon Nano-Tubes • Diamond Nano-Powder • Metal Nano-Wires

  19. NEXT STEPS • Tackle integration problems (towards electronics and towards outside) • Start C6F14 studies – room temperature • Continue C6F14 studies – low temperature • Proceed with Silicon on Silicon bonding technique • Start CO2 studies • Move towards thinned assembly

  20. LONG TERM: A POSSIBLE FUTURE EVOLUTION? ? But a rational approach is to move step by step towards intermediate useful objectives…

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