1 / 3


First Year of IC Production. 1999. 2001. 2003. 2005. 2007. 2009. 2011. 2013. 2015. Research Required. Development Underway. Qualification/Pre-Production.

Télécharger la présentation


An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.


Presentation Transcript

  1. First Year of IC Production 1999 2001 2003 2005 2007 2009 2011 2013 2015 Research Required Development Underway Qualification/Pre-Production This legend indicates the time during which research, development, and qualification/pre-production should be taking place for the solution. Polished Wafer Conventional Silicon Ultra-Low Defect Material H2 Anneal Materials Selection (No Narrowing of Options Expected) Epitaxial Wafer P / P - P / P + P / P++ SOI Wafer Bonded H2 Split Porous Silicon Oxygen Implantation (SIMOX) Implant Dose 200 nm 200 CoO Wafer Diameter 300 mm 300 mm 450mm 450 mm 450 mm 675 mm Model-Based Parameter Specifications Physical-Based Yield Models Parameter Distributions Selection of Material Kill Factors • Statistical Specifications • Model-Based • Empirical-Based Material Acceptance Criteria Based on Long-Term Supplier Distributions Model-Based Empirical-Based

More Related